Thanks to visit codestin.com
Credit goes to www.scribd.com

Scribd
Upload
111 views22 pages

Microfabrication & Lithography Basics

This document discusses microfabrication techniques used in MEMS. It begins with an introduction to microfabrication and overview of common microfabrication steps such as cleaning, oxidation, deposition, etching, and lithography. It then focuses on lithography, explaining that it is the pattern transfer process from mask to wafer using light or other radiation. It describes optical lithography and photolithography in detail, including the photoresist materials used, exposure methods, and developing processes for positive and negative resists. It also discusses parameters that impact lithography such as wavelength of light and feature size. Other high resolution lithography techniques such as electron beam, x-ray and ion beam lithography are also mentioned.

Uploaded by

Gopinath Chakraborty
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
111 views22 pages

Microfabrication & Lithography Basics

This document discusses microfabrication techniques used in MEMS. It begins with an introduction to microfabrication and overview of common microfabrication steps such as cleaning, oxidation, deposition, etching, and lithography. It then focuses on lithography, explaining that it is the pattern transfer process from mask to wafer using light or other radiation. It describes optical lithography and photolithography in detail, including the photoresist materials used, exposure methods, and developing processes for positive and negative resists. It also discusses parameters that impact lithography such as wavelength of light and feature size. Other high resolution lithography techniques such as electron beam, x-ray and ion beam lithography are also mentioned.

Uploaded by

Gopinath Chakraborty
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 22

INTRODUCTION TO MEMS

BITS F415

Dr. D. G. Patil

BITS Pilani
Chapter 5
K. K. Birla Goa Campus
MICROFABRICATION
MICROFAB STEPS
Cleaning
 Sand to Wafer Oxidation
Wafer Level Process Diffusion Ion Implantation
Drive-in-diffusion
Deposition
Etching
Physical Vapor/Chemical Vapor/ Wet
Spin Casting/Sol-gel deposition
Isotropic/
Anisotropic
Pattern Transfer (Lithography)
Dry
Micromachining Vapor based/Plasma
assisted/RIE (DRIE)
BULK SURFACE LIGA
LITHOGRAPHY
 Litho means “Stone” and Graphy means “Writing”

 Pattern Transfer process from mask to wafer


 Optical Light/X-Ray is used to project pattern on
mask onto surface of Wafer
 Wafer surface is coated with photosensitive
material (photoresist)
 Exposed area of photoresist gets
softened/hardened depending on type of photoresist

BITS Pilani, K K Birla Goa Campus


LITHOGRAPHY
IMPORTANCE OF LITHOGRAPHY

BITS Pilani, K K Birla Goa Campus


LITHOGRAPHY
LITHOGRAPHY COST

BITS Pilani, K K Birla Goa Campus


LITHOGRAPHY
LITHOGRAPHY EQUIPMENT

BITS Pilani, K K Birla Goa Campus


LITHOGRAPHY
LITHOGRAPHY LABOR

BITS Pilani, K K Birla Goa Campus


LITHOGRAPHY
Feature Size (µm)

 Optical (UV) Lithography 1

 Direct Write to Wafer methods (DWW)


LASER 1-2

ELECTRON ~ 0.01
BEAM

ION BEAM ~ 0.1

 X-Ray Lithography < 0.1


BITS Pilani, K K Birla Goa Campus
OPTICAL LITHOGRAPHY
PHOTOLITHOGRAPHY
 light-stone-writing in Greek

 Process by which patterns on a semiconductor


material can be defined using light.

 Means to create small-scale features of


integrated circuits/MEMS.

BITS Pilani, K K Birla Goa Campus


PHOTOLITHOGRAPHY

SCHEMATIC OF PHOTOLITHOGRAPHY

BITS Pilani, K K Birla Goa Campus


PHOTOLITHOGRAPHY
TEN STEP PROCESS
1. Begin with Doped Silicon Substrate (Electric Properties)
2. Grow Oxide Layer (Insulation)
3. Apply Photoresist (Photosensitive Coat) (followed by prebaking)
Edge beads needs to be controlled

4. Place Mask over Chip (acts as elaborate template)


5. Expose Areas to be Removed to Light
6. Remove Mask
7. Wash Away Exposed Photoresist (followed by postbaking)
8. Etch Oxide Layer
9. Deposit Next Layer (optional)
10. Remove Remaining Photoresist (aka “de-scumming”)
BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY
IMPORTANT PARAMETERS
 Photoresist
 Ways of exposure
 Contact printing
 Proximity printing
 Projection printing
 Wavelength of light
 Intensity of light
 Width w of the feature size: Diffraction
effects
BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY
METHODS OF PHOTOLITHOGRAPHY

Q. Pro’s and Con’s of each method??

BITS Pilani, K K Birla Goa Campus


PHOTOLITHOGRAPHY
NEGATIVE RESIST POSITIVE RESIST

UV LIGHT

MASK WITH OPAQUE


PATTERN

PHOTORESIST
SiO2

SUBSTRATE

Exposed Region Becomes Insoluble Exposed Region Becomes Soluble


BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY
NEGATIVE RESIST POSITIVE RESIST
ORGANIC (Xylene) ALKALINE (KOH)

DEVELOPER

AFTER DEVELOPMENT & POST BAKE

ETCHING WITH HF/HF+NH4F

AFTER ETCHING
BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY

NEGATIVE RESIST POSITIVE RESIST

Strong H2SO4

RESIST REMOVAL

#Ex. NEGATIVE PHOTORESIST: Kodak KTFR (Azide-sensitized


polyisotropine rubber)
POSITIVE PHOTORESIST: PMMA (Polymethyl metha-acrylate)

BITS Pilani, K K Birla Goa Campus


PHOTOLITHOGRAPHY
#Ex. NEGATIVE RESIST PHOTOLITHOGRAPHIC PROCESS
A
[100]

A Cross Section A-A


TOP VIEW
A
[100] [111]

54.7°

TOP VIEW A Cross Section A-A


BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY
PHOTORESIST
 Positive photoresist
 Photoactive agent (dissolution inhibitor)+ Resin inhibition destroyed
 Better resolution than negative PR
 More sensitive to UV (with max sensitivity at 220 nm)
 Examples: MP-2400, HPR 206, Deep UV resists: PMMA (λ <250 nm),
polybutene sulfone (λ <200 nm)
 Negative photoresist
 Photoactive agent + rubber less soluble
 Less sensitive to optical and x-ray exposure but more sensitive to
e-beam
 Examples: Su-8, Kodak Microneg 747
Q. Effect of temperature (Tg) on resists?
Q. Must have requirements of Resists?
www.microchem.com
BITS Pilani, K K Birla Goa Campus
PHOTOLITHOGRAPHY
 Exposed [100] planes etch rapidly
 [111] etch slowly revealing itself at 54.7°
angle
 Because [111] planes do etch an undercut is
present
 Undercut is used to produce a suspended
structure in substrate etching

BITS Pilani, K K Birla Goa Campus


PHOTOLITHOGRAPHY
SUSPENDED
STRUCTURE BULK
ETCHING

Convex Corners are


rapidly undercut

BITS Pilani, K K Birla Goa Campus


Reading Assignment –
• Electron beam lithography
• X-ray lithography
• Ion beam lithography

Q. What are the common features and differentiating


features of above mentioned methods with respect to
Photolithography??

BITS Pilani, K K Birla Goa Campus


NEXT LECTURE

WAFER LEVEL PROCESSES


CONTINUED

ETCHING

BITS Pilani, K K Birla Goa Campus

You might also like