LP5816

SNVSCQ1 – MARCH 2025

LP5816 4-Channel I2C Interface RGBW LED Driver

1 Features 3 Description
• Operating voltage range The LP5816 is a 4-channel RGBW LED driver. The
– VCC range: 2.5V to 5.5V device has ultra-low operation current with 0.1μA
– Logic pins compatible with 1.8V, 3.3V, and 5V (typical) in shutdown mode, 0.1mA (typical) when
– Output voltage up to 5.5V enable device and 0.2mA (typical) when illuminate
• 4 constant current sinks with high precision LEDs.
– 0.1mA to 51mA per channel Both analog dimming and PWM dimming methods are
– Device-to-device error: ±8% (max.) adopted to achieve powerful dimming performance.
– Channel-to-channel error: ±3% (max.) The output current of each LED can be adjusted
– Ultra-low headroom voltage: 135mV (max.) at with 256 steps from 0.1mA to 25.5mA or 0.2mA to
25.5mA; 275mV (max.) at 51mA 51mA. The 8-bits PWM generator enables smooth
• Ultra-low power consumption and audible-noise-free dimming control for LED
– Shutdown: ISD = 0.1μA (typ.) brightness.
– Standby: ISTB = 22μA (typ.)
– Active: Package Information
PART NUMBER PACKAGE PACKAGE SIZE (NOM)
• INOR = 0.15mA (typ.) when disable output
channel LP5816DRL SOT583 (8) 1.6mm × 2.1mm
• INOR = 0.23mA (typ.) when LED current = DSBGA (8)
25.5mA LP5816YCH (1)
1.36mm × 0.8mm
• Analog dimming (current gain control)
– Global 1-bit Maximum Current (MC): 25.5mA or (1) Preview preview.
51mA VIO VLED
Red LED

Green LED

– Individual 8-bits Dot Current (DC) setting LED0

Blue LED
2.5 V - 5.5 V
• PWM dimming up to audible-noise-free 23kHz
4.7kΩ

4.7kΩ

VCC OUT0 White LED

1 uF

– Individual 8-bits PWM dimming resolution SCL OUT1

LED1

– Linear or exponential dimming curves MCU

SDA OUT2
LED2

• 400kHz (max.) I2C interface LED3

• ESD: 4kV HBM, 1.5kV CDM GND OUT3

• Package
– 1.6mm*2.1mm SOT583-8 with 0.5mm pitch LP5816 Simplified Schematic
– 1.36mm*0.8mm DSBGA-8 with 0.35mm pitch
• –40°C to 125°C operating temperature range
2 Applications
LED animation and indication for:
• Personal Electronics
– Virtual Reality (VR) Headset
– Gaming Controller and Peripherals
– Electronic and Robotic Toys
– Smart Speaker
– Wireless Speaker
– Solid State Drive (SSD)
– Electronic Smart Lock
– Headsets/Headphones and Earbuds
– GPS Personal Navigation Device
• WLAN/Wi-Fi Access Point
• Video Doorbell
• Video Conference System

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1 7.4 Device Functional Modes..........................................15
2 Applications..................................................................... 1 7.5 Programming............................................................ 17
3 Description.......................................................................1 7.6 Register Maps...........................................................19
4 Device Comparison......................................................... 3 8 Application and Implementation.................................. 27
5 Pin Configuration and Functions...................................4 8.1 Application Information............................................. 27
6 Specifications.................................................................. 5 8.2 Typical Application.................................................... 27
6.1 Absolute Maximum Ratings........................................ 5 8.3 Power Supply Recommendations.............................32
6.2 ESD Ratings............................................................... 5 8.4 Layout....................................................................... 32
6.3 Recommended Operating Conditions.........................5 9 Device and Documentation Support............................33
6.4 Thermal Information....................................................5 9.1 Documentation Support............................................ 33
6.5 Electrical Characteristics.............................................6 9.2 Receiving Notification of Documentation Updates....33
6.6 Timing Requirements.................................................. 7 9.3 Support Resources................................................... 33
6.7 Timing Diagrams......................................................... 8 9.4 Trademarks............................................................... 33
6.8 Typical Characteristics................................................ 8 9.5 Electrostatic Discharge Caution................................33
7 Detailed Description...................................................... 11 9.6 Glossary....................................................................33
7.1 Overview................................................................... 11 10 Revision History.......................................................... 33
7.2 Functional Block Diagram......................................... 11 11 Mechanical, Packaging, and Orderable
7.3 Feature Description...................................................12 Information.................................................................... 34

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4 Device Comparison
PART LED AUTO INSTANT I2C SOFTWARE
PACKAGE (1) MATERIAL
NUMBER NUMBER ANIMATIO BLINKING ADDRESS COMPATIBLE
SOT583-8 LP5814DRLR
LP5814 4 No 0x2C
DSBGA-8 LP5814YCHR
Yes
SOT583-8 LP5815DRLR
LP5815 3 Yes 0x2D
DSBGA-8 LP5815YCHR
Yes
SOT583-8 LP5816DRLR
LP5816 4 0x2C
DSBGA-8 LP5816YCHR
No No
SOT583-8 LP5817DRLR
LP5817 3 0x2D
DSBGA-8 LP5817YCHR

(1) For the most up-to-date packaging information refer to the Mechanical, Packaging, and Orderable Information.

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5 Pin Configuration and Functions

SOT583
Top View

SCL 1 8 OUT0

SDA 2 7 OUT1

GND 3 6 OUT2

VCC 4 5 OUT3

Figure 5-1. LP5816 DRL Package 8-Pin SOT583 Top View

DSBGA
Top View

A SCL OUT0

Power

B SDA OUT1

LED
Driver
C GND OUT2

Digital

D VCC OUT3

1 2

Figure 5-2. LP5816 YCH Package 8-Pin DSBGA Top View

Table 5-1. Pin Functions

PIN
TYPE(1) DESCRIPTION
NAME DRL YCH
SCL 1 A1 I I2C serial interface clock input.

SDA 2 B1 I/O I2C serial interface data input/output.

GND 3 C1 P Ground.

Power supply of the device. A 1 μF capacitor is recommended to be connected between this

VCC 4 D1 P
pin with GND and be placed as close to the device as possible.
OUT3 5 D2 O Constant current sink output 3.
OUT2 6 C2 O Constant current sink output 2.
OUT1 7 B2 O Constant current sink output 1.
OUT0 8 A2 O Constant current sink output 0.

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6 Specifications
6.1 Absolute Maximum Ratings
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
Voltage range
VCC, SCL, SDA, OUT0, OUT1, OUT2, OUT3 –0.3 6 V
at terminals
TJ Junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C

(1) Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply
functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.
If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully
functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

6.2 ESD Ratings

VALUE UNIT
Human body model (HBM), per ANSI/ESDA/
±4000
JEDEC JS-001, all pins(1)
V(ESD) Electrostatic discharge V
Charged device model (CDM), per ANSI/ESDA/
±1500
JEDEC JS-002, all pins(2)

(1) JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)
MIN NOM MAX UNIT
VCC Input voltage range 2.5 5.5 V
CIN Effective input capacitance range 1 4.7 μF
OUT0, OUT1, OUT2,
Voltage on OUT0, OUT1, OUT2, OUT3 pins 0 5.5 V
OUT3
SCL, SDA Voltage on SCL, SDA pins 0 5.5 V
TA Ambient temperature –40 85 °C
TJ Operating junction temperature –40 125 °C

6.4 Thermal Information

LP5816
THERMAL METRIC(1) DRL (SOT583) UNIT
8 PINS
RθJA Junction-to-ambient thermal resistance 118.9 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 47.1 °C/W
RθJB Junction-to-board thermal resistance 27.5 °C/W
ΨJT Junction-to-top characterization parameter 1.4 °C/W
ΨJB Junction-to-board characterization parameter 27.2 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance n/a °C/W

(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.

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6.5 Electrical Characteristics

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ),
VCC = 3.6V, CIN = 1μF.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Power Supply
VCC Input voltage range 2.5 5.5 V
VCC rising 2.2 2.3 2.4 V
VCC_UVLO Under-voltage lockout threshold
VCC falling 2 2.1 2.2 V
ISD Shutdown current into VCC pin VCC = 3.6V 0.1 0.3 μA
ISTB Standby current into VCC pin VCC = 3.6V, CHIP_EN = 0 (bit) 22 26 μA
VCC = 3.6V, CHIP_EN = 1 (bit), OUT0_EN =
INOR Normal operation current into VCC pin 0.15 0.17 mA
OUT1_EN = OUT2_EN = OUT3_EN = 0 (bit)
VCC = 3.6V, CHIP_EN = 1 (bit), OUT0_EN =
OUT1_EN = OUT2_EN = OUT3_EN = 1 (bit), IOUT0
INOR Normal operation current into VCC pin = IOUT1 = IOUT2 = IOUT3 = 25.5mA (MAX_CURRENT 0.23 0.29 mA
= 0 (bit), OUTx_DC = FFh, OUTx_MANUAL_PWM
= FFh)
LED Driver Output
VCC = 3.6V, VLED = 5V, MAX_CURRENT = 0 (bit),
0.1 25.5 mA
OUTx_MANUAL_PWM = FFh (100% ON)
ICS Constant current sink output range
VCC = 3.6V, VLED = 5V, MAX_CURRENT = 1 (bit),
0.2 51 mA
OUTx_MANUAL_PWM = FFh (100% ON)
VCC = 3.6V, OUTx = 1V, OUTx_MANUAL_PWM = 0
ICS_LKG Constant current sink leakage current 0.1 1 μA
(0%)
All LEDs turn ON. Current set to 25.5mA
(MAX_CURRENT = 0 (bit), OUTx_DC = FFh, –8 8 %
Device to device current error, OUTx_MANUAL_PWM = FFh)
IERR_D2D
IERR_D2D = (IAVE-ISET)/ISET×100% All LEDs turn ON. Current set to 51mA
(MAX_CURRENT = 1 (bit), OUTx_DC = FFh, –8 8 %
OUTx_MANUAL_PWM = FFh)
All LEDs turn ON. Current set to 25.5mA
(MAX_CURRENT = 0 (bit), OUTx_DC = FFh, –3 3 %
Channel to Channel current error OUTx_MANUAL_PWM = FFh)
IERR_C2C
IERR_C2C = (IOUTX-IAVE)/IAVE×100% All LEDs turn ON. Current set to 51mA
(MAX_CURRENT = 1 (bit), OUTx_DC = FFh, –2 2 %
OUTx_MANUAL_PWM = FFh)
All LEDs turn ON. Current set to 25.5mA
(MAX_CURRENT = 0 (bit), OUTx_DC = FFh, 0.135 V
OUTx_MANUAL_PWM = FFh), VCC = 3.6V
All LEDs turn ON. Current set to 51mA
(MAX_CURRENT = 1 (bit), OUTx_DC = FFh, 0.275 V
OUTx_MANUAL_PWM = FFh), VCC = 3.6V
VHR LED driver output headroom voltage
All LEDs turn ON. Current set to 25.5mA
(MAX_CURRENT = 0 (bit), OUTx_DC = FFh, 0.15 V
OUTx_MANUAL_PWM = FFh), VCC = 2.5V
All LEDs turn ON. Current set to 51mA
(MAX_CURRENT = 1 (bit), OUTx_DC = FFh, 0.3 V
OUTx_MANUAL_PWM = FFh), , VCC = 2.5V
fLED_PWM PWM dimming frequency 23 kHz
fOSC Internal oscillator frequency 6 MHz

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Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ),
VCC = 3.6V, CIN = 1μF.
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
Logic Interface
VIH_LOGIC High level input voltage of SDA, SCL 1.4 V
VIL_LOGIC Low level input voltage of SDA, SCL 0.4 V
VOL_LOGIC Low level output voltage of SDA 0.4 V
Protection
Thermal shutdown threshold for LED
TSD TJ rising 150 °C
driver part
TSD_HYS Thermal shutdown hysteresis TJ falling below TSD 15 °C

6.6 Timing Requirements

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ), VCC
= 3.6V, CIN = 1μF.
I2C Timing Requirements MIN NOM MAX UNIT
Standard-mode
fSCL SCL clock frequency 0 100 kHz
Hold time (repeated) START condition. After this period, the first clock
1 4 µs
pulse is generated.
2 LOW period of the SCL clock 4.7 µs
3 HIGH period of the SCL clock 4 µs
4 Set-up time for a repeated START condition 4.7 µs
5 Data hold time 0 µs
6 Data set-up time 250 ns
7 Rise time of both SDA and SCL signals 1000 ns
8 Fall time of both SDA and SCL signals 300 ns
9 Set-up time for STOP condition 4 µs
10 Bus free time between a STOP and START condition 4.7 µs
Cb Capacitive load for each bus line 400 pF
Fast-mode
fSCL SCL clock frequency 0 400 kHz
Hold time (repeated) START condition. After this period, the first clock
1 0.6 µs
pulse is generated.
2 LOW period of the SCL clock 1.3 µs
3 HIGH period of the SCL clock 0.6 µs
4 Set-up time for a repeated START condition 0.6 µs
5 Data hold time 0 µs
6 Data set-up time 100 ns
7 Rise time of both SDA and SCL signals 300 ns
8 Fall time of both SDA and SCL signals 300 ns
9 Set-up time for STOP condition 0.6 µs
10 Bus free time between a STOP and START condition 1.3 µs
Cb Capacitive load for each bus line 400 pF

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6.7 Timing Diagrams

SDA

10
8 7 6 7
2 8 1

SCL

1 3
5 4 9

Figure 6-1. I2C Timing Parameters

6.8 Typical Characteristics

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ), VCC
= 3.6V, CIN = 1μF

0.03 0.055
DC = 10 DC = 10
0.05
DC = 50 DC = 50
0.025 DC = 100 0.045 DC = 100
DC = 150 DC = 150
DC = 200 0.04 DC = 200
Output Current (A)

Output Current (A)

0.02 DC = 255 DC = 255

0.035
0.03
0.015
0.025
0.02
0.01
0.015

0.005 0.01
0.005
0 0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4
Current Sink Voltage (V) Current Sink Voltage (V)

Figure 6-2. Current Sinks Voltage vs Current (MC = 0, VCC = Figure 6-3. Current Sinks Voltage vs Current (MC = 1, VCC =
2.5V) 2.5V)
0.03 0.055
DC = 10 DC = 10
0.05
DC = 50 DC = 50
0.025 DC = 100 0.045 DC = 100
DC = 150 DC = 150
DC = 200 0.04 DC = 200
Output Current (A)

Output Current (A)

0.02 DC = 255 DC = 255

0.035
0.03
0.015
0.025
0.02
0.01
0.015

0.005 0.01
0.005
0 0
0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4 0.05 0.1 0.15 0.2 0.25 0.3 0.35 0.4
Current Sink Voltage (V) Current Sink Voltage (V)

Figure 6-4. Current Sinks Voltage vs Current (MC = 0, VCC = Figure 6-5. Current Sinks Voltage vs Current (MC = 1, VCC =
3.6V) 3.6V)

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6.8 Typical Characteristics (continued)

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ), VCC
= 3.6V, CIN = 1μF

280 55
MC = 0 / VCC = 2.5V
260 50
MC = 1 / VCC = 2.5V
45 MC = 0 / VCC = 3.6V
240 MC = 1 / VCC = 3.6V
40

Output Current (A)

220
35
VSAT (mV)

200 Iout = 25.5mA / Vcc = 2.5V 30

Iout = 25.5mA / Vcc = 3.6V
180 Iout = 51mA / Vcc = 2.5V 25
Iout = 51mA / Vcc = 3.6V 20
160
15
140
10
120
5
100 0
-60 -40 -20 0 20 40 60 80 100 120 140 0 30 60 90 120 150 180 210 240 270
Ambient Te mperature (C) DC
Figure 6-6. VSAT vs Temperature Figure 6-7. DC vs Current
0.0275 0.055
0.025 0.05
0.0225 0.045
0.02 0.04
Output Current (A)

Output Current (A)

0.0175 0.035
0.015 0.03
0.0125 0.025
0.01 DC = 10 0.02 DC = 10
0.0075 DC = 50 DC = 50
DC = 100 0.015
DC = 100
0.005 DC = 150 0.01 DC = 150
DC = 200 DC = 200
0.0025 0.005
DC = 255 DC = 255
0 0
2.4 2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7 2.4 2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5.1 5.4 5.7
VCC (V) VCC (V)
Figure 6-8. VCC vs Current (MC = 0) Figure 6-9. VCC vs Current (MC = 1)
0.8 0.4
0.3
0.6
0.2
0.4 2mA_MIN 30mA_MIN
0.1
1mA_MIN 15mA_MIN 2mA_MAX 30mA_MAX
0.2 1mA_MAX 15mA_MAX 0 10mA_MIN 40mA_MIN
IERR_C2C (%)

IERR_C2C (%)

5mA_MIN 20mA_MIN 10mA_MAX 40mA_MAX

-0.1
0 5mA_MAX 20mA_MAX 20mA_MIN 51mA_MIN
10mA_MIN 25.5mA_MIN -0.2 20mA_MAX 51mA_MAX
-0.2 10mA_MAX 25.5mA_MAX -0.3

-0.4 -0.4
-0.5
-0.6
-0.6
-0.8 -0.7
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Ambient Te mperature (C) Ambient Te mperature (C)
Figure 6-10. Channel-to-Channel Current Accuracy vs Figure 6-11. Channel-to-Channel Current Accuracy vs
Temperature (MC = 0, VCC = 2.5V) Temperature (MC = 1, VCC = 2.5V)

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6.8 Typical Characteristics (continued)

Unless specified otherwise, typical characteristics apply over the full ambient temperature range (–40°C < TA < +85°C ), VCC
= 3.6V, CIN = 1μF

0.8 0.4
0.3
0.6
0.2
0.4 2mA_MIN 30mA_MIN
1mA_MIN 15mA_MIN 0.1
2mA_MAX 30mA_MAX
0.2 1mA_MAX 15mA_MAX 0 10mA_MIN 40mA_MIN
IERR_C2C (%)

IERR_C2C (%)
5mA_MIN 20mA_MIN 10mA_MAX 40mA_MAX
5mA_MAX 20mA_MAX -0.1
0 20mA_MIN 51mA_MIN
10mA_MIN 25.5mA_MIN -0.2 20mA_MAX 51mA_MAX
10mA_MAX 25.5mA_MAX
-0.2 -0.3

-0.4 -0.4
-0.5
-0.6
-0.6
-0.8 -0.7
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Ambient Te mperature (C) Ambient Te mperature (C)
Figure 6-12. Channel-to-Channel Current Accuracy vs Figure 6-13. Channel-to-Channel Current Accuracy vs
Temperature (MC = 0, VCC = 3.6V) Temperature (MC = 1, VCC = 3.6V)
0.4 0.6
0.2 0.4
0 0.2
Iout = 1mA Iout = 15mA Iout = 2mA Iout = 30mA
-0.2 0
Iout = 5mA Iout = 20mA Iout = 10mA Iout = 40mA
Iout = 10mA Iout = 25.5mA -0.2
-0.4 Iout = 20mA Iout = 51mA
IERR_D2D (%)

IERR_D2D (%)
-0.4
-0.6
-0.6
-0.8
-0.8
-1
-1
-1.2 -1.2
-1.4 -1.4
-1.6 -1.6
-1.8 -1.8
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Ambient Te mperature (C) Ambient Te mperature (C)
Figure 6-14. Device-to-Device Current Accuracy vs Temperature Figure 6-15. Device-to-Device Current Accuracy vs Temperature
(MC = 0, VCC = 2.5V) (MC = 1, VCC = 2.5V)
0.4 0.6
0.2 0.4
0 0.2
Iout = 2mA Iout = 30mA
-0.2 Iout = 1mA Iout = 15mA 0
Iout = 10mA Iout = 40mA
Iout = 5mA Iout = 20mA -0.2
-0.4 Iout = 20mA Iout = 51mA
Iout = 10mA Iout = 25.5mA
IERR_D2D (%)

IERR_D2D (%)

-0.4
-0.6
-0.6
-0.8
-0.8
-1
-1
-1.2 -1.2
-1.4 -1.4
-1.6 -1.6
-1.8 -1.8
-60 -40 -20 0 20 40 60 80 100 120 140 -60 -40 -20 0 20 40 60 80 100 120 140
Ambient Te mperature (°C) Ambient Te mperature (C)
Figure 6-16. Device-to-Device Current Accuracy vs Temperature Figure 6-17. Device-to-Device Current Accuracy vs Temperature
(MC = 0, VCC = 3.6V) (MC = 1, VCC = 3.6V)

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7 Detailed Description
7.1 Overview
The LP5816 is a 4 channel RGBW LED driver. The maximum output current of each channel is up to 51mA and
can be adjusted by 256 steps from 0 to the full current. Besides the annalog dimming, every channel supports
8-bit PWM dimming.
The LP5816 features ultra-low shutdown current that is about 0.1uA. Two approaches are provided to control the
LP5816 enter shutdown mode, sending shutdown command or constantly pulling down SCL, which improves the
flexibility in system design for different application requirements.
7.2 Functional Block Diagram

Thermal
VCC UVLO
Oscillator Shutdown
(TSD)

Bandgap
Manual Control
OUT0
Internal LDO

SCL Digital Core OUT1

Digital Interface
SDA

8-bits PWM
Control OUT2

1-bit
Individual 8-bits OUT3
Maximum Current Sink Driver
Dot Current (DC)
Current (MC)

GND

Figure 7-1. LP5816 Function Block

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7.3 Feature Description

7.3.1 Analog Dimming
There are two methods to control the current gain of each output channel.
• Global 1-bit Maximum Current (MC) control for all channels without external resistor
• Individual 8-bit Dot Current (DC) control for each channel
The maximum output current IOUT_max of each channel can be programmed by the 1 bit MAX_CURRENT. When
the device is powered on, the default value of MC is 0h, which is 25.5mA.
Table 7-1. Maximum Current (MC) Bit Setting
1-bit Maximum Current (MC)
IOUT_MAX (mA)
Binary Decimal
0 (default) 0 (default) 25.5 (default)
1 1 51

The LP5816 can individually adjust the analog output current of each channel by using Dot Current (DC)
function. The brightness deviation among the LED bins can be miminized to achieve uniform display
performance through the DC setting. The DC is programmed in an 8-bit depth, so the analog current can
be adjusted with 256 steps from 0 to 100% of IOUT_MAX.. The default value of all DC is 0h, which is not current
output.
Table 7-2. Dot Current (DC) Bits Setting
8-bits Dot Current (DC) Register
Ratio of IOUT_MAX
Binary Decimal
0000 0000 (default) 0 (default) 0% (default)
0000 0001 1 0.39%
0000 0010 2 0.78%
--- --- ---
1000 0000 128 50.2%
--- --- ---
1111 1101 253 99.2%
1111 1110 254 99.6%
1111 1111 255 100%

By configuring the MC and DC, the analog output current of each channel can be calculated as Equation 1:

DC
IOUT mA = IOUT_MAX × 255 (1)

The average output current of each channel can be caculated asEquation 2:

DC
IAVE mA = IOUT_MAX × 255 × DPWM (2)

• DPWM is the PWM duty.

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7.3.2 PWM Dimming

The LP5816 supports 8-bit PWM dimming with 23kHz frequency. The device integrates an internal 6MHz
oscillator to generate the PWM clock.
The PWM output value of each channel is controlled by the OUT0_MANUAL_PWM, OUT1_MANUAL_PWM,
OUT2_MANUAL_PWM and OUT3_MANUAL_PWM separately.
If OUT0_FADE_EN, OUT1_FADE_EN, OUT2_FADE_EN and OUT3_FADE_EN bit in DEV_CONFIG2 register is
set as 0, the output PWM value updates immeditaly to the latest received PWM set value.
If OUT0_FADE_EN, OUT1_FADE_EN, OUT2_FADE_EN and OUT3_FADE_EN bit in DEV_CONFIG2 register
is set as 1, the fade in or out function is enabled, the output PWM ramps up or down smoothly to the latest
received PWM value within the time period defined by OUT_FADE_TIME automatically.
The LP5816 allows users to configure the dimming scale as exponential curve or linear curve for each
channel separately through the OUT0_EXP_EN, OUT1_EXP_EN, OUT2_EXP_EN and OUT3_EXP_EN in
DEV_CONFIG3 register. A human-eye-friendly visual performance can be achieved by using the internal
exponential scale. The linear scale has great linearity between PWM duty cycle and PWM setting value, which
provides flexible approach for external controlled gamma correction algorithm. The 8-bit linear and exponential
curves are shown as Figure 7-2.
100 %
PWM Duty

80 %

60 %
Linear
Scale
40 %

Exponenti
20 % al Scale

0%
0 32 64 96 128 160 192 224 255
PWM value (8-bits)

Figure 7-2. Linear and Exponential PWM Dimming Curves

7.3.3 Sloper
In manual control mode, output fade in or out is supported when LED0_FADE_EN, LED1_FADE_EN,
LED2_FADE_EN and LED3_FADE_EN bit in DEV_CONFIG2 register is set as 1. Sloper is the basic element
to achieve autonomous fade in and fade out animations. The output can achieve 256 steps fade in or fade out
effects from 'PWM_Start' to 'PWM_End' within a specified time period T as shown in Figure 7-3. Exponential
dimming curve can also be supported in the sloper.
PWM_End

PWM_Start T

Figure 7-3. Sloper Curve Demonstration

The programable time T is selectable from 0 to around 8s with 16 levels shown in Table 7-3.
Table 7-3. Programable Time Options
Register Value 0h 1h 2h 3h 4h 5h 6h 7h 8h 9h Ah Bh Ch Dh Eh Fh
Time (Typ.) 0s 0.05s 0.1s 0.15s 0.2s 0.25s 0.3s 0.35s 0.4s 0.45s 0.5s 1s 2s 4s 6s 8s

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7.3.4 Protections
7.3.4.1 UVLO
The LP5816 has an internal comparator that monitors the voltage at VCC. When VCC is below VCC_UVLO, the
device resets and keeps in Power On Reset (POR) state. When VCC ramps above VCC_UVLO, the device enters
INITIALIZATION mode and the POR flag is set. The POR flag needs manual clear by setting POR_CLR bit when
CHIP_EN = 1.
7.3.4.2 Thermal Shutdown
The LP5816 implements a thermal shutdown mechanism to protect the device from damage due to overheating.
When the junction temperature of the device rises to 155oC (typical), the device turns off all output channels.
The TSD flag is set to indicate thermal shutdown is triggered. The LP5816 releases thermal shutdown when the
junction temperature reduces to 140oC (typical). The TSD flag needs manual clear by setting TSD_CLR bit when
CHIP_EN = 1.

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7.4 Device Functional Modes

The Figure 7-4 shows the function modes of the LED driver.

VCC > VCC_UVLO

Apply Exit Shutdown Method

INITIALIZATION

STANDBY

CHIP_EN = 1 CHIP_EN = 0

Apply Enter Shutdown Method

SHUTDOWN NORMAL

TJ > TSD TJ < TSD – TSD_HYS

THERMAL
SHUTDOWN

Figure 7-4. Functional Modes

7.4.1 Initialization Mode

The LP5816 enters INITIALIZATION mode when VCC voltage ramps above the VCC_UVLO or exits from
SHUTDOWN mode. The LP5816 reset all registers to default value in INITIALIZATION mode. The POR flag
is set to 1 after exiting from INITIALIZATION mode to indicate the reset history.
7.4.2 Standby and Normal Mode
The LP5816 enters STANDBY mode when CHIP_EN = 0 or NORMAL mode when CHIP_EN = 1 after exiting
from INITIALIZATION mode or THERMAL SHUTDOWN mode.
While staying in STANDBY or NORMAL mode,
• when Enter Shutdown Method is applied, the LP5816 enters SHUTDOWN mode. The Enter Shutdown
Method is described in Shutdown Mode.
• when the junction temperature of the LP5816 rises above the thermal shutdown threshold TSD, the LP5816
turns off all output channels and enters THERMAL SHUTDOWN mode.
7.4.3 Shutdown Mode
The LP5816 supports shutdown mode to minimize the power consumption from VCC. The quscient current from
VCC decreases to 0.1 uA (typical) in SHUTDOWN mode. The LP5816 provides two pairs of methods to control
the device enter and exit SHUTDOWN mode.
• Figure 7-5 shows the method 1
– Enter shutdown, send Shutdown_command by writing 0x33 to register 0xD though I2C communication.
– Exit shutdown, toggle SDA 8 times to generate 8 falling edges while keeping SCL as high. The
supported maximum toggle frequency for SDA is 100kHz.

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• Figure 7-6 shows the method 2

– Enter shutdown, pull down SCL for 100ms while keeping SDA as high.
– Exit shutdown, pull up SCL to generate one rising edge regardless of SDA state.

Enter Shutdown Mode

SCL

Enter
SDA Write 0x33 to SHUTDOWN_CMD register

H
SCL

Exit
SDA 1 2 3 4 5 6 7 8

Exit Shutdown Mode

Figure 7-5. Enter and Exit Shutdown Mode Method Pair 1

Enter Shutdown Mode

100 ms
SCL

Enter H
SDA

Exit Shutdown Mode

SCL
Exit

SDA H or L

Figure 7-6. Enter and Exit Shutdown Mode Method Pair 2

7.4.4 Thermal Shutdown Mode

All output channels are turned off while the LP5816 staying in THERMAL SHUTDOWN mode. The I2C interface
is still active and the LP5816 enters SHUTDOWN mode when Enter Shutdown Method is applied.
When the junction temperature of LP5816 falles blow the thermal shutdown threshold, the LP5816 enters
STANDBY mode when CHIP_EN = 0 or NORMAL mode when CHIP_EN = 1 after exiting from THERMAL
SHUTDOWN mode. The TSD flag needs manual clear through setting TSD_CLR bit when CHIP_EN = 1.

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7.5 Programming
The LP5816 is compatible with I2C standard specification. The device supports standard mode (100kHz
maximum) and fast mode (400kHz maximum). The device chip address is 0x2C.
7.5.1 I2C Data Tansactions
The data on SDA line must be stable during the HIGH period of the clock signal (SCL). In other words, state of
the data line can only be changed when clock signal is LOW. START and STOP conditions classify the beginning
and the end of the data transfer session. A START condition is defined as the SDA signal transitioning from and
the end of the data transfer session. A START condition is defined as the SDA signal transitioning from HIGH
to LOW while SCL line is HIGH. A STOP condition is defined as the SDA transitioning from LOW to HIGH while
SCL is HIGH. The bus leader always generates START and STOP conditions. The bus is considered to be busy
after a START condition and free after a STOP condition. During data transmission, the bus leader can generate
repeated START conditions. First START and repeated START conditions are functionally equivalent.
Each byte of data has to be followed by an acknowledge bit. The acknowledge related clock pulse is generated
by the leader. The leader releases the SDA line (HIGH) during the acknowledge clock pulse. The device pulls
down the SDA line during the 9th clock pulse, signifying an acknowledge. The device generates an acknowledge
after each byte has been received.
There is one exception to the acknowledge after every byte rule. When the leader is the receiver, the receiver
must indicate to the transmitter an end of data by not acknowledging (negative acknowledge) the last byte
clocked out of the follower. This negative acknowledge still includes the acknowledge clock pulse (generated by
the leader), but the SDA line is not pulled down.
7.5.2 I2C Data Format
The address and data bits are transmitted MSB first with 8-bits length format in each cycle. Each transmission is
started with Address Byte 1, which are divided into 7 bits of the chip address and 1 read/write bit. The 8 bits of
register address are put in Address Byte 2. The device supports both independent mode and broadcast mode.
The auto-increment feature allows writing / reading several consecutive registers within one transmission. If not
consecutive, a new transmission must be started.
Table 7-4. I2C Data Format
Address Byte1 Chip Address R/W
Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
Independent 0 1 0 1 1 0 0
R: 1 W: 0
Broadcast 0 1 1 0 1 0 0
Register Address
Address Byte2 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
7th bit 6th bit 5th bit 4th bit 3rd bit 2nd bit 1st bit 0 bit

SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 1 8 9 1 8 9

Address Byte 1 Address Byte 2 Data Byte 1 Data Byte 2

SDA CA7 CA6 CA5 CA4 CA3 CA2 CA1 W ACK RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 ACK D7 D0 ACK D7 D0 ACK

Start Stop

Figure 7-7. I2C Write Timming

SCL 1 2 3 4 5 6 7 8 9 1 2 3 4 5 6 7 8 9 10 1 2 3 4 5 6 7 8 9 1 8 9 1 8 9

Address Byte 1 Address Byte 2 Address Byte 1 Data Byte 1 Data Byte 2
SDA CA7 CA6 CA5 CA4 CA3 CA2 CA1 W ACK RA7 RA6 RA5 RA4 RA3 RA2 RA1 RA0 ACK CA7 CA6 CA5 CA4 CA3 CA2 CA1 R ACK D7 D0 ACK D7 D0 NACK

Start Restart Stop

Figure 7-8. I2C Read Timming

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7.5.3 Command Description

The LP5816 has 3 dedicated software commands, Shutdown_command, Reset_command and
Update_command.
• Send Shutdown_command is one of the 2 methods to make the device enter SHUTDOWN mode as
described in Shutdown Mode .
• Send Reset_command to reset all registers to default value.
• Send Update_command to make the modified value in the device configuration registers as shown in Table
7-5 to take effect. The LP5816 responds to the Update_command only when CHIP_EN = 1.

Table 7-5. Update_command Control Registers

Register Address Register Acronym

0x01 to 0x04 DEV_CONGIFx, x = 0, 1, 2, 3

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7.6 Register Maps

Table 7-6. Register Maps
Address Acronym Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 Bit 0
0h CHIP_EN RESERVED CHIP_EN
1h DEV_CONFIG0 RESERVED MAX_CU
RRENT
2h DEV_CONFIG1 RESERVED OUT3_EN OUT2_EN OUT1_EN OUT0_EN
3h DEV_CONFIG2 LED_FADE_TIME OUT3_FA OUT2_FA OUT1_FA OUT0_FA
DE_EN DE_EN DE_EN DE_EN
4h DEV_CONFIG3 OUT3_EX OUT2_EX OUT1_EX OUT0_EX RESERVED
P_EN P_EN P_EN P_EN
Dh SHUTDOWN_CMD SHUTDOWN
Eh RESET_CMD RESET
Fh UPDATE_CMD UPDATE
13h FLAG_CLR RESERVED TSD_CLR POR_CL
R
14h OUT0_DC OUT0_DC
15h OUT1_DC OUT1_DC
16h OUT2_DC OUT2_DC
17h OUT3_DC OUT3_DC
18h OUT0_MANUAL_PWM OUT0_MANUAL_PWM
19h OUT1_MANUAL_PWM OUT1_MANUAL_PWM
1Ah OUT2_MANUAL_PWM OUT2_MANUAL_PWM
1Bh OUT3_MANUAL_PWM OUT3_MANUAL_PWM
40h FLAG RESERVED TSD POR

Complex bit access types are encoded to fit into small table cells. Table 7-7 shows the codes that are used for
access types in this section.
Table 7-7. Register Maps Access Type Codes
Access Type Code Description
Read Type
R R Read
Write Type
W W Write
W1C W Write
1C 1 to clear
Reset or Default Value
-n Value after reset or the default
value

7.6.1 CHIP_EN (Address = 0h) [Reset = 00h]

CHIP_EN is shown in Figure 7-9 and described in Table 7-8.
Return to the Summary Table.
Figure 7-9. CHIP_EN
7 6 5 4 3 2 1 0
RESERVED CHIP_EN
R-0h R/W-0h

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Figure 7-9. CHIP_EN (continued)

Table 7-8. CHIP_EN Field Descriptions

Bit Field Type Reset Description
7-1 RESERVED R 0h Reserved
0 CHIP_EN R/W 0h Device enable.
0x0 = Disable
0x1 = Enable

7.6.2 DEV_CONFIG0 (Address = 1h) [Reset = 00h]

DEV_CONFIG0 is shown in Figure 7-10 and described in Table 7-9.
Return to the Summary Table.
Figure 7-10. DEV_CONFIG0
7 6 5 4 3 2 1 0
RESERVED MAX_CURREN
T
R-0h R/W-0h

Table 7-9. DEV_CONFIG0 Field Descriptions

Bit Field Type Reset Description
7-1 RESERVED R 0h Reserved
0 MAX_CURRENT R/W 0h Max output current.
0x0 = 25.5mA
0x1 = 51mA

7.6.3 DEV_CONFIG1 (Address = 2h) [Reset = 00h]

DEV_CONFIG1 is shown in Figure 7-11 and described in Table 7-10.
Return to the Summary Table.
Figure 7-11. DEV_CONFIG1
7 6 5 4 3 2 1 0
RESERVED OUT3_EN OUT2_EN OUT1_EN OUT0_EN
R-0h R/W-0h R/W-0h R/W-0h R/W-0h

Table 7-10. DEV_CONFIG1 Field Descriptions

Bit Field Type Reset Description
7-4 RESERVED R 0h Reserved
3 OUT3_EN R/W 0h OUT3 enable.
0x0 = Disable
0x1 = Enable
2 OUT2_EN R/W 0h OUT2 enable.
0x0 = Disable
0x1 = Enable
1 OUT1_EN R/W 0h OUT1 enable.
0x0 = Disable
0x1 = Enable
0 OUT0_EN R/W 0h OUT0 enable.
0x0 = Disable
0x1 = Enable

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7.6.4 DEV_CONFIG2 (Address = 3h) [Reset = 00h]

DEV_CONFIG2 is shown in Figure 7-12 and described in Table 7-11.
Return to the Summary Table.
Figure 7-12. DEV_CONFIG2
7 6 5 4 3 2 1 0
LED_FADE_TIME OUT3_FADE_E OUT2_FADE_E OUT1_FADE_E OUT0_FADE_E
N N N N
R/W-0h R/W-0h R/W-0h R/W-0h R/W-0h

Table 7-11. DEV_CONFIG2 Field Descriptions

Bit Field Type Reset Description
7-4 LED_FADE_TIME R/W 0h OUT fade sloper time.
0x0 = 0s
0x1 = 0.05s
0x2 = 0.10s
0x3 = 0.15s
0x4 = 0.20s
0x5 = 0.25s
0x6 = 0.30s
0x7 = 0.35s
0x8 = 0.40s
0x9 = 0.45s
0xA = 0.50s
0xB = 1.00s
0xC = 2.00s
0xD = 4.00s
0xE = 6.00s
0xF = 8.00s
3 OUT3_FADE_EN R/W 0h OUT3 fade in and out enable.
0x0 = Disable
0x1 = Enable
2 OUT2_FADE_EN R/W 0h OUT2 fade in and out enable.
0x0 = Disable
0x1 = Enable
1 OUT1_FADE_EN R/W 0h OUT1 fade in and out enable.
0x0 = Disable
0x1 = Enable
0 OUT0_FADE_EN R/W 0h OUT0 fade in and out enable.
0x0 = Disable
0x1 = Enable

7.6.5 DEV_CONFIG3 (Address = 4h) [Reset = 00h]

DEV_CONFIG3 is shown in Figure 7-13 and described in Table 7-12.
Return to the Summary Table.
Figure 7-13. DEV_CONFIG3
7 6 5 4 3 2 1 0
OUT3_EXP_EN OUT2_EXP_EN OUT1_EXP_EN OUT0_EXP_EN RESERVED
R/W-0h R/W-0h R/W-0h R/W-0h R-0h

Table 7-12. DEV_CONFIG3 Field Descriptions

Bit Field Type Reset Description
7 OUT3_EXP_EN R/W 0h OUT3 exponential PWM dimming enable.
0x0 = Disable
0x1 = Enable

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Table 7-12. DEV_CONFIG3 Field Descriptions (continued)

Bit Field Type Reset Description
6 OUT2_EXP_EN R/W 0h OUT2 exponential PWM dimming enable.
0x0 = Disable
0x1 = Enable
5 OUT1_EXP_EN R/W 0h OUT1 exponential PWM dimming enable.
0x0 = Disable
0x1 = Enable
4 OUT0_EXP_EN R/W 0h OUT0 exponential PWM dimming enable.
0x0 = Disable
0x1 = Enable
3-0 RESERVED R 0h Reserved

7.6.6 SHUTDOWN_CMD (Address = Dh) [Reset = 00h]

SHUTDOWN_CMD is shown in Figure 7-14 and described in Table 7-13.
Return to the Summary Table.
Figure 7-14. SHUTDOWN_CMD
7 6 5 4 3 2 1 0
SHUTDOWN
W-0h

Table 7-13. SHUTDOWN_CMD Field Descriptions

Bit Field Type Reset Description
7-0 SHUTDOWN W 0h 0x33 = Enter shutdown mode

7.6.7 RESET_CMD (Address = Eh) [Reset = 00h]

RESET_CMD is shown in Figure 7-15 and described in Table 7-14.
Return to the Summary Table.
Figure 7-15. RESET_CMD
7 6 5 4 3 2 1 0
RESET
W-0h

Table 7-14. RESET_CMD Field Descriptions

Bit Field Type Reset Description
7-0 RESET W 0h 0xCC = Reset all the registers to default value

7.6.8 UPDATE_CMD (Address = Fh) [Reset = 00h]

UPDATE_CMD is shown in Figure 7-16 and described in Table 7-15.
Return to the Summary Table.
Figure 7-16. UPDATE_CMD
7 6 5 4 3 2 1 0
UPDATE
W-0h

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Table 7-15. UPDATE_CMD Field Descriptions

Bit Field Type Reset Description
7-0 UPDATE W 0h 0x55 = Update all device configuration registers value

7.6.9 FLAG_CLR (Address = 13h) [Reset = 00h]

FLAG_CLR is shown in Figure 7-17 and described in Table 7-16.
Return to the Summary Table.
Figure 7-17. FLAG_CLR
7 6 5 4 3 2 1 0
RESERVED TSD_CLR POR_CLR
R-0h W1C-0h W1C-0h

Table 7-16. FLAG_CLR Field Descriptions

Bit Field Type Reset Description
7-2 RESERVED R 0h Reserved
1 TSD_CLR W1C 0h Write 1 to clear TSD flag.
0 POR_CLR W1C 0h Write 1 to clear POR flag.

7.6.10 OUT0_DC (Address = 14h) [Reset = 00h]

OUT0_DC is shown in Figure 7-18 and described in Table 7-17.
Return to the Summary Table.
Figure 7-18. OUT0_DC
7 6 5 4 3 2 1 0
OUT0_DC
R/W-0h

Table 7-17. OUT0_DC Field Descriptions

Bit Field Type Reset Description
7-0 OUT0_DC R/W 0h OUT0 DC setting.

7.6.11 OUT1_DC (Address = 15h) [Reset = 00h]

OUT1_DC is shown in Figure 7-19 and described in Table 7-18.
Return to the Summary Table.
Figure 7-19. OUT1_DC
7 6 5 4 3 2 1 0
OUT1_DC
R/W-0h

Table 7-18. OUT1_DC Field Descriptions

Bit Field Type Reset Description
7-0 OUT1_DC R/W 0h OUT1 DC setting.

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7.6.12 OUT2_DC (Address = 16h) [Reset = 00h]

OUT2_DC is shown in Figure 7-20 and described in Table 7-19.
Return to the Summary Table.
Figure 7-20. OUT2_DC
7 6 5 4 3 2 1 0
OUT2_DC
R/W-0h

Table 7-19. OUT2_DC Field Descriptions

Bit Field Type Reset Description
7-0 OUT2_DC R/W 0h OUT2 DC setting.

7.6.13 OUT3_DC (Address = 17h) [Reset = 00h]

OUT3_DC is shown in Figure 7-21 and described in Table 7-20.
Return to the Summary Table.
Figure 7-21. OUT3_DC
7 6 5 4 3 2 1 0
OUT3_DC
R/W-0h

Table 7-20. OUT3_DC Field Descriptions

Bit Field Type Reset Description
7-0 OUT3_DC R/W 0h OUT3 DC setting.

7.6.14 OUT0_MANUAL_PWM (Address = 18h) [Reset = 00h]

OUT0_MANUAL_PWM is shown in Figure 7-22 and described in Table 7-21.
Return to the Summary Table.
Figure 7-22. OUT0_MANUAL_PWM
7 6 5 4 3 2 1 0
OUT0_MANUAL_PWM
R/W-0h

Table 7-21. OUT0_MANUAL_PWM Field Descriptions

Bit Field Type Reset Description
7-0 OUT0_MANUAL_PWM R/W 0h OUT0 manual PWM setting.
0x00 = 0%
...
0x80 = 50%
...
0xFF = 100%

7.6.15 OUT1_MANUAL_PWM (Address = 19h) [Reset = 00h]

OUT1_MANUAL_PWM is shown in Figure 7-23 and described in Table 7-22.
Return to the Summary Table.

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Figure 7-23. OUT1_MANUAL_PWM

7 6 5 4 3 2 1 0
OUT1_MANUAL_PWM
R/W-0h

Table 7-22. OUT1_MANUAL_PWM Field Descriptions

Bit Field Type Reset Description
7-0 OUT1_MANUAL_PWM R/W 0h OUT1 manual PWM setting.
0x00 = 0%
...
0x80 = 50%
...
0xFF = 100%

7.6.16 OUT2_MANUAL_PWM (Address = 1Ah) [Reset = 00h]

OUT2_MANUAL_PWM is shown in Figure 7-24 and described in Table 7-23.
Return to the Summary Table.
Figure 7-24. OUT2_MANUAL_PWM
7 6 5 4 3 2 1 0
OUT2_MANUAL_PWM
R/W-0h

Table 7-23. OUT2_MANUAL_PWM Field Descriptions

Bit Field Type Reset Description
7-0 OUT2_MANUAL_PWM R/W 0h OUT2 manual PWM setting.
0x00 = 0%
...
0x80 = 50%
...
0xFF = 100%

7.6.17 OUT3_MANUAL_PWM (Address = 1Bh) [Reset = 00h]

OUT3_MANUAL_PWM is shown in Figure 7-25 and described in Table 7-24.
Return to the Summary Table.
Figure 7-25. OUT3_MANUAL_PWM
7 6 5 4 3 2 1 0
OUT3_MANUAL_PWM
R/W-0h

Table 7-24. OUT3_MANUAL_PWM Field Descriptions

Bit Field Type Reset Description
7-0 OUT3_MANUAL_PWM R/W 0h OUT3 manual PWM setting.
0x00 = 0%
...
0x80 = 50%
...
0xFF = 100%

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7.6.18 FLAG (Address = 40h) [Reset = 00h]

FLAG is shown in Figure 7-26 and described in Table 7-25.
Return to the Summary Table.
Figure 7-26. FLAG
7 6 5 4 3 2 1 0
RESERVED TSD POR
R-0h R-0h R-0h

Table 7-25. FLAG Field Descriptions

Bit Field Type Reset Description
7-2 RESERVED R 0h Reserved
1 TSD R 0h TSD flag.
0x0 = TSD is not triggered
0x1 = TSD is triggered
0 POR R 0h POR flag.
0x0 = POR is not triggered
0x1 = POR is triggered

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8 Application and Implementation

Note
Information in the following applications sections is not part of the TI component specification,
and TI does not warrant its accuracy or completeness. TI’s customers are responsible for
determining suitability of components for their purposes, as well as validating and testing their design
implementation to confirm system functionality.

8.1 Application Information

The LP5816 is a 4 channel RGBW LED driver. The device has ultra-low operation current at active mode
and only consumes 0.25mA when LED current is set at 25mA. In battery powered applications like e-tag, ear
bud, e-cigarettes, VR headset, RGB mouse, smart speaker, and other hand-held devices, LP5816 can provide
premium LED lighting effects with low power consumption and small package.
8.2 Typical Application
8.2.1 Application
Figure 8-1 shows an example of typical application, which uses one LP5816 to drive RGBW LEDs through I2C
communication.
Red LED
VIO VLED Green LED

Blue LED
2.5 V - 5.5 V LED0
4.7kΩ

4.7kΩ

VCC OUT0 White LED

1 uF
LED1
SCL OUT1

MCU
LED2
SDA OUT2

LED3
GND OUT3

Figure 8-1. Typical Application - LP5816 Driving RGBW LEDs

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8.2.2 Design Parameters

Design Parameters shows the typical design parameters of Application.
Table 8-1. Design Parameters
PARAMETER VALUE
Input voltage 3.6V to 4.2V by one Li-on battery cell
RGBW LED count 1
LED maximum average current (red, green, blue, white) 51mA, 40.8mA, 40.8mA, 40.8mA
LED PWM frequency 23kHz
LED PWM duty cycle (red, green, blue, white) 100%, 80%, 40%, 20%

8.2.3 Detailed Design Procedure

This section will showcase the detailed design procedures for LP5816 including components selection and how
to light on LED.

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8.2.3.1 Program Procedure

After VCC powering up, enable the device by setting CHIP_EN = 1. Set the maximum current for each output.
Then set the device configuration registers to enbale the output and select the dimming mode for each output.
Finally, Send UPDATE_CMD to make the prior configuration settings take effect. After that, set the PWM value to
adjust the output brightness.
The detailed program procedure is illustrated in Figure 8-2.

Power up VCC

Wait around 1 ms

Write CHIP_EN = 1 to
enable device

Set maximum current

Configure device
(enable output)

Send UPDATE_CMD to
make device configuration
take effect

Set manual PWM to adjust

output brightness

Figure 8-2. Program Procedure

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8.2.3.2 Programming Example

To get the design parameters in Section 8.2.2, the following program steps can be referred.
After VCC powering up and wait around 1ms,
1. Set CHIP_EN = 1 to enable the device(Write 01h to register 00h)
2. Set MAX_CURRENT = 1h to set 51mA maximum output LED current (Write 01h to register 01h)
3. Set 51mA maximum current for red LEDs, 40.8mA maximum current for green, blue and white LEDs (Write
FFh to registers 14h, write CCh to registers 15h, 16h and 17h)
4. Enable all 4 LEDs (Write 0Fh to register 02h)
5. Send UPDATE_CMD to make above step2 and step4 configurations take effect (Write 55h to register 0Fh)
6. Set red, green, blue and white LEDs PWM duty cycle as 100%, 80%, 40% and 20% (Write FFh to register
18h, write CCh to register 19h, write 66h to register 1Ah, write 33h to register 1Bh)
After this step, the red, green, blue and white LEDs are turned on with 100%, 80%, 40% and 20% PWM
duty cycle.

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8.2.4 Application Performance Plots

The following figures show the application performance plots.

OUT0 PWM 100% OUT1 PWM 80% OUT2 PWM 40% OUT3 PWM 20%

Figure 8-3. Current Sinks Waveforms of OUT0, OUT1, OUT2, OUT3

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8.3 Power Supply Recommendations

The LP5816 is designed to operate from an input voltage supply range from 2.5V to 5.5V. This input supply
must be well regulated. If the input supply is located more than a few inches from the converter, additional
bulk capacitance is required close to the ceramic bypass capacitors. A typical choice is a tantalum or aluminum
electrolytic capacitor with a value of 100μF.
8.4 Layout
8.4.1 Layout Guidelines
The input capacitor needs not only to be close to the VCC pin, but also to the GND pin to reduce input supply
ripple. For OUTx (x = 0, 1, 2, 3), low inductive and resistive path of switch load loop can help to provide a high
slew rate. Therefore, path of adjecent outputs must be short and wide and avoid parallel wiring and narrow trace.
For better thermal performance, TI suggest to make copper polygon connected with each pin bigger.
8.4.2 Layout Example
Red LED

Green LED

Blue LED

White LED

SCL OUT0

SDA OUT1

GND OUT2

VCC OUT3

Figure 8-4. LP5816 DRL Package Layout Example

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 LP5816
www.ti.com SNVSCQ1 – MARCH 2025

9 Device and Documentation Support

TI offers an extensive line of development tools. Tools and software to evaluate the performance of the device,
generate code, and develop solutions are listed below.
9.1 Documentation Support
9.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. Click on
Notifications to register and receive a weekly digest of any product information that has changed. For change
details, review the revision history included in any revised document.
9.3 Support Resources
TI E2E™ support forums are an engineer's go-to source for fast, verified answers and design help — straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
9.4 Trademarks
TI E2E™ is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
9.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.

9.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.

10 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
DATE REVISION NOTES
March 2025 * Initial Release

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11 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

34 Submit Document Feedback Copyright © 2025 Texas Instruments Incorporated

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 PACKAGE OPTION ADDENDUM

www.ti.com 24-Jul-2025

PACKAGING INFORMATION

Orderable part number Status Material type Package | Pins Package qty | Carrier RoHS Lead finish/ MSL rating/ Op temp (°C) Part marking
(1) (2) (3) Ball material Peak reflow (6)
(4) (5)

LP5816DRLR Active Production SOT-5X3 (DRL) | 8 4000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 5816
LP5816DRLR.A Active Production SOT-5X3 (DRL) | 8 4000 | LARGE T&R Yes SN Level-1-260C-UNLIM -40 to 125 5816
LP5816DRLR.B Active Production SOT-5X3 (DRL) | 8 4000 | LARGE T&R - SN Level-1-260C-UNLIM -40 to 125 5816

(1)
Status: For more details on status, see our product life cycle.

(2)
Material type: When designated, preproduction parts are prototypes/experimental devices, and are not yet approved or released for full production. Testing and final process, including without limitation quality assurance,
reliability performance testing, and/or process qualification, may not yet be complete, and this item is subject to further changes or possible discontinuation. If available for ordering, purchases will be subject to an additional
waiver at checkout, and are intended for early internal evaluation purposes only. These items are sold without warranties of any kind.

(3)
RoHS values: Yes, No, RoHS Exempt. See the TI RoHS Statement for additional information and value definition.

(4)
Lead finish/Ball material: Parts may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two lines if the finish value exceeds the maximum
column width.

(5)
MSL rating/Peak reflow: The moisture sensitivity level ratings and peak solder (reflow) temperatures. In the event that a part has multiple moisture sensitivity ratings, only the lowest level per JEDEC standards is shown.
Refer to the shipping label for the actual reflow temperature that will be used to mount the part to the printed circuit board.

(6)
Part marking: There may be an additional marking, which relates to the logo, the lot trace code information, or the environmental category of the part.

Multiple part markings will be inside parentheses. Only one part marking contained in parentheses and separated by a "~" will appear on a part. If a line is indented then it is a continuation of the previous line and the two
combined represent the entire part marking for that device.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information provided by third parties, and
makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and continues to take reasonable steps to provide representative
and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals. TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers
and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

Addendum-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 4-Apr-2025

TAPE AND REEL INFORMATION

REEL DIMENSIONS TAPE DIMENSIONS

K0 P1

B0 W
Reel
Diameter
Cavity A0
A0 Dimension designed to accommodate the component width
B0 Dimension designed to accommodate the component length
K0 Dimension designed to accommodate the component thickness
W Overall width of the carrier tape
P1 Pitch between successive cavity centers

Reel Width (W1)

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Sprocket Holes

Q1 Q2 Q1 Q2

Q3 Q4 Q3 Q4 User Direction of Feed

Pocket Quadrants

*All dimensions are nominal

Device Package Package Pins SPQ Reel Reel A0 B0 K0 P1 W Pin1
Type Drawing Diameter Width (mm) (mm) (mm) (mm) (mm) Quadrant
(mm) W1 (mm)
LP5816DRLR SOT-5X3 DRL 8 4000 180.0 8.4 2.75 1.9 0.8 4.0 8.0 Q3

Pack Materials-Page 1
 PACKAGE MATERIALS INFORMATION

www.ti.com 4-Apr-2025

TAPE AND REEL BOX DIMENSIONS

Width (mm)
H
W

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
LP5816DRLR SOT-5X3 DRL 8 4000 210.0 185.0 35.0

Pack Materials-Page 2
 PACKAGE OUTLINE
DRL0008A SCALE 8.000
SOT-5X3 - 0.6 mm max height
PLASTIC SMALL OUTLINE

1.3
B
1.1
A
PIN 1
ID AREA

1
8

6X 0.5

2.2
2X 1.5
2.0
NOTE 3

5
4
0.27
8X
0.17
0.1 C A B 1.7 0.05
2X 0 -10
1.5 0.00
0.05
2X 4 -15

0.6 MAX C

SEATING PLANE
0.18
0.08 0.05 C
SYMM
0.4
8X
0.2

SYMM

4224486/G 11/2024
NOTES:

1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. This dimension does not include mold flash, protrusions, or gate burrs. Mold flash, interlead flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
4.Reference JEDEC Registration MO-293, Variation UDAD

www.ti.com
 EXAMPLE BOARD LAYOUT
DRL0008A SOT-5X3 - 0.6 mm max height
PLASTIC SMALL OUTLINE

8X (0.67)
SYMM

8X (0.3) 1 8

SYMM

6X (0.5)

5
4

(R0.05) TYP
(1.48)

LAND PATTERN EXAMPLE

EXPOSED METAL SHOWN
SCALE:30X

0.05 MAX 0.05 MIN

AROUND AROUND

EXPOSED EXPOSED
METAL METAL

SOLDER MASK METAL METAL UNDER SOLDER MASK

OPENING SOLDER MASK OPENING
NON SOLDER MASK SOLDER MASK
DEFINED DEFINED
(PREFERRED)

SOLDERMASK DETAILS

4224486/G 11/2024

NOTES: (continued)

5. Publication IPC-7351 may have alternate designs.

6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
7. Land pattern design aligns to IPC-610, Bottom Termination Component (BTC) solder joint inspection criteria.

www.ti.com
 EXAMPLE STENCIL DESIGN
DRL0008A SOT-5X3 - 0.6 mm max height
PLASTIC SMALL OUTLINE

8X (0.67)
SYMM

8X (0.3) 1 8

SYMM

6X (0.5)

5
4

(R0.05) TYP
(1.48)

SOLDER PASTE EXAMPLE

BASED ON 0.1 mm THICK STENCIL
SCALE:30X

4224486/G 11/2024

NOTES: (continued)

8. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
9. Board assembly site may have different recommendations for stencil design.

www.ti.com
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