INTEGRATED CIRCUITS

DATA SHEET

TDA1517; TDA1517P 2 x 6 W stereo power amplifier

Product specication Supersedes data of 2002 Jan 17 2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

FEATURES Requires very few external components High output power Fixed gain Good ripple rejection Mute/standby switch AC and DC short-circuit safe to ground and VP Thermally protected Reverse polarity safe Capability to handle high energy on outputs (VP = 0 V) No switch-on/switch-off plop Electrostatic discharge protection. QUICK REFERENCE DATA SYMBOL VP IORM Iq(tot) Isb Isw |ZI| Po SVRR cs Gv Vno(rms) Tc PARAMETER supply voltage repetitive peak output current total quiescent current standby current switch-on current input impedance output power supply voltage ripple rejection channel separation closed loop voltage gain noise output voltage (RMS value) crystal temperature RL = 4 ; THD = 0.5% RL = 4 ; THD = 10% fi = 100 Hz to 10 kHz CONDITIONS 50 48 40 19

TDA1517; TDA1517P
GENERAL DESCRIPTION The TDA1517 is an integrated class-B dual output amplifier in a plastic single in-line medium power package with fin (SIL9MPF), a plastic rectangular-bent single in-line medium power package with n (RBS9MPF) or a plastic heat-dissipating dual in-line package (HDIP18). The device is primarily developed for multi-media applications.

MIN. 6.0

TYP. 14.4 40 0.1 5 6 20 50

MAX. 18.0 2.5 80 100 40 21 150

UNIT V A mA A A k W W dB dB dB V C

ORDERING INFORMATION PACKAGE TYPE NUMBER NAME TDA1517/N3 TDA1517/N3/S5 TDA1517P SIL9MPF RBS9MPF HDIP18 DESCRIPTION plastic single in-line medium power package with n; 9 leads plastic rectangular-bent single in-line medium power package with n; 9 leads plastic heat-dissipating dual in-line package; 18 leads VERSION SOT110-1 SOT352-1 SOT398-1

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

BLOCK DIAGRAM

TDA1517; TDA1517P

handbook, full pagewidth

non-inverting input 1

1 60 k

mute switch

Cm

4 VA 2 k 18 k power stage

output 1

VP 8 stand-by switch VA 15 k x1 supply voltage ripple rejection output 3 15 k mute reference voltage 18 k mute switch stand-by reference voltage mute/stand-by switch input

TDA1517

2 k non-inverting input 2 VA 9 60 k input reference voltage mute switch signal ground 2 SGND 7 VP Cm power stage power ground 5 (substrate)
MLC351

output 2

PGND

Fig.1 Block diagram.

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

PINNING SYMBOL INV1 SGND SVRR OUT1 PGND OUT2 VP M/SS INV2 PIN 1 2 3 4 5 6 7 8 9 non-inverting input 1 signal ground

TDA1517; TDA1517P

DESCRIPTION

supply voltage ripple rejection output output 1 power ground output 2 supply voltage mute/standby switch input non-inverting input 2

handbook, halfpage

INV1 SGND SVRR OUT1 PGND OUT2 VP M/SS INV2

1 2 3 4 5 6 7 8 9
MLC352

handbook, halfpage

INV1 SGND SVRR OUT1

1 2 3 4 5 6 7 8 9
MLC353

18 17 16 15 TDA1517P 14 13 12 11 10

TDA1517

PGND OUT2 VP M/SS INV2

Pins 10 to 18 should be connected to GND or floating.

Fig.2

Pin configuration for SOT110-1 and SOT352-1.

Fig.3 Pin configuration for SOT398-1.

FUNCTIONAL DESCRIPTION The TDA1517 contains two identical amplifiers with differential input stages. The gain of each amplifier is fixed at 20 dB. A special feature of the device is the mute/standby switch which has the following features: Low standby current (<100 A) Low mute/standby switching current (low cost supply switch) Mute condition. 2004 Feb 18 4

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

LIMITING VALUES In accordance with the Absolute Maximum Rating System (IEC 60134). SYMBOL VP VP(sc) VP(r) ERGO IOSM IORM Ptot Tstg Tamb Tc PARAMETER supply voltage AC and DC short-circuit safe voltage reverse polarity energy handling capability at outputs non-repetitive peak output current repetitive peak output current total power dissipation storage temperature operating ambient temperature crystal temperature see Fig.4 VP = 0 V CONDITIONS operating no signal

TDA1517; TDA1517P

MIN. 55 40

MAX. 18 20 18 6 200 4 2.5 15 +150 +85 150 V V V V

UNIT

mJ A A W C C C

THERMAL RESISTANCE SYMBOL Rth(j-c) Rth(j-p) Rth(j-a) TYPE NUMBER TDA1517/N3; TDA1517/N3/S5 TDA1517P PARAMETER thermal resistance from junction to case thermal resistance from junction to pins VALUE 8 15 50 UNIT K/W K/W K/W

TDA1517/N3; TDA1517/N3/S5; thermal resistance from junction to TDA1517P ambient

handbook, halfpage

18

MLC354

P (W) 12 (1)

(2) 6

0 25 0 50 100 150 o T amb ( C)

(1) Rth j-c = 8 K/W. (2) Rth j-p = 15 K/W.

Fig.4 Power derating curve.

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

DC CHARACTERISTICS VP = 14.4 V; Tamb = 25 C; measured in Fig.6; unless otherwise specied. SYMBOL Supply VP Iq(tot) VO V8 VO Isb Vsw Note supply voltage total quiescent current DC output voltage note 1 PARAMETER CONDITIONS

TDA1517; TDA1517P

MIN.

TYP.

MAX.

UNIT

6.0

14.4 40 6.95 12

18.0 80 2

V mA V

Mute/standby switch switch-on voltage level see Fig.5 8.5 V

Mute condition output signal in mute position VI(max) = 1 V; fi = 20 Hz to 15 kHz mV A A

Standby condition DC current in standby condition switch-on current 100 40

1. The circuit is DC adjusted at VP = 6 to 18 V and AC operating at VP = 8.5 to 18 V.

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

TDA1517; TDA1517P

AC CHARACTERISTICS VP = 14.4 V; RL = 4 ; f = 1 kHz; Tamb = 25 C; measured in Fig.6; unless otherwise specied. SYMBOL Po THD flr fhr Gv SVRR PARAMETER output power total harmonic distortion low frequency roll-off high frequency roll-off closed loop voltage gain supply voltage ripple rejection on mute standby |Zi| Vno input impedance noise output voltage on on mute cs |Gv| Notes 1. Output power is measured directly at the output pins of the IC. 2. Frequency response externally fixed. 3. Ripple rejection measured at the output with a source impedance of 0 , maximum ripple amplitude of 2 V (p-p) and a frequency between 100 Hz and 10 kHz. 4. Noise voltage measured in a bandwidth of 20 Hz to 20 kHz. 5. Noise output voltage independent of Rs (VI = 0 V). channel separation channel unbalance Rs = 0 ; note 4 Rs = 10 ; note 4 note 5 Rs = 10 40 50 70 50 0.1 100 1 V V V dB dB note 3 48 48 80 50 60 75 dB dB dB k CONDITIONS THD = 0.5%; note 1 THD = 10%; note 1 Po = 1 W at 3 dB; note 2 at 1 dB 4 5.5 20 19 MIN. 5 6.0 0.1 45 20 TYP. 21 MAX. UNIT W W % Hz kHz dB

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

TDA1517; TDA1517P

handbook, halfpage

18 V11 (V)

8.5 6.4

3.3 2 0

,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,, ,,,,,,,

MLC355

ON (IP = 40 mA)

mute (IP = 40 mA)

standby (I P

100 A)

Fig.5 Standby, mute and on conditions.

APPLICATION INFORMATION

handbook, full pagewidth

standby switch 100 F 3 input reference voltage internal 1/2 V P 8 7 VP 100 nF 2200 F

TDA1517
220 nF input 1 60 k 1 20 dB 20 dB 60 k 9 220 nF input 2

5 1000 F

6
MLC356

signal ground

power ground

1000 F

Fig.6 Application circuit diagram.

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

PACKAGE OUTLINES
SIL9MPF: plastic single in-line medium power package with fin; 9 leads

TDA1517; TDA1517P

SOT110-1

D1 q P P1 A2

A3 q1 q2

A A4

seating plane

E pin 1 index

L 1 Z b2 e b b1 w M 9 Q

5 scale

10 mm

DIMENSIONS (mm are the original dimensions) UNIT mm A 18.5 17.8 A2 max. 3.7 A3 8.7 8.0 A4 15.8 15.4 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (1) 21.8 21.4 D1 21.4 20.7 E (1) 6.48 6.20 e 2.54 L 3.9 3.4 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 w 0.25 Z (1) max. 1

Note 1. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT110-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION

ISSUE DATE 95-02-25 03-03-12

2004 Feb 18

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

TDA1517; TDA1517P

RBS9MPF: plastic rectangular-bent single in-line medium power package with fin; 9 leads

SOT352-1

L 1 Z b2 e b b1 w M 9

D1 q P P1 Q A2

A3 q1 q2

A E pin 1 index c

seating plane v M 0 5 scale DIMENSIONS (mm are the original dimensions) UNIT A (1) mm 14.45 13.95 A2 max. 3.7 A3 8.7 8.0 b 1.40 1.14 b1 0.67 0.50 b2 1.40 1.14 c 0.48 0.38 D (2) 21.8 21.4 D1 21.4 20.7 E (2) 6.48 6.20 e 2.54 L 3.8 3.3 P 2.75 2.50 P1 3.4 3.2 Q 1.75 1.55 q 15.1 14.9 q1 4.4 4.2 q2 5.9 5.7 v 0.6 w 0.25 Z (2) max. 1 10 mm

Notes 1. Dimension is specified at seating plane. 2. Plastic or metal protrusions of 0.25 mm maximum per side are not included. OUTLINE VERSION SOT352-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION

ISSUE DATE 97-12-16 03-03-12

2004 Feb 18

10

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

TDA1517; TDA1517P

HDIP18: plastic heat-dissipating dual in-line package; 18 leads

SOT398-1

ME

seating plane

A2

A1 L

b1 b b2 10

w M

c (e 1) MH

18

pin 1 index E

5 scale

10 mm

DIMENSIONS (inch dimensions are derived from the original mm dimensions) UNIT mm inches A max. 4.7 0.19 A1 min. 0.51 0.02 A2 max. 3.7 0.15 b 1.40 1.14 0.06 0.04 b1 0.67 0.50 0.03 0.02 b2 1.05 0.75 0.04 0.03 c 0.47 0.38 0.02 0.01 D (1) 21.85 21.35 0.87 0.84 E (1) 6.5 6.2 0.26 0.24 e 2.54 0.1 e1 7.62 0.3 L 3.9 3.1 0.15 0.12 ME 8.32 8.02 0.33 0.32 MH 8.7 7.7 0.34 0.30 w 0.25 0.01 Z (1) max. 1 0.04

Note 1. Plastic or metal protrusions of 0.25 mm (0.01 inch) maximum per side are not included. OUTLINE VERSION SOT398-1 REFERENCES IEC JEDEC JEITA EUROPEAN PROJECTION

ISSUE DATE 95-01-25 03-02-13

2004 Feb 18

11

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

SOLDERING Introduction to soldering through-hole mount packages This text gives a brief insight to wave, dip and manual soldering. A more in-depth account of soldering ICs can be found in our Data Handbook IC26; Integrated Circuit Packages (document order number 9398 652 90011). Wave soldering is the preferred method for mounting of through-hole mount IC packages on a printed-circuit board. Soldering by dipping or by solder wave Driven by legislation and environmental forces the worldwide use of lead-free solder pastes is increasing. Typical dwell time of the leads in the wave ranges from 3 to 4 seconds at 250 C or 265 C, depending on solder material applied, SnPb or Pb-free respectively.

TDA1517; TDA1517P
The total contact time of successive solder waves must not exceed 5 seconds. The device may be mounted up to the seating plane, but the temperature of the plastic body must not exceed the specified maximum storage temperature (Tstg(max)). If the printed-circuit board has been pre-heated, forced cooling may be necessary immediately after soldering to keep the temperature within the permissible limit. Manual soldering Apply the soldering iron (24 V or less) to the lead(s) of the package, either below the seating plane or not more than 2 mm above it. If the temperature of the soldering iron bit is less than 300 C it may remain in contact for up to 10 seconds. If the bit temperature is between 300 and 400 C, contact may be up to 5 seconds.

Suitability of through-hole mount IC packages for dipping and wave soldering methods SOLDERING METHOD PACKAGE DIPPING CPGA, HCPGA DBS, DIP, HDIP, RDBS, SDIP, SIL PMFP(2) Notes 1. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board. 2. For PMFP packages hot bar soldering or manual soldering is suitable. suitable suitable suitable(1) not suitable WAVE

2004 Feb 18

12

Philips Semiconductors

Product specication

2 x 6 W stereo power amplier

DATA SHEET STATUS LEVEL I DATA SHEET STATUS(1) Objective data PRODUCT STATUS(2)(3) Development

TDA1517; TDA1517P

DEFINITION This data sheet contains data from the objective specication for product development. Philips Semiconductors reserves the right to change the specication in any manner without notice. This data sheet contains data from the preliminary specication. Supplementary data will be published at a later date. Philips Semiconductors reserves the right to change the specication without notice, in order to improve the design and supply the best possible product. This data sheet contains data from the product specication. Philips Semiconductors reserves the right to make changes at any time in order to improve the design, manufacturing and supply. Relevant changes will be communicated via a Customer Product/Process Change Notication (CPCN).

II

Preliminary data Qualication

III

Product data

Production

Notes 1. Please consult the most recently issued data sheet before initiating or completing a design. 2. The product status of the device(s) described in this data sheet may have changed since this data sheet was published. The latest information is available on the Internet at URL http://www.semiconductors.philips.com. 3. For data sheets describing multiple type numbers, the highest-level product status determines the data sheet status. DEFINITIONS Short-form specification The data in a short-form specification is extracted from a full data sheet with the same type number and title. For detailed information see the relevant data sheet or data handbook. Limiting values definition Limiting values given are in accordance with the Absolute Maximum Rating System (IEC 60134). Stress above one or more of the limiting values may cause permanent damage to the device. These are stress ratings only and operation of the device at these or at any other conditions above those given in the Characteristics sections of the specification is not implied. Exposure to limiting values for extended periods may affect device reliability. Application information Applications that are described herein for any of these products are for illustrative purposes only. Philips Semiconductors make no representation or warranty that such applications will be suitable for the specified use without further testing or modification. DISCLAIMERS Life support applications These products are not designed for use in life support appliances, devices, or systems where malfunction of these products can reasonably be expected to result in personal injury. Philips Semiconductors customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify Philips Semiconductors for any damages resulting from such application. Right to make changes Philips Semiconductors reserves the right to make changes in the products including circuits, standard cells, and/or software described or contained herein in order to improve design and/or performance. When the product is in full production (status Production), relevant changes will be communicated via a Customer Product/Process Change Notification (CPCN). Philips Semiconductors assumes no responsibility or liability for the use of any of these products, conveys no licence or title under any patent, copyright, or mask work right to these products, and makes no representations or warranties that these products are free from patent, copyright, or mask work right infringement, unless otherwise specified.

2004 Feb 18

13

Philips Semiconductors a worldwide company

Contact information For additional information please visit http://www.semiconductors.philips.com. Fax: +31 40 27 24825 For sales ofces addresses send e-mail to: [email protected].

Koninklijke Philips Electronics N.V. 2004

SCA76

All rights are reserved. Reproduction in whole or in part is prohibited without the prior written consent of the copyright owner. The information presented in this document does not form part of any quotation or contract, is believed to be accurate and reliable and may be changed without notice. No liability will be accepted by the publisher for any consequence of its use. Publication thereof does not convey nor imply any license under patent- or other industrial or intellectual property rights.

Printed in The Netherlands

R30/05/pp14

Date of release: 2004

Feb 18

Document order number:

9397 750 12926