No, microfabrication and nanofabrication are not exactly the same, although they share
some similarities.
Microfabrication:
Microfabrication refers to the process of fabricating structures or devices with features in
the micrometer (μm) scale, typically ranging from 1-100 μm. Microfabrication techniques
are used to create microelectromechanical systems (MEMS), microfluidic devices, and
other micro-scale devices.
Nanofabrication:
Nanofabrication, on the other hand, refers to the process of fabricating structures or devices
with features in the nanometer (nm) scale, typically ranging from 1-100 nm. Nanofabrication
techniques are used to create nanoscale devices, such as nanowires, nanoparticles, and
nanostructured surfaces.
Key differences:
1. Length scale: Microfabrication deals with features in the micrometer scale,
while nanofabrication deals with features in the nanometer scale.
2. Techniques: Microfabrication techniques, such as photolithography and etching,
are different from nanofabrication techniques, such as electron beam lithography and
nanoimprint lithography.
3. Applications: Microfabrication is used in applications such as MEMS, microfluidics,
and optical devices, while nanofabrication is used in applications such as
nanoelectronics, nanophotonics, and nanomedicine.
In summary, while microfabrication and nanofabrication share some similarities, they differ
in terms of length scale, techniques, and applications.
Alright, let's break down the microfabrication process into numbered steps, based on the
image:
* Clean Wafer: The process begins with a clean substrate (wafer) to ensure no
contaminants affect the subsequent steps.
* Deposit Barrier Layer: A protective layer, such as silicon dioxide (SiO2) or silicon
nitride (Si3N4), is deposited onto the wafer.
* Coat with Photoresist Material: A light-sensitive material called photoresist is applied
to the wafer's surface.
* Soft Bake: The wafer is heated slightly to evaporate solvents from the
photoresist, improving its adhesion.
* Align Mask: A mask containing the desired pattern is precisely aligned over the
photoresist layer.
* Expose: The photoresist is exposed to ultraviolet (UV) light through the mask,
transferring the pattern.
* Develop PR (Photoresist): The exposed (or unexposed, depending on the type of
photoresist) areas of the photoresist are removed using a developer solution, revealing the
pattern on the barrier layer.
* Hard Bake: The remaining photoresist is further hardened by heating to enhance
its resistance to the etching process.
* Etching: The exposed areas of the barrier layer (SiO2 or Si3N4) are selectively
removed using a chemical or plasma etching process.
* Remove PR (Photoresist): The remaining photoresist is stripped away, leaving only
the patterned barrier layer on the wafer.
* Develop Layer: Any further processing or development of the underlying layers of
the wafer is carried out as required for the final device.
what is photolithography?and its application
Photolithography
Photolithography, also known as optical lithography or UV lithography, is a process used in
microfabrication to create high-resolution patterns on a substrate, typically a silicon wafer. It
involves the use of light to transfer a pattern from a photomask to a light-sensitive chemical,
called a photoresist.
Process:
1. Preparation: The substrate is cleaned and coated with a photoresist.
2. Exposure: The photoresist is exposed to ultraviolet (UV) light through a photomask,
which contains the desired pattern.
3. Development: The exposed photoresist is developed, revealing the pattern.
4. Etching: The pattern is transferred to the substrate using an etching process.
Applications:
1. Semiconductor Manufacturing: Photolithography is used to create transistors, diodes,
and other semiconductor devices.
2. Microelectromechanical Systems (MEMS): Photolithography is used to create micro-
scale mechanical structures, such as sensors and actuators.
3. Biomedical Devices: Photolithography is used to create micro-scale features
for biomedical devices, such as lab-on-a-chip devices and biosensors.
4. Optical Devices: Photolithography is used to create optical devices, such as
waveguides and optical filters.
5. Data Storage: Photolithography is used to create high-density data storage devices,
such as hard disk drives and solid-state drives.
Advantages:
1. High Resolution: Photolithography can achieve high resolutions, down to 10 nanometers.
2. High Throughput: Photolithography can be used to create large numbers of
devices quickly and efficiently.
3. Low Cost: Photolithography is a cost-effective method for creating micro-scale devices.
Limitations:
1. Diffraction Limit: Photolithography is limited by the diffraction limit of light,
which restricts the minimum feature size.
2. Cost of Equipment: Photolithography requires expensive equipment, such as steppers
and scanners.
3. Complexity: Photolithography involves complex processes, such as mask creation
and etching.
Negative and positive photo resist definition
[8:59 pm, 17/03/2025] sarah bt: Photoresists: Negative and Positive
Photoresists are light-sensitive materials used in photolithography to transfer patterns
onto a substrate. There are two main types of photoresists: negative and positive.
Negative Photoresist:
A negative photoresist is a type of photoresist that becomes less soluble in a developer
solution after exposure to light.
Characteristics:
1. Cross-linking: Negative photoresists undergo cross-linking reactions when exposed
to light, making them less soluble.
2. Pattern formation: The exposed areas become less soluble and remain on the
substrate, while the unexposed areas are dissolved away.
3. Inverted pattern: The resulting pattern is an inverted version of the original pattern on
the photomask.
Positive Photoresist:
A positive photoresist is a type of photoresist that becomes more soluble in a developer
solution after exposure to light.
Characteristics:
1. Breakdown: Positive photoresists undergo breakdown reactions when exposed to
light, making them more soluble.
2. Pattern formation: The exposed areas become more soluble and are dissolved away,
while the unexposed areas remain on the substrate.
3. Direct pattern: The resulting pattern is a direct replica of the original pattern on
the photomask.
Key differences:
1. Solubility: Negative photoresists become less soluble, while positive photoresists
become more soluble after exposure.
2. Pattern formation: Negative photoresists form an inverted pattern, while
positive photoresists form a direct pattern.
3. Applications: Negative photoresists are often used for creating thick resist
structures, while positive photoresists are commonly used for creating high-resolution
patterns.
Photolithography steps explained
1. Substrate Cleaning
* Purpose: To prepare the silicon wafer surface for further processing by
removing contaminants.
* Process:
* The silicon wafer is cleaned in a chemical bath of Piranha solution (a strong
oxidizing mixture).
* It is then rinsed with a solution of Isopropyl Alcohol (IPA) to further remove residues.
* Finally, it's washed with deionized water to ensure a clean surface.
2. Photoresist Coating
* Purpose: To apply a thin, uniform layer of photoresist (PR) onto the substrate for
pattern transfer.
* Process:
* A small amount of PR is dispensed onto the center of the spinning wafer.
* The wafer is rapidly spun at high speeds (typically 2000-5000 rpm) to evenly
distribute the PR across the surface, creating a thin, uniform film.
3. Mask Alignment
* Purpose: To precisely align the photomask (containing the desired pattern) with the wafer.
* Process:
* The photomask (a transparent plate with chrome patterns) is aligned with the
wafer using alignment marks present on both.
* This ensures the pattern is transferred correctly to the photoresist.
4. Exposure
* Purpose: To transfer the pattern from the mask to the photoresist.
* Process:
* The photoresist (PR) is exposed to UV light through the aligned mask.
* The UV light alters the exposed areas of the PR, making them either soluble or
insoluble in the developer (depending on the type of PR).
* The image mentions a specific exposure wavelength of 365nm.
5. Development
* Purpose: To remove either the exposed or unexposed areas of the PR, revealing
the desired pattern.
* Process:
* The wafer is submerged in a developer solution, which selectively removes either
the exposed or unexposed PR areas.
* After development, the wafer is rinsed with deionized water to stop the
development process.
6. Hard Baking
* Purpose: To harden the remaining photoresist pattern, making it more resistant
to subsequent processing steps.
* Process:
* The wafer is baked at a temperature between 120-150°C.
* This strengthens the photoresist, ensuring it can withstand further processing.
7. Etching
* Purpose: To selectively remove unwanted material from the wafer, transferring
the pattern from the photoresist to the underlying layer.
* Process:
* Wet Etching: Uses chemical solutions (e.g., HF, HNO3 for metals) to dissolve
the unprotected material.
* Dry Etching: Uses plasma or reactive ions (RIE) to remove material. Gases are
ionized and react with the material.
* Isotropic Etching: Etching occurs uniformly in all directions, resulting in rounded patterns.
* Anisotropic Etching: Etching is directional (vertical), producing sharp edge profiles.
8. Removal of Photoresist (PR)
* Purpose: To remove the remaining photoresist after etching.
* Process:
* The PR is removed using a stripping solution (e.g., acetone) or by plasma ashing.
* Finally, the desired material is left on the wafer, forming the etched pattern.
Soft lithography definition
Soft Lithography
Soft lithography is a set of techniques used to create micro-scale patterns and structures on
a substrate using a flexible, elastomeric stamp or mold. It is a non-photolithographic method
that uses physical contact to transfer patterns, rather than light.
Key Characteristics:
1. Flexible stamp: Soft lithography uses a flexible, elastomeric stamp or mold to
create patterns.
2. Physical contact: The stamp or mold is brought into physical contact with the substrate
to transfer the pattern.
3. Non-photolithographic: Soft lithography does not use light to create patterns,
unlike photolithography.
4. Low-cost: Soft lithography is often less expensive than photolithography, as it does
not require expensive equipment or cleanroom facilities.
Techniques:
1. Microcontact printing (μCP): A technique that uses a flexible stamp to transfer ink onto
a substrate.
2. Soft embossing: A technique that uses a flexible mold to emboss patterns onto
a substrate.
3. Nanoimprint lithography (NIL): A technique that uses a flexible mold to create nano-
scale patterns on a substrate.
Applications:
1. Microfluidics: Soft lithography is used to create microfluidic devices, such as lab-on-a-
chip devices.
2. Biosensors: Soft lithography is used to create biosensors, such as DNA microarrays.
3. Tissue engineering: Soft lithography is used to create micro-scale patterns for
tissue engineering applications.
4. Optical devices: Soft lithography is used to create optical devices, such as waveguides
and optical filters.
Key aspects of soft lithography
Key Aspects of Soft Lithography
a) Pattern Transfer Using Soft Materials:
* Process:
* PDMS (Polydimethylsiloxane) Mold Creation: A soft polymer called PDMS is used to
create a mold or stamp from a rigid master template. Think of it like making a rubber
stamp from a carved design.
* Pattern Replication: This PDMS mold is then used to replicate the pattern onto
another substrate. It's like stamping the design onto a new surface.
b) Surface Chemistry and Contact Printing:
* Process:
* Self-Assembled Monolayers (SAMs): Soft lithography utilizes SAMs, ink molecules, or
polymers that can transfer onto a surface through a technique called microcontact
printing (μCP).
* PDMS Advantages: The hydrophobic nature and flexibility of PDMS molds make them
ideal for this process. Hydrophobicity helps the "ink" adhere to the mold and transfer to
the substrate, while flexibility allows for conformal contact with various surfaces.
In simpler terms:
Soft lithography is like using a rubber stamp to create patterns on surfaces. You make a
stamp out of a flexible material (PDMS) from a template, then use it to transfer "ink"
(SAMs or other molecules) onto another surface. The flexibility and surface properties of
PDMS
make it a great tool for this.
c) Mechanical Conformability
* Concept: This refers to the ability of PDMS (Polydimethylsiloxane) to conform to non-
flat surfaces due to its soft and flexible nature.
* Application: This makes PDMS ideal for applications like bio-devices and
flexible electronics, where contact with curved or irregular surfaces is necessary.
Process Illustration
The image shows a simplified diagram illustrating two key soft lithography techniques:
* Replica Molding:
* Step 1: A patterned polymer (the "master" or template) is created.
* Step 2: PDMS pre-polymer is poured over the patterned polymer.
* Step 3: The PDMS is cured, forming a replica mold that replicates the pattern.
* Microcontact Printing (μCP):
* Step 1: The PDMS mold (created through replica molding) is "inked" with a
desired material.
* Step 2: The inked PDMS mold is brought into contact with a substrate.
* Step 3: The "ink" is transferred from the PDMS mold to the substrate, creating
a patterned layer.
Advantages of Soft Lithography
* Curved Surface Compatibility: As mentioned, soft lithography can be used on
curved surfaces, unlike traditional photolithography.
* Printing on Various Materials: It allows for printing on a wider range of
materials compared to photolithography.
* No Masking Required (in some cases): The process doesn't always require
traditional masking steps like photolithography, simplifying the process.
* Cost-Effectiveness: Soft lithography can be less expensive than
traditional photolithography.
Comparison with Photolithography
* Photolithography: Typically requires flat surfaces and involves masking steps to
define patterns.
In essence:
The image highlights the key advantage of PDMS's flexibility in soft lithography, allowing
for pattern transfer onto non-planar surfaces. It also visually explains the processes of
replica molding and microcontact printing, which are fundamental to soft lithography.
Finally, it
contrasts soft lithography with photolithography, highlighting its advantages in certain
applications.
Etching
Etching
Etching is a process used in microfabrication and semiconductor manufacturing to remove
material from a substrate, typically a silicon wafer. It involves the use of chemicals or plasma
to selectively remove material, creating patterns or structures on the substrate.
Types of Etching Processes:
1. Wet Etching: Uses a liquid etchant to remove material.
2. Dry Etching: Uses a gas or plasma to remove material.
3. Reactive Ion Etching (RIE): A type of dry etching that uses a plasma to remove material.
4. Ion Beam Etching (IBE): A type of dry etching that uses a focused beam of ions to
remove material.
5. Chemical Vapor Etching (CVE): A type of dry etching that uses a chemical vapor to
remove material.
Wet Etching:
1. Isotropic Etching: Etches equally in all directions.
2. Anisotropic Etching: Etches preferentially in one direction.
Dry Etching:
1. Physical Etching: Uses physical processes, such as sputtering or ion milling, to
remove material.
2. Chemical Etching: Uses chemical reactions to remove material.
Etching Techniques:
1. Masked Etching: Uses a mask to protect areas that should not be etched.
2. Unmasked Etching: Does not use a mask, and the entire substrate is exposed to
the etchant.
3. Selective Etching: Etches specific materials or layers.
Applications:
1. Semiconductor Manufacturing: Etching is used to create transistors, diodes, and
other semiconductor devices.
2. Microelectromechanical Systems (MEMS): Etching is used to create micro-
scale mechanical structures.
3. Biomedical Devices: Etching is used to create micro-scale features for biomedical devices.
Module 1 remaining
effects of size shape density melting point wet ability and specific surface area. on nanomaterials
The physical and chemical properties of nanomaterials, such as size, shape, density, melting point,
wettability, and specific surface area, significantly influence their behavior, reactivity, and
applications. Here's how each property affects nanomaterials:
1. Size
As particle size decreases to the nanometer scale, surface area increases significantly, leading to
enhanced chemical reactivity.
Quantum effects become more pronounced, altering optical, electrical, and mechanical properties.
Small nanoparticles exhibit size-dependent properties, such as shifts in melting points and electronic
band gaps.
2. Shape
Different shapes (spherical, rod-like, cubic, plate-like) influence surface energy, interaction with
biological systems, and catalytic activity.
Anisotropic (non-spherical) nanoparticles have direction-dependent properties, impacting optical and
electronic behaviors.
Shape can affect self-assembly, aggregation, and targeted drug delivery in biomedical applications.
3. Density
Affects sedimentation and dispersion in colloidal suspensions.
Low-density nanomaterials (e.g., aerogels) are useful for insulation, while high-density nanoparticles
(e.g., metal-based) are essential in catalysts.
4. Melting Point
Nanomaterials often exhibit lower melting points than bulk materials due to high surface energy and
increased surface atom mobility.
This property is crucial in nanofabrication and sintering processes.
Lower melting points can enhance catalytic activity and processing flexibility.
5. Wettability
Determines how a nanomaterial interacts with liquids, affecting adhesion, lubrication, and coating
applications.
Hydrophilic nanoparticles enhance dispersion in aqueous environments, useful in biomedical and
environmental applications.
Hydrophobic nanoparticles are used in water-repellent coatings and oil separation technologies.
6. Specific Surface Area (SSA)
Defined as the surface area per unit mass (m²/g), it increases as particle size decreases.
Higher SSA improves catalytic efficiency, adsorption capacity, and reaction rates.
Important for applications in drug delivery, energy storage, and pollutant removal.
Conclusion
The interplay of these properties determines the functionality and performance of nanomaterials in
various fields, including medicine, catalysis, energy, and environmental science. Tailoring these
properties allows for the design of nanomaterials with specific desired functionalities.
