MMFT107T1

Preferred Device

Power MOSFET
250 mA, 200 Volts
N–Channel SOT–223
This Power MOSFET is designed for high speed, low loss power
switching applications such as switching regulators, dc–dc converters,
solenoid and relay drivers. The device is housed in the SOT–223 http://onsemi.com
package which is designed for medium power surface mount
applications.
250 mA
• Silicon Gate for Fast Switching Speeds 200 VOLTS
• Low Drive Requirement RDS(on) = 14

• The SOT–223 Package can be soldered using wave or reflow.
N–Channel
The formed leads absorb thermal stress during soldering
eliminating the possibility of damage to the die. D

MAXIMUM RATINGS (TC = 25°C unless otherwise noted)

Rating Symbol Value Unit G
Drain–to–Source Voltage VDSS 200 Volts
Gate–to–Source Voltage – Non–Repetitive VGS ±20 Volts S

Drain Current ID 250 mAdc

Total Power Dissipation @ TA = 25°C PD 0.8 Watts MARKING
(Note 1.) DIAGRAM
Derate above 25°C 6.4 mW/°C
Operating and Storage Temperature TJ, Tstg –65 to °C 4
TO–261AA FT107
Range 150
CASE 318E LWW
THERMAL CHARACTERISTICS 1 STYLE 3
2
3
Thermal Resistance – RθJA 156 °C/W
Junction–to–Ambient
L = Location Code
Maximum Temperature for Soldering TL WW = Work Week
Purposes 260 °C
Time in Solder Bath 10 Sec
1. Device mounted on FR–4 glass epoxy printed circuit using minimum PIN ASSIGNMENT
recommended footprint.
4 Drain

1 2 3
Gate Drain Source

ORDERING INFORMATION

Device Package Shipping

MMFT107T1 SOT–223 1000 Tape & Reel

MMFT107T3 SOT–223 4000 Tape & Reel

Preferred devices are recommended choices for future use

and best overall value.

 Semiconductor Components Industries, LLC, 2000 1 Publication Order Number:

November, 2000 – Rev. 4 MMFT107T1/D
 MMFT107T1

ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)

Characteristic Symbol Min Typ Max Unit

OFF CHARACTERISTICS
Drain–to–Source Breakdown Voltage V(BR)DSS 200 – – Vdc
(VGS = 0, ID = 10 µA)

Zero Gate Voltage Drain Current IDSS – – 30 nAdc

(VDS = 130 V, VGS = 0)

Gate–Body Leakage Current – Reverse IGSS – – 10 nAdc

(VGS = 15 Vdc, VDS = 0)

ON CHARACTERISTICS (Note 2.)

Gate Threshold Voltage VGS(th) 1.0 – 3.0 Vdc
(VDS = VGS, ID = 1.0 mAdc)

Static Drain–to–Source On–Resistance RDS(on) – – 14 Ohms

(VGS = 10 Vdc, ID = 200 mA)

Drain–to–Source On–Voltage VDS(on) – – 2.8 Vdc

(VGS = 10 V, ID = 200 mA)

Forward Transconductance gfs – 300 – mmhos

(VDS = 25 V, ID = 250 mA)

DYNAMIC CHARACTERISTICS
Input Capacitance Ciss – 60 – pF
(VDS = 25 VV, VGS = 0,
0
Output Capacitance Coss – 30 –
f = 1.0 MHz)
Transfer Capacitance Crss – 6.0 –

SOURCE DRAIN DIODE CHARACTERISTICS

Diode Forward Voltage VF – 0.8 – V
Continuous Source Current, Body IS – – 250 mA
(VGS = 0,
Diode
IS = 250 mA)
Pulsed Source Current, Body ISM – – 500
Diode
2. Pulse Test: Pulse Width ≤ 300 µs, Duty Cycle ≤ 2.0%.

TYPICAL ELECTRICAL CHARACTERISTICS

2.5 500
TJ = 25°C VDS = 10 V
VGS = 10 V
2 400
I D, DRAIN CURRENT (AMPS)

I D, DRAIN CURRENT (mA)

1.5 6V 5V 300
4V
1 200

3V
0.5 100 TJ = 125°C
25°C
-
55°C
0 0
0 2 4 6 8 10 0 1 2 3 4 5
VDS, DRAIN-TO-SOURCE VOLTAGE (VOLTS) VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)

Figure 1. On–Region Characteristics Figure 2. Transfer Characteristics

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 MMFT107T1

TYPICAL ELECTRICAL CHARACTERISTICS

RDS(on) , DRAIN-SOURCE RESISTANCE (NORMALIZED)

RDS(on) , DRAIN-SOURCE RESISTANCE (OHMS)

10 10
VGS = 10 V ID = 1 A
VGS = 10 V
8

6 TJ = 125°C
1
4
25°C
2

-
55°C
0 0.1
0 100 200 300 400 500 -
75 -
50 -
25 0 25 50 75 100 125 150
ID, DRAIN CURRENT (AMPS) TJ, JUNCTION TEMPERATURE (°C)

Figure 3. On–Resistance versus Drain Current Figure 4. On–Resistance Variation with Temperature

1 250
VGS = 0 V
f = 1 MHz
200
I D, DRAIN CURRENT (AMPS)

TJ = 25°C
C, CAPACITANCE (pF)

150
0.1
100 Ciss

50 Coss
TJ = 125°C 25°C
Crss
0.01 0
0 0.3 0.6 0.9 1.2 1.5 0 5 10 15 20 25 30
VSD, SOURCE-DRAIN DIODE FORWARD VOLTAGE (VOLTS) VDS, DRAIN-SOURCE VOLTAGE (VOLTS)

Figure 5. Source–Drain Diode Forward Voltage Figure 6. Capacitance Variation

10 2
VGS, GATE-TO-SOURCE VOLTAGE (VOLTS)

9 ID = 200 mA
VDS = 10 V
gFS, TRANSCONDUCTANCE (mhos)

8
1.5
7
6 VDS = 100 V
5 1
TJ = -
55°C
4 160 V
3
0.5 25°C
2
125°C
1
0 0
0 0.5 1 1.5 2 2.5 3 3.5 4 4.5 5 0 100 200 300 400 500
Qg, TOTAL GATE CHARGE (nC) ID, DRAIN CURRENT (AMPS)

Figure 7. Gate Charge versus Gate–to–Source Voltage Figure 8. Transconductance

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 MMFT107T1

INFORMATION FOR USING THE SOT-223 SURFACE MOUNT PACKAGE

MINIMUM RECOMMENDED FOOTPRINT FOR SURFACE MOUNTED APPLICATIONS

Surface mount board layout is a critical portion of the interface between the board and the package. With the
total design. The footprint for the semiconductor packages correct pad geometry, the packages will self align when
must be the correct size to insure proper solder connection subjected to a solder reflow process.

0.15
3.8

0.079
2.0

0.248
6.3
0.091 0.091
2.3 2.3

0.079
2.0

0.059 0.059 0.059 inches

1.5 1.5 1.5 mm

SOT-223 POWER DISSIPATION

The power dissipation of the SOT-223 is a function of the PD = 150°C – 25°C = 0.8 watts
pad size. This can vary from the minimum pad size for 156°C/W
soldering to a pad size given for maximum power
The 156°C/W for the SOT-223 package assumes the use
dissipation. Power dissipation for a surface mount device is
of the recommended footprint on a glass epoxy printed
determined by TJ(max), the maximum rated junction
circuit board to achieve a power dissipation of 0.8 watts.
temperature of the die, RθJA, the thermal resistance from
There are other alternatives to achieving higher power
the device junction to ambient, and the operating
dissipation from the SOT-223 package. One is to increase
temperature, TA. Using the values provided on the data
the area of the collector pad. By increasing the area of the
sheet for the SOT-223 package, PD can be calculated as
collector pad, the power dissipation can be increased.
follows:
Although the power dissipation can almost be doubled with
TJ(max) – TA
PD = this method, area is taken up on the printed circuit board
RθJA which can defeat the purpose of using surface mount
The values for the equation are found in the maximum technology. A graph of RθJA versus collector pad area is
ratings table on the data sheet. Substituting these values shown in Figure 9.
into the equation for an ambient temperature TA of 25°C,
one can calculate the power dissipation of the device which
in this case is 0.8 watts.

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 MMFT107T1

160

JA , Thermal Resistance, Junction

Board Material = 0.0625″ TA = 25°C
140 G10/FR4, 2 oz Copper

to Ambient (C/W)
0.8 Watts
°
120
1.25 Watts* 1.5 Watts

100

R θ
*Mounted on the DPAK footprint
80
0.0 0.2 0.4 0.6 0.8 1.0
A, Area (square inches)

Figure 9. Thermal Resistance versus Collector

Pad Area for the SOT-223 Package (Typical)

Another alternative would be to use a ceramic substrate board, the power dissipation can be doubled using the same
or an aluminum core board such as Thermal Clad. Using footprint.
a board material such as Thermal Clad, an aluminum core

SOLDER STENCIL GUIDELINES

Prior to placing surface mount components onto a printed or stainless steel with a typical thickness of 0.008 inches.
circuit board, solder paste must be applied to the pads. A The stencil opening size for the SOT-223 package should
solder stencil is required to screen the optimum amount of be the same as the pad size on the printed circuit board, i.e.,
solder paste onto the footprint. The stencil is made of brass a 1:1 registration.

SOLDERING PRECAUTIONS
The melting temperature of solder is higher than the rated • The soldering temperature and time should not exceed
temperature of the device. When the entire device is heated 260°C for more than 10 seconds.
to a high temperature, failure to complete soldering within • When shifting from preheating to soldering, the
a short time could result in device failure. Therefore, the maximum temperature gradient should be 5°C or less.
following items should always be observed in order to • After soldering has been completed, the device should
minimize the thermal stress to which the devices are be allowed to cool naturally for at least three minutes.
subjected. Gradual cooling should be used as the use of forced
• Always preheat the device. cooling will increase the temperature gradient and
• The delta temperature between the preheat and result in latent failure due to mechanical stress.
soldering should be 100°C or less.* • Mechanical stress or shock should not be applied
• When preheating and soldering, the temperature of the during cooling
leads and the case must not exceed the maximum
temperature ratings as shown on the data sheet. When * Soldering a device without preheating can cause
using infrared heating with the reflow soldering excessive thermal shock and stress which can result in
method, the difference should be a maximum of 10°C. damage to the device.

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 MMFT107T1

TYPICAL SOLDER HEATING PROFILE

For any given circuit board, there will be a group of The line on the graph shows the actual temperature that
control settings that will give the desired heat pattern. The might be experienced on the surface of a test board at or
operator must set temperatures for several heating zones, near a central solder joint. The two profiles are based on a
and a figure for belt speed. Taken together, these control high density and a low density board. The Vitronics
settings make up a heating “profile” for that particular SMD310 convection/infrared reflow soldering system was
circuit board. On machines controlled by a computer, the used to generate this profile. The type of solder used was
computer remembers these profiles from one operating 62/36/2 Tin Lead Silver with a melting point between
session to the next. Figure 10 shows a typical heating 177–189°C. When this type of furnace is used for solder
profile for use when soldering a surface mount device to a reflow work, the circuit boards and solder joints tend to
printed circuit board. This profile will vary among heat first. The components on the board are then heated by
soldering systems but it is a good starting point. Factors that conduction. The circuit board, because it has a large surface
can affect the profile include the type of soldering system in area, absorbs the thermal energy more efficiently, then
use, density and types of components on the board, type of distributes this energy to the components. Because of this
solder used, and the type of board or substrate material effect, the main body of a component may be up to 30
being used. This profile shows temperature versus time. degrees cooler than the adjacent solder joints.

STEP 1 STEP 2 STEP 3 STEP 4 STEP 5 STEP 6 STEP 7

PREHEAT VENT HEATING HEATING HEATING VENT COOLING
ZONE 1 “SOAK” ZONES 2 & 5 ZONES 3 & 6 ZONES 4 & 7
“RAMP” “RAMP” “SOAK” “SPIKE” 205° TO 219°C
PEAK AT
200°C DESIRED CURVE FOR HIGH 170°C SOLDER
MASS ASSEMBLIES JOINT
160°C
150°C

150°C
SOLDER IS LIQUID FOR
40 TO 80 SECONDS
100°C 140°C (DEPENDING ON
MASS OF ASSEMBLY)
100°C

DESIRED CURVE FOR LOW

MASS ASSEMBLIES
5°C

TIME (3 TO 7 MINUTES TOTAL) TMAX

Figure 10. Typical Solder Heating Profile

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 MMFT107T1

PACKAGE DIMENSIONS

SOT–223 (TO–261)
CASE 318E–04
ISSUE K

A
F
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
4
INCHES MILLIMETERS
S B DIM MIN MAX MIN MAX
1 2 3
A 0.249 0.263 6.30 6.70
B 0.130 0.145 3.30 3.70
C 0.060 0.068 1.50 1.75
D 0.024 0.035 0.60 0.89
D F 0.115 0.126 2.90 3.20
G 0.087 0.094 2.20 2.40
L
G H 0.0008 0.0040 0.020 0.100
J 0.009 0.014 0.24 0.35
J K 0.060 0.078 1.50 2.00
C L 0.033 0.041 0.85 1.05
M 0
10
0
10

0.08 (0003) M S 0.264 0.287 6.70 7.30
H
K STYLE 3:
PIN 1. GATE
2. DRAIN
3. SOURCE
4. DRAIN

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 MMFT107T1

Thermal Clad is a registered trademark of the Bergquist Company.

ON Semiconductor and are trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes
without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular
purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability,
including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or
specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be
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alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer.

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