EE503 IC FABRICATION AND
PACKAGING TECHNOLOGY
CHAPTER 1
COURSE LEARNING OUTCOMES
CLO 1 :
Describe clearly the integrated circuit technology evolution and MicroElectromechanical System (MEMS) concept. (C1)
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WHAT IS ICS?
A complete circuit that usually built on a semiconductor substrate having the same functions with the circuit on PCB in a very small package where the circuit may be a complex circuit consisting of a combination of several tens / hundreds / thousands to the millions of components.
PCB Printed Circuit Board
PCB board
A Die inside an IC
MAIN FUNCTIONS OF ICS
- Missile system, - Military Areas - TV / Radio / Video, - Computer - Work Station - Server - Equipment Toys children - Mobile Phone - Telecommunications System - Robotic System - Digital Clock - Field of Aerospace - Medical Field
An Osborne Executive portable computer, from 1982 with a Zilog Z80 4MHz CPU, and a 2007 Apple iPhone with a 412MHz ARM11 CPU. The Executive weighs 100 times as much, is nearly 500 times as large by volume, costs approximately 10 times as much (inflation adjusted), and has 1/100th the clock frequency of the phone.
DISCRETE COMPONENT VS IC
An elementary (basic) electronic device constructed as a single unit. Before the advent (start) of integrated circuits (chips), all transistors, resistors, capacitors and diodes were discrete (Individually separate). Discrete components are widely used in amplifiers and other electronic products that use large amounts of current. On a circuit board, they are intermingled (bercampur) with the chips, and there is hardly any electronic product that does not have at least one or two discrete resistors or capacitors
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THE ADVANTAGES OF ICS OVER DISCREET
COMPONENTS Very small size Very low weight Fast operating Low cost Low power consumption High reliability Repair work easier Easy replacement
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Giga Large Scale (GSI)
2000 above
more than 10 million
MOORES LAW
Moore's law is the observation that over the history of computing hardware, the number of transistors on integrated circuits doubles approximately every two years.
The law is named after Intel co-founder Gordon E. Moore, who described the trend in his 1965 paper. The paper noted that the number of components in integrated circuits had doubled every year from the invention of the integrated circuit in 1958 until 1965 and predicted that the trend would continue "for at least ten years".
MICROPROCESSOR
IC FABRICATION METHODS
MONOLITHIC FILM HYBRID
IC FABRICATION METHODS
MONOLITHIC
All components (active and passive) is produced on a silicon chip (wafer). The most popular use - low cost high reliability
Weakness The weakness of isolation Limited range of passive components Circuit design is not flexible
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
FILM
Formed on a chip components such as ceramic or glass insulators Only passive components Wider range of components Less problem of isolation Active components can be added externally, - more flexible design
Weakness Higher cost Not suitable for active components
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
HYBRID
Combination of two or more chips Combination of film and monolithic fabrication method Active component formed by monolithic method Passive components formed by film method The most flexible design Often used as a prototype of a monolithic integrated circuit
Weakness The cost is too high Less reliability
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
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COMPARATIVE CHARACTERISTICS OF THE FABRICATION TECHNOLOGIES OF INTEGRATED CIRCUITS
Active component: produce new signal from input signal ( transistor, diod) Passive component: can be used to send signal from one part to another part. ( resistor, capacitor, inductor)
TRANSISTOR TYPES
transistor
BJT
FET
IIL
JFET
TTL
MOSFET
NPN
PNP
PMOS
NMOS
CMOS
BiCMOS
BASIC COMPONENTS MOS ( METAL OXIDE SEMICONDUCTOR )
The Types Of MOS Transistor PMOS NMOS
advantages: The cost of cheap manufacture. simple fabrication methods. weaknesses: Operation of the circuit delay Movement of hole current 2x slower than the electrons.
advantages: smaller size compared to pMOS. fast operating speed compared to pMOS
weaknesses: difficult to make
advantages: low power dissipation. High Reliability. better performance.
weaknesses: The size are larger of the pMOS and nMOS. involve more steps during the fabrication process. more silicon area required to build p-wells. The false switching or "latching" if not carefully designed due to parasitic bipolar effects and structure of four layers NPNP.
BASIC COMPONENTS BIPOLAR TRANSISTOR
TTL( Transistor-transistor Logic ) NPN PNP
advantages: high switching speed. Input provide more functionality.
weaknesses: Requires a wide area during the fabrication of silicon.
BICMOS (BIPOLAR + CMOS)
advantages:
high operating speed. low power dissipation
weaknesses: The size of chip large a complex fabrication process. The cost of making expensive
ICS CLASSIFICATION :
ICs can be classify based on their types of application:
Analog circuit digital circuit mixed signal circuit (both analog and digital on the same chip).
Analog ICs
Analog
ICs, such as sensors, power management circuits, and operational amplifiers, work by processing continuous signals. They perform functions like amplification, active filtering, demodulation, and mixing. Analog ICs ease the burden on circuit designers by having expertly designed analog circuits available instead of designing a difficult analog circuit from scratch.
DIGITAL ICS
Digital ICs can contain anything from one to millions of logic gates, flip-flops, multiplexers, and other circuits in a few square millimeters. The small size of these circuits allows high speed, low power dissipation, and reduced manufacturing cost compared with board-level integration. These digital ICs, typically microprocessors, DSPs, memory and micro controllers, work using binary mathematics to process "one" and "zero" signals.
MIXED SIGNAL ICS
ICs can also combine analog and digital circuits on a single chip to create functions such as A/D converters and D/A converters. Such circuits offer smaller size and lower cost, but must carefully account for signal interference.
