Ec 3353 Edc
Ec 3353 Edc
UNIT 1
SEMICONDUCTOR DEVICES
PN JUNCTION DIODE
i. In a piece of semiconductor, one half is doped by P-type impurity and the other half is doped by
N-type impurity. Thus PN junction is formed.
ii. This formation of PN junction is called diode as it has two electrodes one for P region called as
Anode and the other for N region called as Cathode.
N-Type Material
The majority charge carriers are electrons and has higher concentration of free electrons than holes
as shown in Fig.1.7 (a)
.
The majority charge carriers are holes and P type material has higher concentration of holes than
electrons, as shown in Fig. 1.7 (b).
Diffusion
The tendency of the free electrons to diffuse from the n-side to p-side and holes from p- region to
n-region is called diffusion.
Diffusion is the process by which charge carrier moves from high concentration region to low
concentration region.
Depletion Region
The free electrons diffuse from 'n' side to 'p' side region and recombine with the holes in P region.
Thus negative charged immobile ions are formed near the junction.
Also, the holes diffuse from P-region to n-region and recombine with the electrons in n-region and
leaves positively charged immobile ions near the junction of n-side.
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This process continues over certain time duration. After certain extent, the net negative charge on P-
side prevents further diffusion of electrons into P-side. Similarly, the net positive charge on N- side
repels holes crossing from P-side to N- side. These immobile positive and negative ions form a region
called as depletion region.
Depletion region is defined as the region over which all the free charge carriers are depleted. This
region is also known as space charge region since there are no free charge carriers available for
conduction. In equilibrium condition, the depletion region gets widened upto a point where no further
electrons or holes can cross the junction. The physical distance from one side to other side of the
depletion region is called width of the depletion region.
Barrier Potential
The electric filed is developed across the depletion region due to the potential difference between P
and N regions. This potential acts as barrier for further conduction between the junction. This
potential is called as barrier potential or diffusion potential or contact potential or cut in voltage.
i. It depends on doping levels and temperature
ii. The value of contact potential is 0.3 V for Germanium and 0.72V for Silicon at 25° C.
The barrier potential depends on
i. The type of semiconductors
ii. Concentration of donor impurity on n- side
iii. Concentration of acceptor impurity on p - side
iv. Intrinsic concentration of semiconductors
v. Temperature
OPERATION OF A PN JUNCTION DIODE
Biasing
Applying any external voltage to electronic device is called biasing. Biasing refers to provide
minimum external voltage and current to activate the device.
There are two types of biasing for PN junction.
Forward Bias
The positive terminal of the battery is connected to P-type semiconductor and negative terminal is
connected to n-type semiconductor material.
Reverse Bias
The positive terminal of the battery is connected to n - type semiconductor and the negative
terminal is connected to P-type semiconductor material.
FORWARD BIASED PN JUNCTION
In unbiased PN junction, there is no flow of current, when forward bias is applied to the PN junction,
the applied forward voltage creates an electric field opposite to the potential barrier.
i. Thus the potential barrier is reduced at the junction. As the potential barrier is very small (0.7 V
for Si and 0.3 V for Ge), a small forward voltage is sufficient to eliminate the barrier potential.
ii. The applied positive potential repels the holes in P-type region towards the junction. The electrons
in the n-type region are also repelled towards the junction due to the negative voltage applied in n-
region.
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iii. When the applied potential is more than the internal barrier potential, the depletion region
completely disappears and the junction resistance becomes zero.
iv. The junction provides a low resistance path and thus current flows in the circuit. This current is
called forward current.
v. When the forward voltage is increased, the large number of majority charge carriers can cross
the junction. These large number of majority charge carriers constitute the forward current.
The current in P - region is due to the movement of holes which are majority carriers. This is called
hole current.
The current in the n-regions is due to the movement of free electrons which are majority carriers.
This is called electron current. The overall forward current is due to the majority charge carriers.
These majority carriers can travel around the closed circuit and large amount of current flows from
negative to positive of the battery.
The direction of conventional current is from positive to negative of the battery which is opposite
to the direction of flow of electrons.
The voltage drop across a p- n junction diode in forward biased condition is made up of
(i) drop due to barrier potential
(ii) drop due to internal resistance
REVERSE BIASED P-N JUNCTION
The P-region is connected to negative terminal of the battery and n -region is connected to positive
terminal of the battery.
When p-n junction is reverse biased, the negative terminal attracts the holes in p - region and the
positive terminal attracts the free electrons in n - region away from the junction.
The electrons and holes move away from the junction and the width of depletion region increases.
The charge carriers are unable to cross the junction.
Thus there are more positive ions in the n- region and more negative ions in the p- region.
When the depletion region widens, the barrier potential across the junction also increases.
The applied reverse voltage creates an electric field which is in same direction of potential barrier
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PN DIODE SYMBOL
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During reverse bias, all the majority carriers are attracted by the battery i.e., holes from P-type move
towards negative terminal of battery and electrons from n-type move towards positive terminal of
battery. Thus only immobile ions near the junction form a strong depletion region which offers very
high resistance for majority carriers.
Hence only very small current flows in the circuit. The polarity of reverse voltage applied is opposite
to that of forward voltage. So, the reverse saturation current is opposite to the forward current and
its value is negative.
i. When reverse voltage is increased, reverse current increases initially upto certain voltage. After
some extent, the current remains constant although reverse voltage is increased. This current is called
reverse saturation current Io the point at which breakdown occurs and reverse saturation current
increases rapidly is called knee of the reverse characteristics.
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Reverse Resistance
It is the resistance offered by the PN junction diode under reverse bias condition.. It is very large
compared to the forward resistance, in the order of MΩ.
Static Reverse Resistance (Rf)
It is the reverse resistance under dc applied voltage. It is defined as the ratio of applied reverse
voltage to the reverse saturation current Io.
Where
I = diode current, Amperes
Io = reverse saturation current, Amperes
V = Applied voltage, Volts
VT = voltage equivalent of temperature, Volts
η = emission co-efficient, η = 1 for Germanium and η = 2 for Silicon diode
The emission coefficient or ideality factor n represents the recombination occurring in the depletion
region.
The voltage equivalent of temperature indicates the dependence of diode current on temperature.
VT = KT Volts
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REAKDOWN IN DIODES
During reverse bias, when the reverse voltage is less than breakdown voltage, the diode current is
also very small due to minority carriers and almost constant at I o. When the reverse voltage is
increased beyond certain limit, the diode current will be maximum. The point at which the current
increases rapidly is called breakdown and the corresponding voltage is called reverse breakdown
voltage.
There are two types of breakdown mechanisms in PN diode. They are
i. Avalanche Breakdown
ii. Zener Breakdown
Avalanche Breakdown
The reverse bias causes a small reverse current to flow in the device. This occurs due to the
movement of minority charge carriers i.e., electrons from P-type and holes from N - type, since
majority carriers move away from the junction.
When the reverse bias is increased, the minority carriers acquire more energy and this kinetic energy
is sufficient to break the covalent bonds of the crystal structure. Thus more valence electrons are
released from the crystal structure. If the applied voltage is increased, then velocity is also increased.
As kinetic energy is directly proportional to square of velocity (K.E = 1/2 m V2), the kinetic energy
of electron also increases.
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If this electron collides with an electron in a covalent bond, then the collision provides enough energy
to the valence electron to break its covalent bond. This process is called as impact ionization.
Hence, electron-hole pairs are created. These electron hole pairs in turn participate in collision and
generate new electron-hole pairs.
This process is called as Avalanche multiplication or Carrier multiplication. It is a cumulative
process and large number of electron - hole pairs are created. The reverse current increases rapidly
and the junction is said to be in breakdown region.
The avalanche breakdown occurs only in lightly doped diodes, where the depletion region is very
wide and the electric field is very low.
Zener Breakdown
Zener breakdown occurs mainly in heavily doped diodes, where the depletion region is very small.
When the diode is reverse biased, the electric field across the depletion region is very large..
Electric field is defined as the ratio of voltage measured to the distance. As the depletion region is
narrow, the electric field is very high (: electric field is inversely proportional to distance).
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This very high electric field breaks the covalent bonds and pulls the electrons out of the valence bands.
Hence, new electron hole pairs are created which increases the reverse current and large amount of reverse
current across the junction. This process is called Zener effect. This leads to breakdown in p- n diode, called
Zener breakdown.
For diodes with reverse breakdown between 5 V & 6 V, both avalanche and Zener mechanisms
occurs if the breakdown voltage is less than 5 V, then Zener breakdown occurs. The breakdown
voltage depends upon the doping level of the junction. This value determines the practical safe
operating voltage called Peak Inverse Voltage (PIV) of a diode. If the operating voltage is less than
PIV rating, the reverse breakdown condition is prevented.
If temperature is increased, the valence electrons acquire high energy levels and minimum voltage is
sufficient to pull electrons from covalent bonds. Thus for small voltage, at higher temperature,
breakdown occurs.
The breakdown voltage decreases as the temperature increases in Zener breakdown. So, Zener
breakdown exhibits negative temperature co-efficient.
In lightly doped diodes, width of depletion region is large. If temperature is increased, the vibration
of atoms in the crystal increases. The charge carriers have less opportunity to impart energy between
collisions to start carrier multiplication. So, voltage should be increased to create breakdown in diode.
Thus breakdown voltage increases as the temperature increases. Hence, Avalanche breakdown has
positive temperature co-efficient.
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By poisson's equation,
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Where
ε - permittivity of the material
A - Cross sectional area of the junction
W - Width of depletion layer
The depletion width W is given by
When no external voltage is applied, width of PN diode is of the order of 0.5 microns. The majority
carriers move across the junction and opposite charges are stored at a distance W apart. This depletion
region acts as dielectric between P and N regions. Thus it acts as a parallel plate capacitor with
transition capacitance CT approximately 20 PF with no external bias. CT ranges from 5 to 200 PF
with applied voltage.
ii. Linearly Graded Junction
The charge density varies linearly with the applied voltage.
Linear graded junction is formed by melting Germanium and its type is changed during the drawing
process by adding first p-type and then n-type impurities. The charge density becomes absolutely
zero at edge distances and W/2 W/2 and varies linearly with distance.
Integrating (6)
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The total potential VJ across the junction from - W/2 to W/2 is given by
From (7)
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DIFFUIOSN CAPACITANCE
The capacitance which exists in a forward biased junction is called diffusion or storage
capacitance, CD. CD is always larger than transistor capacitance CT.
This capacitance is caused by the injected charge stored near the junction just outside the transition
region.
It is defined as the rate of change of injected charge with applied voltage.
CD = d Q / d V
dQ - change in number of minority carriers outside the depletion region
d V - change in voltage across the diode
Assumption
P side is more heavily doped than N side. Thus current I is carried across the junction only due to
holes moving from P to N side.
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HALF-WAVE RECTIFIER
In half-wave rectifier, either positive or negative half of the ac signal is passed, while the other half
is blocked. It converts an ac voltage into a dc voltage during one half of the ac cycle only.
PN diode is used for rectification because of its unidirectional property ie conducts during forward
bias and does not conduct during forward bias and does not conduct during reverse bias. Fig.1.22
shows the circuit diagram of half wave rectifier. Let V i be the input voltage to the primary of the
transformer, and is given as
Where
During positive half cycle of the input signal, the diode is forward biased and the anode of the diode
is more positive with respect to cathode. The diode therefore conducts during positive cycle of the
input voltage.
For an ideal diode, the forward voltage drop is zero, thus the applied input voltage will appear across
the load resistance RL.
During negative half cycle of the input signal, the diode is reverse biased i.e., the anode of the diode
is negative with respect to cathode. Thus the diode D does not conduct due to high impedance. Hence
the input voltage does not appear at the output. Fig.1.23 shows the input and output waveform of
half wave rectifier.
Ripple Factor
The ratio of rms value of ac component to the de component in the output is known as Ripple Factor.
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Peak Factor
Peak Factor is defined as the ratio of peak value to the rms value.
Peak factor = peak value/rms value
FULL-WAVE RECTIFIER
Full wave rectifier converts an ac voltage into pulsating dc voltage during both half cycles of the
applied voltage.
Here, two diodes are used, one conducts during positive cycle and the other diode conducts during
negative half cycle of the applied voltage.
A multiple winding transformer is used whose secondary winding is split equally into two halves
with a common centre tapped connection (C).
This configuration results in each diode conducting in turn when its anode terminal is positive with
respect to the transformer center point C.
The full wave rectifier circuit consists of two diodes connected to a single load resistance (R) with each diode
supplying current to the load in turn. The output voltage across the resistor R is the phasor sum of the two
waveforms.
Ripple Factor
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Efficiency
Peak Factor
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During positive half cycle of the input voltage, diodes D1 and D3 conduct and diodes D2 and D4 do
not conduct. The current is produced due to diodes D1 and D3 and this current flows through the load
resistance RL.
During negative half cycle of the input ac voltage, diodes D2 and D4 conduct and diodes D1, and D3
do not conduct. The current flows in the load resistance due to diodes D 2 and D4.
The current flows in the same direction in both positive and negative half cycles of the input voltage,
thus an unidirectional output waveform is obtained.
The maximum efficiency of a bridge rectifier is 81.2% and the ripple factor is 0.48. The PIV is V m.
Fig. 1.27 shows the output waveform of bridge rectifier.
ZENER DIODE
In ordinary PN diode, the doping is light. So, the breakdown voltage is high. If the P and N regions
are heavily doped, then breakdown voltage can be reduced.
When the reverse voltage reaches the breakdown voltage, the current through the junction and the
power dissipation at the junction will be high.
Due to large amount of current, there is possibility of damaging the diode. Therefore, the diodes are
designed with adequate power dissipation capability to operate in the breakdown region. The diode
designed with such specification is called Zener diode, which is heavily doped than ordinary diode.
When doping is heavy, the electric field at the junction will be very high even at low reverse voltage.
The electrons in covalent bonds break away from the bonds. This effect is called as Zener effect.
A diode which exhibits the Zener effect is called Zener diode. Zener diode is a reverse biased heavily
doped diode which operates in the breakdown region. Zener diodes are designed to operate at
voltages ranging from a few volts to several hundred volts.
Symbol
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When the reverse voltage is less than the reverse breakdown voltage, the diode carries reverse
saturation current.
When the reverse voltage is greater than the reverse breakdown voltage, the current through the
diode increases rapidly and the voltage across the diode remains constant. Usually Zener diode is
operated in this reverse breakdown region.
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Due to this property, Zener diode is used for providing constant voltage source in voltage regulators.
When the reverse voltage applied to a Zener diode is increased, initially the current through it is very
small, in the order of few μA or less. This is the reverse leakage current of the diode, I o
At certain reverse voltage, the current through Zener diode increases rapidly. This change from a
low value to large current is very sharp. This sharp change is reverse characteristics is called knee of
the curve.
At the knee voltage, the breakdown occurs. The reverse bias voltage at which the breakdown occurs
is called Zener breakdown voltage, Vz.
The current corresponding to the knee point is called Zener knee current, denoted as Izmin
As current is increased, the power dissipation also increases (: P z = Vz Iz). If this power dissipation
increases beyond certain value, the diode may get damaged. The maximum current at which a Zener
diode can operate safely is called Zener maximum current, Izmax.
Equivalent Circuit of Zener Diode
When the breakdown occurs, Iz increases from Izmin to Izmax and, the voltage across Zener diode
remains constant.
The internal Zener impedance decreases as current increases in the Zener region. But this impedance
is very small. Ideally the Zener diode is indicated by a battery of voltage V z which remains fairly
constant.
Fig. 1.31 shows the equivalent circuit of Zener diode. In reverse bias, the resistance is called dynamic
resistance of the Zener diode, r z. The ratio of change in Zener voltage to the change in Zener current
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These new charge carriers again acquire sufficient energy from the field and collide with other
immobile ions and generate further electron-hole pairs. This process continues and results in
generation of avalanche of charge carriers within a short time. This mechanism of carrier generation
is called as Avalanche multiplication.
This process results in flow of large amount of current at the reverse bias. Zener diodes having Zener
Voltage above 6V exhibit avalanche breakdown and the diode has positive temperature coefficient
i.e., the breakdown voltage increases when the p-n junction temperature is increased. Thus Zener
diode has positive temperature coefficient.
Zener Breakdown
When P and N regions are heavily doped, strong electric field is created which results in direct
rupture of covalent bonds. Hence new electron-hole pairs are generated and the reverse current
begins to increase.
This process occurs at a reverse bias below 6V. Due to heavy doping, the depletion width becomes
very small and the electric field across the depletion region becomes very high of the order of
107 V/m. Thus Zener breakdown occurs.
For lightly doped diodes, the breakdown voltage is high and it is mainly due to Avalanche
multiplication. Thus in Zener diode, breakdown occurs both in lower and higher breakdown voltages
ie both Avalanche and Zener breakdown occurs. Such diodes are called Zener diodes.
Tepemrature Coefficient of Zener Diode
The percentage change in the Zener voltage V, for every °C rise/fall in temperature is called
Temperature Coefficient (TC) of a Zener diode.
If Vz is less than 6 V, the temperature coefficient is negative. For Zener diode with V z greater than
6 V, the temperature coefficient is positive.
ZENER DIODE AS VOLTAGE REGULATOR
When reverse bias is applied, the voltage across the diode remains constant and, the current through
the diode increases.
The voltage across the Zener diode acts as reference voltage and the diode can be used as a voltage
regulator.
In the Fig.1.32 shown, the load resistance should be provided with constant voltage. Zener diode is
reverse biased and if the input voltage is not less than Zener breakdown voltage (V z) then the voltage
across the diode will be constant and thus the load voltage is also constant.
Applications of Zener Diode
i. Voltage regulators.
ii. Zener limiters to clip the unwanted portion of the voltage waveform.
iii. Over voltage protection.
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The centre layer is called the base, one of the outer layers is termed the emitter, and the other outer
layer is referred to as the collector.
The emitter, base, and collector are provided with terminals, which are appropriately labeled E, B
and C.
Two pn-junctions exist in each transistor.
i. The collector base junction and
ii. The emitter base junction
Circuit symbols for pnp and npn transistors are shown in Fig. 1.34. The arrow head on each symbol
identifies the transistor either terminal and indicates the conventional direction of current flow. For
an npn transistor, the arrowhead points from the p-type base to the n-type emitter. For a pnp device
the arrowhead points from the p-type emitter to the n-type base. Thus the arrowhead always points
from p to n.
Two transistors packages are there
i. Low power transistor 1 mA to 20 mA current levels
ii. High power transistor - 100 mA to several amps range.
OPERATION ON NPN TRANSISTOR AND PNP TRANSISTOR
NPN Transistor Operation
As shown in Fig.1.35, the forward bias applied to the emitter base junction of an NPN transistor
causes a lot of electrons from the emitter region to crossover to the base region.
As the base is lightly doped with P-type material the number of holes in the base region is very small
and hence the number of electrons that combine with holes in the p-type base region is also very
small. Hence few electrons combine with holes to constitute a base current I B. The remaining
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electrons (more than 95%) crossover into the collector region to constitute collector current I C. Thus
the base and collector current summed up gives the emitter current i.e., IE = - (IC + IB).
In the external circuit of the NPN bipolar junction transistor, the magnitudes of the emitter current
IE, the base current I, and the collector current Ic are related by IE = (IC + IB).
This equation gives the fundamental relationship between the currents in a bipolar transistor circuit.
Also this fundamental equation shows that there are current amplification factors α and β in common
base transistor configuration and common emitter transistor configuration respectively for the static
(dc) currents and for small changes in the currents.
Large-Signal Current Gain (α)
The large signal current gain of a common base transistor is defined as the ratio of the negative of
the collector-current increment to the emitter-current change from cutoff (IE = 0) to IE i.e.,
Where ICBO (or ICO) is the reverse saturation current flowing through the reverse biased collector-
base junction, i.e., the collector to base leakage current with emitter open. As the magnitude of ICBO
is negligible when compared to IE, the above expression can be written as
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Since IC and IE are flowing in opposite directions, a is always positive. Typical value of α ranges
from 0.90 to 0.995. Also a is not a constant but varies with IE, VCB, and temperature.
General Transistor Equation
In the active region of the transistor, the emitter is forward biased and the collector is reverse biased.
The generalized expression for collector current I C for collector junction voltage VC and emitter
current IE is given by
If VC is negative and | VC | is very large compared with VT, then the above equation reduces to
If VC, i.e., VCB, is few volts, IC is independent of V C. Hence the collector current IC is determined
only by the fraction a of the current IB flowing in the emitter.
From equation (5) we have
Comparing the equations (7) and (9) we get the relationship between the leakage currents of
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We get
DC Current Gain
The dc current gain is defined as the ratio of the collector current IC to the base current IB. That is
As IC is large compared with ICEO, the large signal current gain (β) and the de current gain (hFE) are
approximately equal.
TYPES OF CONFIGURATION
When a transistor is to be connected in a circuit, one terminal is used as an input terminal, the other
terminal is used as an output terminal and the third terminal is common to the input and output.
Depending upon the input, output and common terminal, a transistor can be connected in three
configurations. They are (i) Common Base (CB) Configuration (ii) Common Emitter (CE) and (iii)
Common Collector (CC) Configuration.
Common Base Configuration
This is also called grounded base configuration. In this configuration, emitter is the input terminal,
collector is the output terminal and base is the common terminal.
The circuit for determining the static characteristics curve of an NPN transistor in the common base
configuration is shown in Fig.1.37.
Input Characteristics
To determine the input characteristics, the collector base voltage V CB is kept constant at zero volt
and the emitter current IE is increased from zero in suitable equal steps by increasing VEB. This is
repreated for higher fixed values of VCB. A curve is drawn between emitter current IB and emitter-
base voltage VEB at constant collector-base voltage VCB. The input chracteristics thus obtained are
shown in Fig. 1.38.
When VCB is equal to zero and the emitter-base junction is forward biased as shown in the
characteristics. The junction behaves as a forward biased diode so that emitter current I E increases
rapidly with small increase in emitter-base voltage V EB
When VCB is increased keeping VEB constant, the width of the base region will decrease. This effect
results in an increase of IE. Therefore, the curves shift towards the left as VCB is increased.
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Output Characteristics
To determine the output characteristics, the emitter current I E is kept constant at a suitable value by
adjusting the emitter-base voltage VEB. Then VCB is increased in suitable equal steps and the collector
current IC is noted for each value of IE. This is repeated for different fixed values of IE. Now the
curves of IC versus VCB are plotted for constant values of IE and the output characteristics thus
obtained is shown in Fig. 1.39.
From the characteristics, it is seen that for a constant value of IE, IC is independent of VCB and the
curves are parallel to the axis of VCB. Further, IC flows even when VCB is equal to zero. As the
emitter-base junction is forward biased, the majority
carriers i.e., electrons from the emitter are injected into the base region. Due to the action of the
internal potential barrier at the reverse baised collector-base junction, they flow to the collector
region and give rise to IC even when VCB is equal to zero.
(i) Input Impedance (hib)
It is defined as the ratio of the change in (input) emitter voltage to the change in (input) emitter
current with the (output) collector voltage VCB kept constant. Therefore,
It is the slope of CB input characteristics IE versus VEB as shown in Fig. 1.38. The typical value of
hit ranges from 20 to 50 Ω.
(ii) Output Admittance (hob)
It is defined as the ratio of the change in (output) collector current to the corresponding change in
the (output) collector voltage with the (input) emitter current IE kept constant. Therefore,
It is the slope of CB output characteristics IC versus VCB as shown in Fig. 1.39. The typical value of
the parameter is of the order of 0.1 to 10 μhos.
(iii) Forward Current Gain (hfb)
It is detected as a ratio of the change in the (output) collector current to the corresponding change
in the (input) emitter current keeping the (output) collector voltage VCB constant. Hence,
It is the slope of IC versus IE curve. Its typical value varies from 0.9 to 1.0.
(iv) Reverse Voltage Gain (hrb)
It is defined as the ratio of the change in the (input) emitter voltage and the corresponding change
in (output) collector voltage with constant (input)emitter current, IE. Hence,
It is the slope of VEB Vs VCB curve. Its typical value is the order of 10-5 to 10-4.
Common Emitter Configuration
Input Characteristics
To determine the input characteristics the collector to emitter voltage is kept constant at zero volt
and base current is increased from zero in equal steps by increasing VBE in the circuit shown in Fig.
1.40.
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The value of VBE is noted for each settling of IB. This procedure is repeated for higher fixed values
of VCE, and the curves of IB Vs VBE are drawn. The input characteristics thus obtained are shown in
Fig. 1.41.
When VCE = 0, the emitter base junction is forward biased and the junction behaves as a forward
biased diode.
Hence the input characteristics for VCE = 0 is similar to that of a forward biased diode. When VCE is
increased the width of the depletion region at the reverse biased collector base junction will increase.
Hence the effective width of the base will decrease. This effect causes a decrease in the base current
IB. Hence to get the same value of Ib as that for VCE = 0, VBE should be increased. Therefore, the
curve shifts to the right as VCE increases.
Output Characteristics
To determine the output characteristics, the base current I B is kept constant at a suitable value by
adjusting base-emitter voltage, VBE. The magnitude of collector- emitter voltage VCE is increased in
suitable equal steps from zero and the collector current I C is noted for each setting VCE. Now the
curves of IC versus VCE are plotted for different constant values of IB. The output characteristics are
obtained shown in Fig. 1.42.
For larger values of VCE, due to Early effect, a very small change in a is reflected in a very large
change in β.
The output characteristics of CE configuration show a larger slope when compared with CB
configuration.
The output characteristics have three regions namely, saturation region, cutoff region and active
region.
The region of curves to the left of the line OA is called the saturation region, and the line OA is called
the saturation line. In this region, both junctions are forward biased and an increase in the base current
does not cause a corresponding large change in IC. The ratio of VCE(sat) to IC in this region is called
saturation resistance.
The region below the curve for IB = 0 is called the cut-off region. In this region, both junctions are
reverse biased. When the operating point for the transistor enters the cutoff region, the transistor is
OFF. Hence the collector current becomes almost
zero and the collector voltage almost equals V CC, the collector supply voltage. The transistor is
virtually an open circuit between collector and emitter.
The central region where the curves are uniform in spacing and slope is called the active region. In
this region, emitter-base junction is forward biased and the collector base junction is reverse
biased. If the transistor is to be used as a linear amplifier it should be operated in the active region.
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Transistor Parameters
The slope of the CE characteristics will give the following four transistor parameters. Since these
parameters have different dimensions, they are commonly known as common emitter hybrid
parameters or h-parameters.
(i) Output Admittance (hoe)
It is defined as the ratio of change in the (output) collector current to the corresponding change in
the (output) collector voltage with the (input) base current IB kept constant. Therefore
It is the slope of CE output characteristic IC Vs VCE. The typical value of this parameter is of the
order of 0.1 to 10 μ mhos.
(ii) Input Impedance (hie)
It is defined as the ratio of the change in (input) base voltage to the change in (input) base current
with the (output) collector voltage VCE kept constant.
It is the slope of CE input characteristics IB versus VBE, the typical value of hie ranges from 500 to
2000 Ω.
(iii) Forward Current Gain (hfe)
It is defined as a ratio of the change in the (output) collector current to the corresponding change in
the (input) base current keeping the (output) collector voltage VCE constant. Hence
It is the slope of IC versus IB curve. Its typical value varies from 20 to 200.
(iv) Reverse Voltage Gain (hre)
It is defined as the ratio of the change in the (input) base voltage and the corresponding change in
(output) collector voltage with constant (input) base current, IB. Hence,
It is the slope of VBE Versus VCE curve. Its typical value is of the order of 10-5 to 10-4.
Common Collector Configuration
The circuit diagram for determining the static characteristics of an NPN transistor in the common
collector configuration is shown in Fig. 1.43.
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Input Characteristics
To determine the input characteristics, V EC is kept at a suitable fixed value. The base-collector
voltage VBC is increased in equal steps and the corresponding increase in I B is noted. This is repeated
for different fixed values of VEC. Plots of VBC versus IB for different values of VEC shown in Fig.
1.44 are the input characteristics.
Output Characteristics
The output characteristics shown in Fig. 1.45 are same as those of the common emitter
configuration.
METAL OXIDE SEMICONDUCTOR FIELD EFFECT TRANSISTOR (MOSFET)
MOSFET is the common term for the Insulated Gate Field Effect Transistor (IGFET). There are
two basic terms of MOSFET (i) Enhancement MOSFET and (ii) Depletion MOSFET.
Principle
By applying a transverse electric field across an insulator, deposited on the semiconducting material,
the thickness and hence the resistance of a conducting channel of a semiconducting material can be
controlled.
In a depletion MOSFET, the controlling electric field reduces the number of majority carriers
available for conduction, whereas in the enhancement MOSFET, application of electric field causes
an increase in the majority carrier density in the conducting regions of the transistor.
ENHANCEMENT MOSFET
Construction
The construction of an N-channel enhancement MOSFET is shown in Fig. 1,50(a) and the circuit
symbols for an N-channel and a P-channel enhancement MOSFET are shown in Fig. 1.50 (b) and
1.50(c) respectively. As there is no continuous channel in an enhancement MOSFET, this condition
is represented by the broken line in the symbols.
Two highly doped N+ regions are diffused in a lightly doped substrate of P-type silicon substrate.
One N+ region is called the source S and the other one is called the drain D. They are separated by
1 mil (10-3 inch). A thin insulating layer of SiO2 is grown over the surface of the structure of SiO2 is
grown over the surface of the structure and holes are cut into the oxide layer, allowing contact with source and
drain. Then a thin layer of metal aluminium is formed over the layer of SiO2. This metal layer covers the entire
channel region and it forms the gate G.
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The metal area of the gate, in conjunction with the insulating oxide layer of SiO 2 and the
semiconductor channel forms a parallel plate capacitor. This device is called the insulated gate FET
because of the insulating layer of SiO2. This layer gives an extremely high input impedance for the
MOSFET.
Operation
If the substrate is grounded and a positive voltage is applied at the gate, the positive charge on G
induces an equal negative charge on the substrate side between the source and drain regions.
The direction of the electric field is perpendicular to the plates of the capacitor through the oxide.
The negative charge of electrons which are minority carriers in the P-type substrate forms an
inversion layer. As the positive voltage on the gate increases, the induced negative charge in the
semiconductor increase. Hence, the conductivity increases and current flows from source to drain
through the induced channel. Thus the drain current is enhanced by the positive voltage as shown in
Fig. 1.51.
DEPLETION MOSFET
The construction of an N-channel depletion MOSFET is shown in Fig. 1.52(a) where an N channel
is diffused between the source and drain to the basic structure of MOSFET.
The circuit symbols for an N-channel and a P-channel depletion MOSFET are shown in Fig. 1.52
(b) and 1.52 (c) respectively.
With VGS = 0 and the drain D at a positive potential with respect to the source, the electrons (majority
carriers) flow through the channel D to S. If the gate voltage is made negative, positive charge
consisting of holes is induced in the channel through SiO2 of the gate channel capacitor. The
introduction of the positive charge causes depletion of mobile electrons on the channel.
Thus a depletion region is produced in the channel. The shape of the depletion region depends on
VGS and VDS. Hence the channel will be wedge shaped as shown in Fig.1.52. When VDS increased,
ID increases and it becomes practically constant at a certain value of VDS, called the Pinch-Off
voltage. The drain current ID almost gets saturated beyond the pinch-off voltage.
Since the current in an FET is due to majority carriers (electrons for an N-type material) the
induced positive charges make the channel less conductive, and ID drops as VGS is made negative.
The depletion MOSFET may also be operated in an enhancement mode. It is only necessary to
apply a positive gate voltage so that negative charges are induced into the N-type channel. Hence
the conductivity of the channel increases and ID increases. As the depletion MOSFET can be
operated with bipolar input signals irrespective of doping of the channel, it is also called as dual
mode MOSFET. The volt ampere characteristics are induced in Fig. 1.51.
The curve of ID versus VGS for constant VDS for is called the transfer characteristics of MOSFET
and is shown in Fig. 1.53.
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Note that V1 is also the voltage at the cathode of the diode in the equivalent circuit with the emitter
terminal open-circuited, the resistor current is IB2.
If the terminal is grounded, the PN -junction is reverse biased and there is a small emitter reverse
current (IEO).
Now consider what happens when the emitter voltage (V EB1) is slowly increased from zero. When
VEBI equals V1, the emitter current is zero. Further increase in VEBI forward-biases the PN-junctions
and causes a forward current (IE) to flow from the p -type emitter into the n-type silicon bar. When
this occurs, charge carriers are injected into the r B1 region. Since the resistance of the semiconductor
material is dependent on doping, the additional charge carriers cause the resistance of the rB1 region
to decrease rapidly. The decrease in resistance reduces the voltage drop across rB1 and so the pn
junction in more heavily forward biased. This in turn results in a greater emitter current and more
charge carriers that further reduce the resistance of the rB1 region. (The process is termed as
regenerative).
The input voltage is pulled down, and the emitter current (IE) is increased to a limit deetrmined by
the VEBI Source resistance. The device remains in this on conditions until the emitter input is open-
circuited or until I is reduced to very low level.
The circuit symbol for a UJT is shown in Fig. 1.54 (c). As always, the arowhead points in the
conventional current direction for a forward-biased junction. In this case it points from the p-type
emitter to n-type bar.
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UJT CHARACTERISTICS
A plot of emitter voltage VEBI versus emitter current IE gives the UJT emitter characteristics. Refer
to the UJT terminal voltage and currents shown in Fig. 1.55 (a) and to the equivalent circuit Fig. 1.55
(b) Note that when VB1B2 = 0, IB2 = 0 and V1 = 0
If VEB1 is now increased from zero, the resultant plot of VEB1 and IE is simply the characteristics of a
forward-biased diode with some series resistance. This is the characteristics for I B2 = 0 in Fig. 1.55
(b).
When VB1B2 is 20 V, the level of V1 might be around 15 V1 depending on the resistance of rB1 and
rB2. With VB1B2 = 20 V and VEBI = 0, the emitter junction is reverse-biased and the emitter reverse
current IEO flows as shown at point 1 on the VB1B2 = 20 V characteristic in Fig. 1.55 (b).
Increasing VEBI until it equals V1 gives IE = 0. A further increase in VEBI biases the emitter junction,
and this gives the peak point on the characteristic. At the peak point, VEBI is identified as the peak
voltage (VP) and Ie is termed the peak current (IP).
Until the peak point VP, the UJT is said to be operating in the cut off region of its characteristics.
When VEBI arrives at the peak voltage, charge carriers are injected from the emitter to decrease the
resistance of rB1.
The device enters the negative region, r B1 falls rapidly to a saturation resistance (rS), and VEB1 falls
to the valley voltage (VV). IE also increases to the valley current (IV) at this time increase in
IE causes the device to enter the saturation region, where the sum of V d and IE X VS.
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36
UNIT II
AMPLIFIERS
INTRODUCTION
An amplifier is defined as the device which increases the magnitude of the input signal
and produces a larger electrical output. The amplifier needs a source of energy for
amplification from battery or de source and filter combination.
The amplifier also has atleast one active device such as BJT, FET or electron tube. This
active device converts the energy from the dc source into the energy at the output of
amplifier.
TYPES OF AMPLIFIERS
If the output signal is directly proportional to the corresponding input signal, then
the amplifier iscalled linear amplifier.
If the output signal is not directly proportional to the input signal, then the amplifier
is called non-linear amplifier.
Linear amplifiers are further classified depending upon the mode of operation i.e.,
the way inwhich the amplifiers operate on the predetermined set of values.
Now let us discuss the operation of small signal amplifiers and analyze its
performance.
Small signal indicates that the input signal is very small in the range of few mV.
The amplifierwhich operates on small signal is called small signal amplifier.
As the input signal is small, the transistor will operate in the linear region of its
transfercharacteristics. So, it is called linear amplifier. The output signal will not have
any distortion.
BIASING
The process of giving proper supply voltages and resistances for obtaining the desired
operating point is known as biasing.
These voltages and resistances results in a set of dc voltage VCEQ and current ICQ to
operate the transistor in the active region. These voltages and currents are called quiescent
values and they determine the operating point or Q-point for the transistor.
Since the operating point is a fixed point on the transistor characteristics, it is also called
as Quiescent point or Q-point. The circuits used for getting the desired and proper
operating point are known as biasing circuits. For faithful reproduction of input signal, the
transistor should be operated in active region. The collector current for CE amplifier is
given by
the variables β, IB and ICO increase with temperatures .For every 10°C increase in
temperature, ICO doubles itself which leads to increase in IC.. This in turn increases power
dissipation and increases ICO.
This in turn cause IC to increase further and becomes cumulative which leads to thermal
runaway. It will destroy the transistor. Also, the Q-point can shift due to change in
temperature and the transistor enter into saturation region.
The transistor should meet the following conditions for good amplification.
1. Emitter base junction must be forward biased and collector base junction must be reverse biased.
circuit,
Substitute VCE = 0
VCE = VCC
So, coordinates of B are VCE = VCC and IC = 0. Thus the dc load line AB can be drawn
if RC and VCC values are known the straight line represented by AB in Fig. is known as
dc load line.
When a value for maximum possible collector current is considered, the point in Y-
axis is known as saturation point. When maximum possible collector emitter voltage is
considered, the point in X axis is known as cut off point.
A line joining saturation point and cutoff point is known as Load Line. It indicates the
output at theload.
The point at which these two lines intersect is known as operating point or Q- point.
The optimum point is located at the midpoint between A and B. The Q point should be
fixed properly. If Q point gets shifted nearer to either A or B, then the output voltage and
current will be clipped and output signal will be distorted.
1. Reverse saturation current, ICO which doubles for every 10°C rise in temperature.
2. Base emitter voltage, VBE which decreases by 2.5mW per degree celcius.
The operating point is selected by drawing dc load line. This point is chosen under
zero input signal condition of the circuit. Therefore ac load line also pass through the
operating point. The effective ac load resistance is given by
VCE (max) locates point D on VCE axis and ICEQ (max) locates point C on IC axis and
ac load line CD is obtained by joining points C and D.
The dc load line is less steep than ac load line as RC > Rac
Stability Factor S
Stability factor helps to indicate the maintenance of operating point i.e it implies the
degree of change in operating point due to change in temperature.
S should be small to have better thermal stability.
S' is defined as the rate of change of IC with VBE, while IC and IBE are kept constant.
S" is defined as the rate of change of IC with β, with ICO and VBE kept constant.
TRANSISTOR BIASING
A common emitter amplifier using fixed bias circuit is shown in Fig. 2.6. The dc
analysis of thecircuit yields the following equation.
Since this equation is independent of current and
t he stabilityfactor is reduced to S = 1 + β
Since β is a large quantity, this is a very poor bias stable circuit. Therefore in practice,
this circuit isnot used for biasing the base.
Advantages
(i) Simplicity
(iii) If the supply voltage is very large as compared to VBE of the transistor, then the
base currentbecomes largely independent of the voltage VBE
A common emitter amplifier using collector to base bias circuit is shown in Fig.2.7. This
circuit isthe simplest way to provide some degree of stabilization to the amplifier
operating point.
If the collector current I C tends to increase due to either increase in temperature or the
transistor has been replaced by the one with a higher β, the voltage drop across Re.
increases, thereby reducing the value of VCE. Therefore, IB decreases which in turn,
compensates the increase in I e. Thus greaterstability is obtained
This value of the stability factor is smaller than the value obtained by fixed bias circuit.
Also S can be made small and the stability can be improved by making R B small or RC
large.
If RC is very small, then S = (β + 1), i.e., stability is very poor. Hence the value of R C must
be quite large for good stabilization. Thus collector-to-base bias arrangement is not
satisfactory for the amplifier circuits like transformer coupled amplifier where the dc load
resistance in collector circuit is very small. For such amplifiers, emitter bias or self bias
will be the most satisfactory transistor biasing for stabilization.
A simple circuit used to establish a stable operating point is the self-biasing configuration.
The self bias, also called as emitter bias, or emitter resistor and potential divider circuit,
that can be used forlow collector resistance, is shown in Fig.2.8.
The current in the emitter resistor RE causes a voltage drop which is in the direction to
reverse bias the emitter junction. For the transistor to remain in the active region the base
emitter junction has to be forward biased. The required base bias is obtained from the
power supply through the potential divider network of the resistance R1 and R2.
Use of Self Bias Circuit as a Constant Current Circuit
Applying Thevenin's theorem to the circuit of Fig. 2.8 for finding the base current, we have
The value of S is equal to one if the ratio RB/RE is very small as compared to 1. As this
ratio becomes comparable to unity, and beyond towards infinity, the value of the stability
factor goes on increasing till S = 1 + β.
This improvement in the stability upto a factor equal to 1 is achieved as the cost of power
dissipation. To improve the stability, the equivalent resistance R B must be decreased,
forcing more current in the voltage divider network of R1 and R2.
Often to prevent the loss of gain due to the negative feedback, RE is shunted by a capacitor
CE. The capacitive reactance XCE must be equal to about one-tenth of the value of the
resistance RE at the lowest operating frequency.
Fig. 2.11 shows the drain-to-gate bias circuit for enhancement mode MOSFET.
This circuit offers the dc stabilization through the feedback resistor Rf. However, the input
resistance is reduced because of Miller effect.
Also the voltage divider biasing technique given for JFET can be used for the
enhancement MOSFET. Here, the dc stability is accomplished by the de feedback through
RS.
But the self bias technique given for JFET cannot be used for establishing an operating
point for the enhancement MOSFET because of the voltage drop across RS is in a direction
to reverse bias the gate and it actually needs forward gate bias.
Fig. 2.12 shows an N- channel enhancement mode MOSFET common source circuit with
source resistor. The gate voltage is
= VDD - VG
Assuming that VGS > VTN and the MOSFET is biased in the saturation region, the drain current is
Here the threshold voltage VTN and conduction parameter KN are functions of
VDS = VDD – ID RD
If VDS > VDS (sat) = VGS – VTN, then the MOSFET is biased in the saturation region. If VDS <
VDS (sat) = VGS – VTN, then the MOSFET is biased in the non saturation region, and the
drain current is given by
Both the self-bias technique and voltage divider bias circuit given for JFET can be used
to establishan operating point for the depletion mode MOSFET.
A transistor can be treated as a two-port network. The voltage and current at port 1
are V1 and i1 and the voltage and current at port 2 are V2 and i2 as shown in Fig. 2.13. Any
two parameters are considered to be independent variables and the other two parameters
are expressed in terms of the independent variables.
Hybrid Parameters
If the input current i1 and the output voltage V2are taken as independent variables, then
the inputvoltage V1 and output current i2 are expressed in terms of i1 and V2.
Since the units of the four parameters are completely different from each other, these
parametersare called hybrid parameters.
The four hybrid parameters h11, h12, h21, h22 are defined as
The units of the h-parameters h11 and h22 are Ω and m ho respectively. h12 and h21 are dimensionless.
As the units of h-parameters are different they are called hybrid parameters. The
values of h-parameters depend upon
1. Transistor type
2. Transistor configuration
3. Operating point
4. Frequency
5. Temperature
Advantages of h-Parameters
The operation of an amplifiers in the mid band region of its frequency response is
analyzed. So it isalso called midband analysis.
Assumptions
i. All the coupling and bypass capacitors are equivalent to short circuit.
ii. All the internal capacitances of the transistor are open circuited.
Steps
iii. Calculate input impedance, output impedance, current gain, voltage gain and power
gain of theamplifier.
ANALYSIS OF CE AMPLIFIER
Step 1: Draw ac equivalent circuit of the amplifier. Table 3.1 shows the ac equivalent
circuit fordifferent elements.
To draw the ac equivalent circuit of the amplifier, the following steps should be followed.
From the ac equivalent circuit, the hybrid equivalent circuit can be obtained as the ac shown in Fig.
2.15. The above Fig.2.15 can also be drawn as in Fig. 2.16 by connecting the common ground.
Input Impedance
Output Impedance
⇒ hfe Ib = 0
So
Voltage Gain
The bypass capacitor 'C' is used to eliminate ac degeneration ie it bypass all ac signal
and increasethe output gain.
i. The coupling capacitor C1 connects the signal source with the transistor base. C2
couples externalload resistor R L to the collector of transistor.
ii. C1 and C2 avoids the loading effect between input and output.
Operation
When the input voltage is increased in positive direction, VBE is increased. Thus
collector currentIC increases, the voltage drop occurs across RC.
Input Impedance
Output Impedence
Current Gain
Load Current
Power Gain
Characteristics of CE Amplifier
ii. Phase inversion i.e., output voltage is 180° out of phase with input
Applications
i. Voltage amplifier
The base terminal is common between the input and output circuit. The input is applied
to emitterterminal and output is taken from the collector terminal.
Construction
The common base amplifier is shown in Fig. 2.19. The potential divider bias is
applied throughresistors R1 and R2.
ii. The signal source is coupled to the transistor emitter through C2.
iii. Capacitor C1 constitutes an ac short circuit from the base terminal to ground. So,
all the inputvoltage appear across base emitter junction.
iv. Capacitor C3 acts as coupling capacitor and it prevents the loading effect due to RC and RL.
Operation
i. During positive half of input signal, the emitter terminal is positive and the base
remains at aconstant potential.
ii. Therefore, a positive - going signal reduces base-emitter voltage VBE which in
turn reducescollector current IC. Thus the voltage drop across the collector resistor also
decreases.
If IC reduces, then VO ≈ VCC and there is no phase shift between the input and output.
i. During negative half cycle of input, the emitter terminal is negative. Thus
forward bias across Base-Emitter junction increases which in turn increases the collector current.
ii. The voltage drop across RC increases ie IC RC > VO. Thus the output voltage (VO =
VCC IC RC)decreases, and the output is negative value.
Input Impedance
Output Impedance
Current Gain
Power Gain
Characteristics of CB Amplifier
Application
The collector terminal is common between the input and output terminals. The input is
applied atthe base and the output is taken across the emitter terminal.
Construction
i. The collector base junction acts as input and emitter base junction acts as output.
ii. The output voltage exactly follows the input voltage variations. Hence it is
called "Emitterfollower" amplifier.
iii. The load resistor RL is capacitor coupled to the emitter terminal of the transistor.
iv. The circuit employs emitter current bias through the voltage divider resistors R1 and R2.
Operation
i. When an ac signal is applied to transistor base via C1, VB is increased and decreased as
the signalvaries from positive to negative voltage variations.
VB – VBE
ii. Thus the output voltage from a common collector circuit is same as its input voltage.
So the CCamplifier has unity voltage gain.
Analysis of Emitter Follower Amplifier
Input Impedance
Substitute
The input impedance is given by
Output Impedance
Voltage Gain
Current Gain
Current gain
Substitute IB value in IE
for CC amplifier RB >> ZB
Power Gain
Characteristics of CC Amplifier
Applications
The small signal model of MOSFET can be obtained similar to JFET. Fig.2.23 shows
the smallsignal equivalent circuit of MOSFET.
Since gate is insulated from channel by gate-oxide, input resistance of transistor is infinite.
i. Small signal parameters are controlled by the Q-point. For the same operating point,
MOSFEThas lower transconductance and an output resistance that is similar to the BJT.
ii. In saturation mode, MOSFET acts as a voltage controlled current source. The control
voltage isVGS an the output current is iD.
Step 2: Calculate the small signal circuit parameters for the MOSFET.
Construction
CC1 and CC2 are the coupling capacitors and the capacitor CS is bypass capacitor. The
capacitancevalues are chosen to be large so that their reactances are very small at the
operating frequency.
Analysis
Fig. 2.25 shows the small signal equivalent circuit for the common source MOSFET amplifier.
We will calculate the input and output impedances, current and voltage gain similar to
BJT andFET.
Input Impedance
Output Impedance
The input impedance of the dependent current source is infinite. Thus output
impedance is writtenas
Voltage Gain
Substitute (2)
Current Gain
At the input,
When RG → ∞, AV = ∞
Properties
i. High input impedance
The input signal is fed at the gate similar to the common source amplifier. The
signal output istaken at the source terminal. The source follower using MOSFET is
shown in the Fig. 2.26.
The small equivalent circuit for source follower MOSFET is shown in Fig 2.27.
Input Impedance
written asRm = RG
Output Impedance
Voltage Gain
Current Gain
The short circuit small-signal AC current gain can be determined as follows, let ig = 0
Properties
i. Non-inverting amplifier
Fig.2.28 shows the high frequency equivalent circuit of CE amplifier. All the coupling
and bypasscapacitors have been assumed to be short circuited and wiring capacitance is
ignored.
The Fig. 2.29, can be simplified using Millers theorem as follows.
The input and output feedback capacitance Cb'c are replaced by the input and output
shuntingcapacitances. Fig. 2.29 shows the modified circuit of CE amplifier.
The Thevenin's imopedance Rth is the impedance looking from B and E. To calculate Rth
asume VS to be short circuited and Ceq is open circuited. Then Thevenin's voltage is
measured as the open circuit voltage measured across B and E.
g ain,
The equivalent circuit of FET amplifier is shown in Fig.2.31. The capacitors Cgs and Cgd
in a JFETare due to reverse biased gate.
i. The capacitance between the source and the gate Cgs is similar to the collector base
capacitanceCb'e and the capacitance between drain and gate is similar to emitter base
capacitance Cb'e
This equivalent circuit can be modified using Miller's Theorem as shown in Fig.2.32.
The Thevenin's equivalnt circuit for the above circuit is obtained as shown in Fig.2.33.
Applying voltage
division rule,The
output voltage,
Applying voltage division rule to the input circuit
The lowest value of ω21, ω22 is selected as upper 3 dB frequency of the amplifier.
2. When input or output impedance is not of correct magnitude for the intended application.
Voltage Gain
The voltage gain of the cascaded amplifier is defined as the product of the individual
voltage gainsof each stage.
The current gain and input impedance of the nth stage is given by
The current gain and the input impedance can be calculated at every stage by
replacing 'n' by thecorresponding stage.
UNIT III MULTISTAGE AMPLIFIERS AND TUNED AMPLIFIERS
Multistage Amplifiers
In practice, we need amplifier which can amplify a signal from a very weak source such
as a microphone, to a level which is suitable for the operation of another transducer suchas
loudspeaker. This is achieved by cascading number of amplifier stages, known as multistage
amplifier
For faithful amplification amplifier should have desired voltage gain, current gain and it should
match its input impedance with the source and output impedance with the load. Many times
these primary requirements of the amplifier cannot be achieved with single stage amplifier,
because of the limitation of the transistor/FET parameters. In such situations more than one
amplifier stages are cascaded such that input and output stages provide impedance matching
requirements with some amplification and remaining middle stages provide most of the
amplification.
We can say that,
• When the input or output impedance is not of the correct magnitude, for a
particular application two or more amplifier stages are connected, in cascade. Such
amplifier, with two or more stages is also known as multistage amplifier.
In many situations it is found very convenient to compare two powers on logarithmic scale
rather than on a linear scale. The unit of this logarithmic scale is called decibel (abbreviated
dB). The number N decibels by which a power P2 exceeds the power P1 isdefined by Decibel,
dB denotes power ratio. Negative values of number of dB means that the power P2 is less than
the reference power P1 and positive value of number of dB meansthe power P2 is greater than
the reference power P1.For an amplifier, P1 may represent input power, and P2 may represent
output power.Both can be given as. Where Ri and Ro are the input and output impedances of
the amplifier respectively. Then,If the input and output impedances of the amplifier are equal
i.e. Ri = Ro= R, thenGain of Multistage Amplifier in dB.
The gain of a multistage amplifier can be easily calculated if the gains of the individual stages
are known in dB, as shown below
Av dB = Av l dB + Av2dB + ... + Av n dB
• It allows us to denote, both very small as well as very large quantities of linear,
scale by considerably small figures.
• Many times output of the amplifier is fed to loudspeakers to produce sound which is
received by the human ear. It is important to note that the ear responds to the sound
intensities on a proportional or logarithmic scale rather than linear scale. Thus use
of dB unit is more appropriate for representation of amplifier gains.
In multistage amplifier, the output signal of preceding stage is to be coupled to the input
circuit of succeeding stage. For this inter stage coupling, different types of coupling
elements can be employed.
RC coupling
Figure shows RC coupled amplifier using transistors. The output signal of first stage is coupled
to the input of the next stage through coupling capacitor and resistive load atthe output
terminal of first stage
Figure: 3 RC coupling
[Source: “Electronic devices and circuits” by “Balbir Kumar, Shail.B.Jain]
The coupling does not affect the quiescent point of the next stage since the coupling capacitor
Cc blocks the d.c. voltage of the first stage from reaching the base of the second stage. The
RC network is broadband in nature. Therefore, it gives a wideband frequency response without
peak at any frequency and hence used to cover a complete A.F amplifier bands. However its
frequency response drops off at very low frequencies due to coupling capacitors and also at
high frequencies due to shunt capacitors such as stray capacitance.
Transformer Coupling
Figure shows transformer coupled amplifier using transistors. The output signal of first stage is
coupled to the input of the next stage through an impedance matching
Frequency response of transformer coupled amplifier is poor in comparison with that anRC
coupled amplifier. Its leakage inductance and inter winding capacitances does not allow
amplifier to amplify the signals of different frequencies equally well. Inter winding
capacitance of the transformer coupled may give rise resonance at certain frequency which
makes amplifier to give very high gain at that frequency. By putting shunting capacitors across
each winding of the transformer, we can get resonance at anydesired RF frequency. Such
amplifiers are called tuned voltage amplifiers. Theseprovide high gain at the desired of
frequency, i.e. they amplify selective frequencies. For this reason, the transformer-coupled
amplifiers are used in radio and TV receivers for amplifying RF signals.
Figure shows direct coupled amplifier using transistors. The output signal of first stage is
directly connected to the input of the next stage. This direct coupling allows the quiescent
d.c. collector current of first stage to pass through base of the next stage, affecting its biasing
conditions.
Cascode amplifier
The cascode amplifier is combination of common-emitter and common-base amplifier. While the
C-B amplifier is known for wider bandwidth than the C-E configuration, the low input impedance
(10s of Ω) of C-B is a limitation for many applications. The solution is to precede the C-B stage
by a low gain C-E stage which has moderately high input impedance (kΩs).
• A common-base configuration is not subject to the Miller effect because the grounded base
shields the collector signal from being fed back to the emitter input. Thus, a C-B amplifier
has better high frequency response.
• The way to reduce the common-emitter gain is to reduce the load resistance. The gain of
a C-E amplifier is approximately RC/re.
• The collector load RC is the resistance of the emitter of the C-B stage loading the C-E
stage.
• CE gain amplifier gain is approximately Av = RC/re=1. This Miller capacitance is
• Cmiller = Ccbo(1-Av) = Ccbo (1-(-1)=2Ccbo.
• We now have a moderately high input impedance C-E stage without suffering the Miller
effect,
but no C-E stage voltage gain.
• The C-B stage provides a high voltage gain.
• The total current gain of cascode is β as current gain of the C-E stage is 1 for the C-B is
β.
• A cascode amplifier has a high gain, moderately high input impedance, a high output
impedance, and a high bandwidth.
The Cascode amplifier circuit using FET is shown below 2.8.1. The input stage
of this amplifier is a common source of FET & the Vin (input voltage) which is
connected to its gate terminal. The output stage of this amplifier is common gate of
FET which is ambitious by the input phase. The drain resistance of the o/p stage is Rd
and the Vout (output voltage) can be taken from the secondary transistor’s drain
terminal.
As the gate terminal of Q2 transistor is grounded, then the source voltage and
the drain voltage of transistors are held almost stable. That means the higher Q2
transistor provides a low i/p resistance toward the lower Q1 transistor. This decreases
the lower transistor’s gain & thus the Miller effect also gets decreased. SO bandwidth
will increase.
• The transistors Q1 and Q2 are matched transistors and hence for such a
matched pair we can assume :
iv) |VCC| = |VEE| and both are measured with respect to ground.
VC = VCC – IC – IC RC …. (8-7.7)
Neglecting the drop across RS, we can say that the voltage at the emitter
of Qi is approximately equal to -VBE. Hence the collector to emitter
voltage is
Key Point : In the equation (8.7.6), the sign of VEE is already considered
to be negative, while deriving it. Hence while using this equation to solve
the problem, only the magnitude of VEE should be used and negative sign
of VEE should not be used again.
Thus for both the transistors, we can determine operating point values,
using equations (8.7.6) and (8.7.8). With the same biasing arrangement, the
d.c. analysis remains same for all the four possible configurations of
differential amplifier.
UNIT - III
TUNED AMPLIFIERS
Resonance circuits
The frequency applied to an LCR circuit causes XL and XC to be equal, and the
circuit is RESONANT. If XL and XC are equal ONLY at one frequency (the
resonant frequency). This fact is the principle that enables tuned circuits in the
radio receiver to select one particular frequency and reject all others.
This is the reason why so much emphasis is placed on XL and X C . figure 1-1
Shows that a basic tuned circuit consists of a coil and a capacitor, connected either
in series, view (A), or in parallel, view (B). The resistance (R) in the circuit is
usually limited to the inherent resistance of the components (particularly the
resistance of the coil).
[Source: Sedra and Smith, ―Micro Electronic Circuits‖; Sixth Edition, Oxford University Press]
Tuned amplifier
✓ Communication circuit widely uses tuned amplifier and they are used in MW
& SW radio frequency 550 KHz – 16 MHz, 54 – 88 MHz, FM 88 – 108 MHz,
cell phones 470 - 990 MHz
✓ Band width is 3 dB frequency interval of pass band and –30 dB frequency
interval
✓ Tune amplifiers are also classified as A, B, C similar to power amplifiers based
on conduction angle of devices.
So imagine a coil, and imagine that we apply a voltage to it. As current starts to
flow, a magnetic field is created. But this means that our coil is in a changing
magnetic field, and this induces a current in the coil. The induced current runs
contrary to the applied current, effectively diminishing it. We have discovered
self-induction. What happens is that the self-induction delays the build-up of
current in the coil, but eventually the current will reach its maximum and stabilize
at a value only determined by the ohmic resistance in the coil and the voltage
applied. We now have a steady current and a steady magnetic field. During the
buildup of the field, energy was supplied to the coil, where did that energy go? It
went into the magnetic field, and as long as the magnetic field exists, it will be
stored there.
Now imagine that we remove the current source. Without a steady current to
uphold it, the magnetic field starts to disappear, but this means our coil is again
in a variable field which induces a current into it. This time the current is in the
direction of the applied current, delaying the decay of the current and the magnetic
field till the stored energy is spent. This can give a funny effect: Since the coil
must get rid of the stored energy, the voltage over it rises indefinitely until a
current can run somewhere! This means you can get a surprising amount of sparks
and arching when coils are involved. If the coil is large enough, you can actually
get an electric shock from a low-voltage source like an ohmmeter.
The most common tuned amplifiers an average person interacts with can be found
in home or portable entertainment equipment, such as FM stereo receivers. An
FM radio has a tuned amplifier that allows listening to only one radio station at a
time. When the knob is turned to change the station, it adjusts a variable
capacitor, inductor, or similar device inside the radio, which alters the inductive
load of the tuned amplifier circuit. This retunes the amplifier to allow a different
specific radio frequency to be amplified so a different radio station can be heard.
CLASSIFICATION:
1. Single tuned amplifier
2. Double tuned amplifier
3. Stagger tuned amplifier
[Source: Sedra and Smith, ―Micro Electronic Circuits‖; Sixth Edition, Oxford University Press]
By proper adjustment of the coupling between the two coils of the two tuned
circuits, the required results (High selectivity, high Voltage gain and required
bandwidth) may be obtained.
Operation:
The high Frequency signal to be amplified is applied to the input terminal of the
amplifier. The resonant Frequency of TUNED CIRCUIT connected in the
Collector circuit is made equal to signal Frequency by varying the value of C1.
Now the tuned circuit L1, C1 offers very high Impedance to input signal
Frequency and therefore, large output is developed across it. The output from the
tuned circuit L1,C1 is transferred to the second tuned circuit L2, C2 through
Mutual Induction. Hence the Frequency response in Double Tuned amplifier
depends on the Magnetic Coupling of L1 and L2
Equivalent circuit of double tuned amplifier:
[Source: Sedra and Smith, ―Micro Electronic Circuits‖; Sixth Edition, Oxford University Press]
This condition is known as critical coupling.
For the values of k<1/Q the peak gain is less than the maximum gain and the
coupling is poor. For the values k> 1/Q, the circuit is overcoupled and the
response shows double peak. This double peak is useful when more bandwidth is
required
The ratio of peak and dip gain is denoted as γ and it represents the magnitude of
the ripple in the gain curve.
Stagger Tuned Amplifiers are used to improve the overall frequency response of
tuned Amplifiers. Stagger tuned Amplifiers are usually designed so that the
overall response exhibits maximal flatness around the centre frequency. It needs
a number of tuned circuits operating in union. The overall frequency response of
a Stagger tuned amplifier is obtained by adding the individual responsetogether.
Since the resonant Frequencies of different tuned circuits are displaced or
staggered, they are referred as STAGGER TUNED AMPLIFIER.
The main advantage of stagger tuned amplifier is increased bandwidth. Its
Drawback is Reduced Selectivity and critical tuning of many tank circuits. They
are used in RF amplifier stage in Radio Receivers.
Analysis:
Gain of the single tuned amplifier:
NEUTRALIZATION METHODS
In tuned RF amplifiers, transistor are used at the frequencies nearer to their
unity gain bandwidths (i.e. fT), to amplify a narrow band of high frequencies
centred around a ratio frequency. At this frequency, the inter junction
capacitance between base and collector, C bc of the transistor becomes
dominant, i.e., its reactance between low enough to be considered, which is
otherwise infinite to be neglected as open circuit. Being CE configuration
capacitance Cbe, shown in the ig. 3.35 come across input and output circuits of
an amplifier. As reactance of Cbc at RF is low enough it provide the feedback path
from collector to base. With this circuit condition, if some feedback signal
manages to reach the input from output in a positive manner with proper phase
shift, then there is possibility of circuit converted to a positive manner with
proper phase shift, then there is possibility of circuit converted to an unstable
one, generating its own oscillations and can stop working as an amplifier. This
circuit will always oscillate if enough energy is fed back from the collector to the
base in the correct phase to overcome circuit losses. Unfortunately, the
conditions for best gain and selectivity are also those which promote oscillation.
In order to prevent oscillations in tuned RF amplifiers it was necessary to reduce
the stage gain to a level that ensured circuit stability. This could be accomplished
in several ways such as lowering the Q of tune circuits; stager tuning, losse
coupling
[Source: Sedra and Smith, ―Micro Electronic Circuits‖; Sixth Edition, Oxford University Press]
between the stages or inserting a ‘loser’ element into the circuit. While all these
methods reduced gain, detuning and Q reduction had detrimental effects on
selectivity. Instead of loosing the circuit performance to achieve stability, the
professor L.A. Hazeltine introduced a circuit in which the troublesome effect o the
collector to base capacitance of the transistor was neutralized by introducing a signal
which cancels the signal coupled through the collector to base capacitance. He
proved that the neutralization can be achieved by deliberately feeding back a portion
of the output signal to the input in such a way that it has the same amplitude as the
unwanted feedback but the opposite phase. Later on many neutralizing circuits were
introduced. Let us study some of these circuits.
Hazeltine Neutralization
The ig. 3.36 shows one variation of the Hazeline circuit. In this circuit a small
value of variable capacitance CN is connected from the bottom of coil, point B,
to the base. Therefore, the internal capacitance Cbc, shown dotted, feeds a signal
from the top end of the coil, point A, to the transistor base and the CN feeds
a signal o equal magnitude but opposite polarity rom the bottom o coil, point B,
to the base. The neutralizing capacitor, C N can be adjusted correctly to
completely nulliy the signal ed through the Cbc.
[Source: Sedra and Smith, ―Micro Electronic Circuits‖; Sixth Edition, Oxford University Press]
Where X= reactance:
Rs= series resistance
Loaded Q:
The loaded Q or QL of a resonator is determined by how tightly the resonator is
coupled to its terminations.
15. What is the effect of cascading n stages of identical single tuned amplifiers
(synchronously tuned) on the overall 3db bandwidth?
The bandwidth of n stage cascaded single tuned amplifier is given as
From the above equation it is clear that the overall 3dB bandwidth reduces.
16. Mention the bandwidth of a double tuned amplifier
23. Derive the resonance frequency for the tank circuit shown:
At resonance XL=XC
24. A tuned circuit has resonant frequency of 1600 KHz and bandwidth of
10 KHz. What is the value of its Q-factor?
25. A tuned amplifier has its maximum gain at a frequency of 2 MHz and
has a bandwidth of 50 KHz.calculate the Q-factor.
Draw the block diagram of negative feed back amplifier and derive the gain (Nov- Dec 2013)
The negative sign at the mixer shows that the output signal is out of phase. So
A=
Af =
We know that X s = Xi + Xf
Af =
Af =
Af =
Af=
Where A is the open loop gain and Af is the closed loop gain.
feedback
Af =
= =
= x
= x
| | = |x
is defined as the fractional change in amplification with feed back divided by the
fractional change without feedback and is called
Sensitivity(S).
D= = =
The above factor explains that the gain of the amplifier depends on the feedback network. Always the
gain with feedback is less than the gain without feedback.
fLf =
fHf =
Therefore Bandwidth =fHf - fLf
= -
4. Draw the topology diagrams for four basic feedback amplifiers.Nov- Dec 2015)
Summary on the feedbavk amplifiers
5. Derive the input impedance and output impedance of voltage series feedback amplifier.
The above topology diagram shows the voltage series feedback amplifier. Input mixer network has
the voltage source and the output sampling network has the voltage taping.
Gain
The gain with negative feedback is
Af = =
WKT, Vf=β Vo
∴Af =
If Vo =AvVi
Af =
∴Af =
To derive the input impedance and output impedance we have to draw the equivalent circuit
Input impedance
To find Vs,
Vs-IiRi –Vf = 0
∴ Vs = IiRi + Vf
WKT Vf =βVo
Vs =IiRi + βAvVi
Vs = IiRi + βAvIiRi,
Rif =
Rif =
Rif = Ri(1+
Output impedance
From the above diagram Rof=
Vo =IoRo + Av Vi
WKT Vi = Vs –Vf
∴Vi = Vf
Vo = IoRo – Avf
=IoRo- A βVo
Vo + A βVo = IoRo
Vo ( 1+βA) = IoRo
6. Derive the input impedance , output impedance and gain of the Transconductance
amplifier.(May-June2015)
Gain
Gmf = =
Vf = βIo
Input impedance
Vs = Vi+ Vf
Vs = Ii Ri + βVo
= Ii Ri + βAVi
= Ii Ri + βAIiRi
Rif = 1 + βGm)
Output impedance
I + βGmIo =
If Io = I I ( 1+ βGm)=
( 1+ βGm)
7. Derive the input impedance , output impedance and gain of the Transresistance
amplifier.(May-June2014)
Gain
Rmf =
Rmf =
Input impedance
Is = Ii+ If
= Ii + βVo
= Ii + βRm Ii
Is = Ii ( 1+ βRm)
Vo = IoRo +Rm Ii
Vo+RmβVo = IoRo
Vo(1+Rmβ) = IoRo
Rof =
8. Derive the input impedance , output impedance and gain of the current amplifier (May-
June2013)
Gain
Aif =
Aif =
Input impedance
Output impedance
Io = A Ii + = -A If + (∵If = - Ii)
Io +Aβ Io =
Rof = Ro ( 1+ Aβ)
A negative feedback amplifier is designed for a particular frequency and this may cause
distortion or oscillations for some other frequency ranges. Stability problem arises in feedback
amplifiers, if the loop gain has more than two poles. The disturbance will be increasing
exponentially with time. To avoid this problem, the poles of the transfer function must lie on the
left hand side of the complex frequency plane.
Locus of =1
Figure shows the locus of =1. It is a circle of unit radius, with the center -1+j0. If the
feedback is positive of 1 and if it is negative 1.
The system poles are the roots of denominator of H(s). The system zeroes are the roots of
numerator of H(s). The poles depend on Aβ . Nyquist plot is used to check the stability of the
feedback amplifiers. It depends on whether the poles lie in the left or on the right to define stable
and unstable respectively.
If T(j is a real number the phase angle will be 180ͦ . Then the closed loop gain becomes
= .Then the amplifier will work as an oscillator. With negative feedback the
poles shift towards left and the closed loop gain becomes 1+Aβ and maintains stability.
Therefore single pole amplifier is always stable. In the case of two poles the system tries to
maintain to be stable, and in the case of more than two the poles the system will to enter in to
the right hand side and can’t be stable.
To make the system stable we have to apply frequency compensation techniques.
A(s) =
The break frequency is f = . Depending the value of the capacitor the frequency will be
compensated.
WKT V =Vs+Vf
Af=Vₒ/Vi-Vf
WKT Vf=βVₒ
Af=Vₒ/Vi-βVₒ
divide throughout by Vi
Af = Vₒ/Vi
Vi/Vi - βVₒ/Vi
=A/1-βA.
To fix positive feedback,the amplifier should be a non inverting amplifier ,otherwise if the amplifier is
an inverting amplifier amplifier,the feedback network will provide a phase reversal so the at the input
the circuit will have 0 degree or 360 degree phase.
if A=Vₒ/Vi
Vₒ=AVi
Vf=-βVₒ
=-βAVi
Vi=-βAVi
Vi/Vi=-βA
-βA=1
βA=-1
if the above condition is satisfied ,the circuit can work under Barkhausen condition.
1. Aβ = 1
2. closed loop gain zero degree or360 degree.
2. Explain RC phase shift oscillator with a neat diagram:(Nov-Dec2016)
Z=R-jXc
=tan⁻1 (XC/R)
V₁/Vₒ =R₁/R₁+1/j
=j R₁C₁/1+j R₁C₁
similarly,
=(j RC/1+j
if C₁=C₂=C₃ and
R₁=R₂=R₃
V₁/Vₒ=V₂/V₁=Vₓ/V₂=j /1+j
Ib(R+1/j C+R)-I₁R=0 ①
hfeIbRC-I₁R+(R+RC+1/j )I₂=0
= + (3+hfe)-(5R+RC)/ +j[1/ -6 =0
1/ =6 +4R /
from the above equation,
fₒ=1/2
=0
hfe=-29R/RC+23+4RC/R
if K= /R
hfe=23-29/K+4K
ADVANTAGES:
1. Simplecircuitry
DISADVANTAGES:
2. Poor stability
3. Draw the circuit diagram of Wein bridge oscillator and derive the frequency of
oscillation.(Nov-Dec2015)
It is also a RC oscilolator. To derive the frequency of oscillations
I=
Vf = I Z2
= =
2+
If R1 = R2 and C1 = C2
when power is ON the positive feedback helps tobuild oscillations.it can set oscillations only at
fr(resonance frequency) and on other frequencies the circuit set negative feedback .it has resonance
frequency same like RC phase shift
f=1/2 RC
On simplifying ZL =
The Hartley oscillator is having two inductors and a capacitor in the feedback path with the capacitor
in the feedback path with the amplifier
hie(Z₁+Z₂+Z₃)=(1+hfe)Z₁Z₂+Z₁Z₃=0
-hfe
on equating imaginary part to 0,
f=1/2
-hfe
hfe=L₁/L₂= .
7. Draw the circuit for Colpits oscillator and derive the frequency of oscillations.Nov-Dec2011)
hie
and on simplifying
8. Draw a neat diagram for Clapp oscillator and derive the condition for oscillation?(May-
June2016)
The addition of c₃ in the feedback network improves the stability of oscillation .it also eliminates the
stray capacitance effect.
hie(Z₁+Z₂+Z₃)+(1+hfe)Z₁Z₂+Z₁Z₃=0
-hfeZ₁Z₂+Z₁Z₂+Z₁Z₃=0
- - .j -j/ =0
on simplifing,
hfe+1/c₂=1/c₁+1/c₂
hfe=c₂/c₁
Equivalent Circuit
CM-mounting cap when Cm vibrates it gives the internal friction R,intertia L and stiffness C
f=1/2 . /1+
Q=
when + approaches to 1
fr=1/2
1. series resonating(fs)
2. parallel resonating(fp)
where fs=1/2
fp=1/2
Ceq=Cm.c/Cm+c
Crystals exhibit piezoelecric effect .under the influence of mechanical pressure,the crystal vibrates,and
the equivalent voltages against the vibration getsgenerated across the against the vibration gets generated
across the opposite faces .the resonating frequency depends on the cutof the crystal. The types are
The common LC oscillator can be converted into crystal oscillator if the crystal is used. The resulting
circuit frequency is set by the series resonant frequency of the circuit. The change in temperature have
no effect on the operating frequency and hence good stability is maintained .
On simplifying
Where
To determine the stability of a system using the Nyquist stability criterion, you can analyze the Nyquist
plot for encirclements of the critical point -1+j0.
Nyquist stability criterion states the number of encirclements about the critical point (1+j0) must be
equal to the poles of characteristic equation, which is nothing but the poles of the open loop transfer
function in the right half of the 's' plane.
EC 3353 ELECTRO DEVICES AND CIRCUITS
UNIT 5
Class A amplifier
It is similar to a fixed bias circuit. The load resistance RL is replaced by a speaker. The
current flow is for 360°. Q point is placed at the center of the load line. The efficiency is
calculated as
But Vm =
Transformer coupled class A amplifier
But
Efficiency η =
If Vm = VCC
= 78.5%
This circuit consists of drivers, bias circuit and power amplification using MOSFET
with class AB amplifier MOSFET is preferred over BJT because of its simple drive
circuit, less susceptibility to thermal stability and high input impedance.
It consists of two VBE multipliers formed by transistors Q5 and Q6 with their
associated resistors. Q6 is connected in direct thermal contact with the output
transistors by connecting Q6 on their common heat sink. The bias voltage VGG can be
reduced by selecting VBE multiplication factor of Q6 appropriately so VBE
decreases with temperature same rate as that of sum of threshold voltages |Vin|
+ |Vtp| of output MOSFET. Thus quiescent current of output transistors is stabilized
against temperature variations.
DRIVER CIRCUIT
VGG is given by
The other VBE multiplier is adjusted to field the value of VGG required for the desired
quiescent current in QN and QP.
The Class AB amplifier using MOSFET is known as Hi-fi amplifier circuit and is
suitable for applications such as keyboard amplifiers, general purpose amplifiers,
guitar amplifiers and subwoofer amplifiers.
Temperature Effect
With power transistors, a designer often uses a heat sink to get a high power
rating for the transistor. As already mentioned, the heat sink allows the
internally generated heat to escape more easily from the transistor. This reduces
the junction temperature, equivalent to increase the maximum power rating.
The heat developed at the collector-base junction of a transistor must flow from
the junction to the transistor case, then from the case to the heat sink, and finally
from heat sink to the surrounding air. Each portion of the path that the heat must
pass through has a thermal resistance. These thermal resistances are θ jC
(junction to case), θCS (case to sink), and θSA (sink to air).
Thermal equivalent circuit for the transistor and heat sink is depicted in Fig.
12.59. This consists of the three thermal resistances connected in series. The
size of heat sink required for a transistor with given power dissipation,
PD may be determined from the thermal equivalent circuit. The temperature
difference between the transistor collector-base junction and the air surrounding
the heat sink (Tj – TA) causes the dissipated power (PD) to flow through each of
the thermal resistances in series.
Power flow,
The rate at which heat is released at the collector junction must not exceed the
rate at which the heat can be dissipated under steady-state condition
The condition required to avoid the thermal runaway is given below :
The rate at which heat is released at the collector junction must not exceed the
rate at which the heat can be dissipated under steady-state condition
The condition expressed by Eq. (12.53) is the condition which must be satisfied
to avoid thermal runaway. By suitable design, it is possible to ensure that the
transistor cannot runaway before a specified ambient temperature or even under
any condition.
DC/DC Converters
Dc-dc power converters are employed in a variety of applications, including power supplies for personal
computers, office equipment, spacecraft power systems, laptop computers, and telecommunications
equipment, as well as dc motor drives. The input to a dc-dc converter is an unregulated dc voltage Vg. The
converter produces
a regulated output voltage V, having a 1 + L +
vs(t) is equal to Vg when the switch is in position 1, and is equal to zero when the switch is in position 2. The
switch position is varies periodically, such that vs(t) is a rectangular waveform having period Ts and duty cycle
D. The duty cycle is equal to the fraction of time that the switch is connected in position 1, and hence 0 c D c 1.
The switching frequency f s is equal to 1/Ts.
1: Magnetic Converters
In these DC-to-DC Converters, energy is periodically stored and released from a magnetic
field in an inductor or a transformer. The frequency ranges from 300 kHz to 10MHz. By
maintaining the duty cycle of the charging voltage the amount of power that needs to be
transferred continuously to a load can be more easily controlled.
Moreover, the control can also be applied to the input current, the output current or to
maintain constant power through the circuit. The transformer-based converter can easily
provide the isolation between input and output.
2: Non-Isolated Converters
Non-isolated converters are mostly used when the change in the voltage is comparatively
small. It posses the input and output terminal to a common ground. The major disadvantage
is that it cannot provide protection from high electrical voltages and it poses more noise.
3: Step-down/Buck Converters
In a typical non-isolated step-down or buck converter the output voltage VOUT depends on
the input voltage VIN and the switching duty cycle D of the power switch.
4: Step-up/Boost Converters
It is used to boost DC to DC converter voltage and it uses the same number of passive
components but arranged to step up the input voltage so that the output is higher than that
of the input.
5: Buck-Boost Converters
This converter allows the input DC voltage to be either stepped-up or stepped-down,
depending on the duty cycle.
The output voltage is given by the relation as mentioned below:
Advantages
• It simplifies the power supply systems in the circuit.
• It provides isolation in the primary and secondary circuits from each other.
• It provides a technique to extend potential (voltage) as required.
• It is available as a hybrid circuit with all elements in a single chip.
• It is also used in the regulation and control of DC voltage.
• The output is well organized as positive or negative.
• Battery space can be reduced by using a converter.
Disadvantages
• Switching converters lead to more noise.
• They are expensive as an external circuit is required.
• Choppers are inadequate due to unsteady voltage and current supply.
• More ripple current, More input and output capacitance, higher losses, etc.
From the above expression, we can notice that the output voltage is always reversed in
polarity with respect to the input. Therefore, a buck-boost converter is also known as a
voltage inverter.