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RT7294A

2.5A, 18V, 500kHz ACOTTM Synchronous Step-Down Converter

General Description Features
The RT7294A is a synchronous step-down converter with  4.3V to 18V Input Voltage Range
Advanced Constant On-Time (ACOTTM) mode control. The  2.5A Output Current
ACOTTM provides a very fast transient response with few  Advanced Constant On-Time Control
external components. The low impedance internal  Fast Transient Response
MOSFET supports high efficiency operation with wide input  Support All Ceramic Capacitors
voltage range from 4.3V to 18V. The proprietary circuit of  Up to 95% Efficiency
the RT7294A enables to support all ceramic capacitors.  500kHz Switching Frequency
The output voltage can be adjusted between 0.6V and 8V.  Adjustable Output Voltage from 0.6V to 8V
 Cycle-by-Cycle Current Limit
Ordering Information  Input Under-Voltage Lockout
RT7294A  Hiccup Mode Under-Voltage Protection
Package Type  Thermal Shutdown
J6F : TSOT-23-6 (FC)  Power Saving Mode for High Efficiency at Light
Load
Lead Plating System
G : Green (Halogen Free and Pb Free)  RoHS Compliant and Halogen Free
Note :
Richtek products are :
 RoHS compliant and compatible with the current require-
Applications
ments of IPC/JEDEC J-STD-020.  Industrial and Commercial Low Power Systems
 Suitable for use in SnPb or Pb-free soldering processes.  Computer Peripherals
 LCD Monitors and TVs
 Green Electronics/Appliances
Pin Configurations
 Point of Load Regulation for High-Performance DSPs,
(TOP VIEW)
FPGAs, and ASICs
SW VIN EN

6 5 4
Marking Information
2 3 01= : Product Code

BOOT GND FB
01=DNN DNN : Date Code
TSOT-23-6 (FC)

Simplified Application Circuit

RT7294A

VIN VIN BOOT

SW VOUT

Enable EN FB
GND

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RT7294A
Functional Pin Description
Pin No. Pin Name Pin Function
Bootstrap Supply for High-Side Gate Driver. Connect a 0.1F ceramic capacitor
1 BOOT
between the BOOT and SW pins.
2 GND Power Ground.
Feedback Voltage Input. The pin is used to set the output voltage of the converter
3 FB
via a resistive divider. The converter regulates VFB to 0.6V
Enable Control Input. Connect EN to a logic-high voltage to enable the IC or to a
4 EN
logic-low voltage to disable. Do not leave this high impedance input unconnected.
Power Input. The input voltage range is from 4.3V to 18V. Must bypass with a
5 VIN
suitable large ceramic capacitor at this pin.
6 SW Switch Node. Connect to external L-C filter.

Function Block Diagram

BOOT VIN

VIN

Reg
PVCC

VIBIAS Min off

VREF
PVCC

OC UGATE
Driver SW
Control
UV & OV LGATE

PVCC GND
Ripple GND SW
SW
Gen. VIN
+
- EN On-Time SW
-
Comparator

FB EN

Operation
The RT7294A is a synchronous step-down converter with UVLO Protection
advanced constant on-time control mode. Using the ACOT To protect the chip from operating at insufficient supply
control mode can reduce the output capacitance and fast voltage, the UVLO is needed. When the input voltage of
transient response. It can minimize the component size VIN is lower than the UVLO falling threshold voltage, the
without additional external compensation network. device will be lockout.

Current Protection Thermal Shutdown

The inductor current is monitored via the internal switches When the junction temperature exceeds the OTP
cycle-by-cycle. Once the output voltage drops under UV threshold value, the IC will shut down the switching
threshold, the RT7294A will enter hiccup mode. operation. Once the junction temperature cools down and
is lower than the OTP lower threshold, the converter will
autocratically resume switching.

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 RT7294A
Absolute Maximum Ratings (Note 1)
 VIN to GND ----------------------------------------------------------------------------------------------------- −0.3V to 20V
 SW to GND ---------------------------------------------------------------------------------------------------- −0.3V to (VIN + 0.3V)
<10ns ----------------------------------------------------------------------------------------------------------- −5V to 25V
 BOOT to GND ------------------------------------------------------------------------------------------------- (VSW − 0.3V) to (VSW + 6V)
 Other Pins ------------------------------------------------------------------------------------------------------ −0.3V to 6V
 Power Dissipation, PD @ TA = 25°C
TSOT-23-6 (FC) ----------------------------------------------------------------------------------------------- 1.429W
 Package Thermal Resistance (Note 2)
TSOT-23-6 (FC), θJA ------------------------------------------------------------------------------------------ 70°C/W
TSOT-23-6 (FC), θJC ----------------------------------------------------------------------------------------- 15°C/W
 Lead Temperature (Soldering, 10 sec.) ------------------------------------------------------------------ 260°C
 Junction Temperature ---------------------------------------------------------------------------------------- 150°C
 Storage Temperature Range ------------------------------------------------------------------------------- −65°C to 150°C
 ESD Susceptibility (Note 3)
HBM (Human Body Model) --------------------------------------------------------------------------------- 2kV

Recommended Operating Conditions (Note 4)

 Supply Input Voltage, VIN ---------------------------------------------------------------------------------- 4.3V to 18V
 Junction Temperature Range ------------------------------------------------------------------------------- −40°C to 125°C
 Ambient Temperature Range ------------------------------------------------------------------------------- −40°C to 85°C

Electrical Characteristics
(VIN = 12V, TA = 25°C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Shutdown Current ISHDN VEN = 0V -- -- 4 A
Quiescent Current IQ VEN = 2V, VFB = 1V -- 0.5 -- mA

Switch-On High-Side RDS(ON)_H VBOOTSW = 4.8V -- 150 --

m
Resistance Low-Side RDS(ON)_L VIN = 5V -- 90 --
Current Limit ILIM Valley Current 2.7 3.4 4 A
Oscillator Frequency f SW -- 500 -- kHz
Maximum Duty Cycle DMAX -- 90 -- %
Minimum On-Time tON -- 60 -- ns
Feedback Threshold Voltage VFB In CCM Mode 591 600 609 mV
Logic-High VEN_H 1.19 1.29 1.39
EN Input Threshold V
Logic-Low VEN_L 0.93 1.03 1.13
VIN Under-Voltage Lockout
VUVLO VIN Rising 3.55 3.9 4.25 V
Threshold
VIN Under-Voltage Lockout
-- 340 -- mV
Threshold Hysteresis
Soft-Start Time tSS -- 800 -- s
Thermal Shutdown Threshold TSD -- 160 -- C

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RT7294A
Parameter Symbol Test Conditions Min Typ Max Unit
Thermal Shutdown Hysteresis TSD -- 20 -- C
VOUT Discharge Resistance RDISCHG EN = 0V, VOUT = 0.5V -- 50 100 
Output Under-Voltage Trip UVP detect 70 75 80
%
Threshold Hysteresis -- 10 --
Output Under-Voltage Delay
-- 250 -- s
Time
Note 1. Stresses beyond those listed “Absolute Maximum Ratings” may cause permanent damage to the device. These are
stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may
affect device reliability.
Note 2. θJA is measured at TA = 25°C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. θJC is
measured at the top of the package.
Note 3. Devices are ESD sensitive. Handling precaution is recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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 RT7294A
Typical Application Circuit

RT7294A
VIN 5 1
VIN BOOT
4.3V to 18V CIN CBOOT L
10µF 100nF 2µH
VOUT
SW 6
1.2V
CFF R1
10k
4 EN
Enable FB 3 COUT
22µF
R2
10k
GND 2

Table 1. Suggested Component Values

VOUT (V) R1 (k) R2 (k) L (H) COUT (F) CFF (pF)
5 110 15 4.7 22 39
3.3 115 25.5 3.6 22 33
2.5 25.5 8.06 3.6 22 NC
1.2 10 10 2 22 NC

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RT7294A
Typical Operating Characteristics
Efficiency vs. Load Current Efficiency vs. Load Current
100 100
90 90
80 80 VIN = 12V
VIN = 15V
70 VIN = 4.5V 70 VIN = 18V

Efficiency (%)
Efficiency (%)

VIN = 9V
60 60
VIN = 12V
50 VIN = 18V 50
40 40
30 30
20 20
10 10
VOUT = 1.2V VOUT = 5V
0 0
0.001 0.01 0.1 1 10 0.001 0.01 0.1 1 10
Load Current (A) Load Current (A)

Reference Voltage vs. Input Voltage Reference Voltage vs. Temperature

0.620 0.65

0.615
0.63
Reference Voltage (V)

0.610
Reference Voltage (V)

0.605 0.61

0.600
0.59
0.595

0.590
0.57
0.585
VIN = 4.5V to 18V, VOUT = 1.2V, IOUT = 0A VIN = 12V, VOUT = 1.2V, IOUT = 0.75A
0.580 0.55
4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)

Output Voltage vs. Load Current Switching Frequency. vs. Input Voltage
1.250 550
1.242 540
Switching Frequency (kHz)1

VIN = 18V
1.234 VIN = 12V 530
Output Voltage (V)

1.226 VIN = 9V 520

VIN = 4.5V
1.218 510
1.210 500
1.202 490
1.194 480
1.186 470
1.178 460
VOUT = 1.2V VIN = 4.5V to 18V, VOUT = 1.2V, IOUT = 0.75A
1.170 450
0 0.25 0.5 0.75 1 1.25 1.5 1.75 2 2.25 2.5 4 6 8 10 12 14 16 18
Load Current (A) Input Voltage (V)

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 RT7294A

Switching Frequency vs. Temperature Current Limit vs. Temperature

650 4.0
630 3.9
Switching Frequency (kHz)1

610 3.8

Current Limit (A)

590 3.7
570 3.6
VIN = 4.5V
550 VIN = 12V 3.5
VIN = 18V
530 3.4
510 3.3
490 3.2
470 3.1
VOUT = 1.2V, IOUT = 0.75A
450 3.0
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

Load Transient Response Load Transient Response

VOUT VOUT
(50mV/Div) (50mV/Div)

IOUT IOUT
(1A/Div) (1A/Div)

VIN = 12V, VOUT = 1.2V, IOUT = 0A to 2.5A VIN = 12V, VOUT = 1.2V, IOUT = 1.25A to 2.5A

Time (250μs/Div) Time (250μs/Div)

Switching Switching

VOUT VOUT
(10mV/Div) (10mV/Div)

VSW VSW
(10V/Div) (10V/Div)

I SW I SW
(1A/Div) (2A/Div)
VIN = 12V, VOUT = 1.2V, IOUT = 1.25A VIN = 12V, VOUT = 1.2V, IOUT = 2.5A

Time (1μs/Div) Time (1μs/Div)

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RT7294A

Power On from EN Power Off from EN

VEN VEN
(2V/Div) (2V/Div)

VOUT VOUT
(1V/Div) (1V/Div)
VSW VSW
(10V/Div) (10V/Div)

IOUT IOUT
(2A/Div) (2A/Div)
VIN = 12V, VOUT = 1.2V, IOUT = 2.5A VIN = 12V, VOUT = 1.2V, IOUT = 2.5A

Time (2.5ms/Div) Time (5ms/Div)

Power On from VIN Power Off from VIN

VIN VIN
(10V/Div) (10V/Div)

VOUT VOUT
(1V/Div) (1V/Div)
VSW VSW
(10V/Div) (10V/Div)

IOUT IOUT
(2A/Div) (2A/Div)
VIN = 12V, VOUT = 1.2V, IOUT = 2.5A VIN = 12V, VOUT = 1.2V, IOUT = 2.5A

Time (2.5ms/Div) Time (5ms/Div)

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 RT7294A
Application information
Inductor Selection
Selecting an inductor involves specifying its inductance The ripple current was selected at 0.9A and, as long as
and also its required peak current. The exact inductor value we use the calculated 2μH inductance, that should be the
is generally flexible and is ultimately chosen to obtain the actual ripple current amount. The ripple current and required
best mix of cost, physical size, and circuit efficiency. peak current as below :
Lower inductor values benefit from reduced size and cost 1.2  12  1.2 
IL = = 0.9A
and they can improve the circuit's transient response, but 12  500kHz  2μH
they increase the inductor ripple current and output voltage
and IL(PEAK) = 2.5A  0.9 = 2.95A
ripple and reduce the efficiency due to the resulting higher 2
peak currents. Conversely, higher inductor values increase Inductor saturation current should be chosen over IC's
efficiency, but the inductor will either be physically larger current limit.
or have higher resistance since more turns of wire are
required and transient response will be slower since more Input Capacitor Selection
time is required to change current (up or down) in the The input filter capacitors are needed to smooth out the
inductor. A good compromise between size, efficiency, switched current drawn from the input power source and
and transient response is to use a ripple current (ΔIL) about to reduce voltage ripple on the input. The actual
20% to 40% of the desired full output load current. capacitance value is less important than the RMS current
Calculate the approximate inductor value by selecting the rating (and voltage rating, of course). The RMS input ripple
input and output voltages, the switching frequency (fSW), current (IRMS) is a function of the input voltage, output
the maximum output current (IOUT(MAX)) and estimating a voltage, and load current :
ΔIL as some percentage of that current. V
IRMS = IOUT(MAX)  OUT
VIN
1
VOUT   VIN  VOUT  VIN VOUT
L=
VIN  fSW  IL
Ceramic capacitors are most often used because of their
Once an inductor value is chosen, the ripple current (ΔIL)
low cost, small size, high RMS current ratings, and robust
is calculated to determine the required peak inductor
surge current capabilities. However, take care when these
current.
capacitors are used at the input of circuits supplied by a
VOUT   VIN  VOUT 
IL = wall adapter or other supply connected through long, thin
VIN  fSW  L
wires. Current surges through the inductive wires can
I
IL(PEAK) = IOUT(MAX)  L induce ringing at the RT7294A input which could potentially
2
IL cause large, damaging voltage spikes at VIN. If this
IL(VALLY) = IOUT(MAX) 
2 phenomenon is observed, some bulk input capacitance
Considering the Typical Operating Circuit for 1.2V output may be required. Ceramic capacitors (to meet the RMS
at 2.5A and an input voltage of 12V, using an inductor current requirement) can be placed in parallel with other
ripple of 0.9A (36%), the calculated inductance value is : types such as tantalum, electrolytic, or polymer (to reduce
1.2  12  1.2 
ringing and overshoot).
L= = 2μH
12  500kHz  0.9 Choose capacitors rated at higher temperatures than
required. Several ceramic capacitors may be paralleled to
meet the RMS current, size, and height requirements of
the application. The typical operating circuit use 10μF and
one 0.1μF low ESR ceramic capacitors on the input.

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RT7294A
Output Capacitor Selection But some modern digital loads can exhibit nearly
The RT7294A is optimized for ceramic output capacitors instantaneous load changes and the following section
and best performance will be obtained using them. The shows how to calculate the worst-case voltage swings in
total output capacitance value is usually determined by response to very fast load steps.
the desired output voltage ripple level and transient response The output voltage transient undershoot and overshoot each
requirements for sag (undershoot on positive load steps) have two components : the voltage steps caused by the
and soar (overshoot on negative load steps). output capacitor's ESR, and the voltage sag and soar due
to the finite output capacitance and the inductor current
Output Ripple
slew rate. Use the following formulas to check if the ESR
Output ripple at the switching frequency is caused by the is low enough (typically not a problem with ceramic
inductor current ripple and its effect on the output capacitors) and the output capacitance is large enough to
capacitor's ESR and stored charge. These two ripple prevent excessive sag and soar on very fast load step
components are called ESR ripple and capacitive ripple. edges, with the chosen inductor value.
Since ceramic capacitors have extremely low ESR and
The amplitude of the ESR step up or down is a function of
relatively little capacitance, both components are similar
the load step and the ESR of the output capacitor :
in amplitude and both should be considered if ripple is
critical. VESR _STEP = ΔIOUT x RESR
VRIPPLE = VRIPPLE(ESR)  VRIPPLE(C) The amplitude of the capacitive sag is a function of the
VRIPPLE(ESR) = IL  RESR load step, the output capacitor value, the inductor value,
IL the input-to-output voltage differential, and the maximum
VRIPPLE(C) =
8  COUT  fSW duty cycle. The maximum duty cycle during a fast transient
For the Typical Operating Circuit for 1.2V output and an is a function of the on-time and the minimum off-time since
inductor ripple of 1.08A, with 22μF output capacitance each the ACOTTM control scheme will ramp the current using
with about 5mΩ ESR including PCB trace resistance, the on-times spaced apart with minimum off-times, which is
output voltage ripple components are : as fast as allowed. Calculate the approximate on-time
VRIPPLE(ESR) = 1.08A  5m = 5.4mV (neglecting parasitics) and maximum duty cycle for a given
1.08A input and output voltage as :
VRIPPLE(C) = = 12mV
8  22μF  500kHz VOUT tON
tON = and DMAX =
VIN  fSW tON  tOFF(MIN)
VRIPPLE = 2.7mV  12mV = 14.7mV
The actual on-time will be slightly longer as the IC
Output Transient Undershoot and Overshoot compensates for voltage drops in the circuit, but we can
In addition to voltage ripple at the switching frequency, neglect both of these since the on-time increase
the output capacitor and its ESR also affect the voltage compensates for the voltage losses. Calculate the output
sag (undershoot) and soar (overshoot) when the load steps voltage sag as :
up and down abruptly. The ACOT transient response is L  (IOUT )2
VSAG =
very quick and output transients are usually small. 2  COUT   VIN(MIN)  DMAX  VOUT 
The amplitude of the capacitive soar is a function of the
However, the combination of small ceramic output
load step, the output capacitor value, the inductor value
capacitors (with little capacitance), low output voltages
and the output voltage :
(with little stored charge in the output capacitors), and
L  (IOUT )2
low duty cycle applications (which require high inductance VSOAR =
2  COUT  VOUT
to get reasonable ripple currents with high input voltages)
increases the size of voltage variations in response to
very quick load changes. Typically, load changes occur
slowly with respect to the IC's 500kHz switching frequency.
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 RT7294A
Feed-forward Capacitor (Cff) Enable Operation (EN)
The RT7294A is optimized for ceramic output capacitors For automatic start-up the EN pin can be connected to
and for low duty cycle applications. However for high-output VIN, through a 100kΩ resistor. Its large hysteresis band
voltages, with high feedback attenuation, the circuit's makes EN useful for simple delay and timing circuits. EN
response becomes over-damped and transient response can be externally pulled to VIN by adding a resistor-
can be slowed. In high-output voltage circuits (VOUT > 3.3V) capacitor delay (REN and CEN in Figure 2). Calculate the
transient response is improved by adding a small “feed- delay time using EN's internal threshold where switching
forward” capacitor (Cff) across the upper FB divider resistor operation begins (1.4V, typical).
(figure 1), to increase the circuit's Q and reduce damping An external MOSFET can be added to implement digital
to speed up the transient response without affecting the control of EN when no system voltage above 2V is available
steady-state stability of the circuit. Choose a suitable (Figure 3). In this case, a 100kΩ pull-up resistor, REN, is
capacitor value that following below step. connected between VIN and the EN pin. MOSFET Q1 will
 Get the BW the quickest method to do transient be under logic control to pull down the EN pin. To prevent
response form no load to full load. Confirm the damping enabling circuit when VIN is smaller than the VOUT target
frequency. The damping frequency is BW. value or some other desired voltage level, a resistive voltage
divider can be placed between the input voltage and ground
and connected to EN to create an additional input under
voltage lockout threshold (Figure 4).

EN
BW REN
VIN EN
RT7294A
CEN
GND
VOUT

Figure 2. External Timing Control

R1 Cff
FB REN
100k
RT7294A R2 VIN EN

GND Enable Q1 RT7294A

GND
Figure 1. Cff Capacitor Setting

Cff can be calculated base on below equation : Figure 3. Digital Enable Control Circuit
Cff  1
2  3.1412  R1 BW  0.8
REN1
VIN EN
Internal Soft-Start (SS) REN2 RT7294A
The RT7294A soft-start uses an internal soft-start time
GND
800μs.
Following below equation to get the minimum capacitance Figure 4. Resistor Divider for Lockout Threshold Setting
range in order to avoid UV occur.
COUT  VOUT  0.6  1.2
T
(ILIM  Load Current)  0.8
T  800μs

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RT7294A
Output Voltage Setting can be slowed by placing a small (<47Ω) resistance
Set the desired output voltage using a resistive divider between BOOT and the external bootstrap capacitor. This
from the output to ground with the midpoint connected to will slow the high-side switch turn-on and VSW's rise. To
FB. The output voltage is set according to the following remove the resistor from the capacitor charging path
equation : (avoiding poor enhancement due to undercharging the
BOOT capacitor), use the external diode shown in figure
VOUT = 0.6 x (1 + R1 / R2)
6 to charge the BOOT capacitor and place the resistance
VOUT
between BOOT and the capacitor/diode connection.
5V
R1
FB

RT7294A R2 BOOT
GND RT7294A 0.1µF
SW

Figure 5. Output Voltage Setting

Figure 6. External Bootstrap Diode
Place the FB resistors within 5mm of the FB pin. Choose
R2 between 10kΩ and 100kΩ to minimize power Over-Temperature Protection
consumption without excessive noise pick-up and The RT7294A features an Over-Temperature Protection
calculate R1 as follows : (OTP) circuitry to prevent from overheating due to
R2  (VOUT  0.6) excessive power dissipation. The OTP will shut down
R1 
0.6 switching operation when junction temperature exceeds
For output voltage accuracy, use divider resistors with 1% 160°C. Once the junction temperature cools down by
or better tolerance. approximately 20°C, the converter will resume operation.
To maintain continuous operation, the maximum junction
External BOOT Bootstrap Diode temperature should be lower than 125°C.
When the input voltage is lower than 5.5V it is
Under-Voltage Protection
recommended to add an external bootstrap diode between
VIN (or VINR) and the BOOT pin to improve enhancement Hiccup Mode
of the internal MOSFET switch and improve efficiency.
The RT7294A provides Hiccup Mode Under-Voltage
The bootstrap diode can be a low cost one such as 1N4148
Protection (UVP). When the VFB voltage drops below
or BAT54.
0.4V, the UVP function will be triggered to shut down
switching operation. If the UVP condition remains for a
External BOOT Capacitor Series Resistance
period, the RT7294A will retry automatically. When the
The internal power MOSFET switch gate driver is
UVP condition is removed, the converter will resume
optimized to turn the switch on fast enough for low power
operation. The UVP is disabled during soft-start period.
loss and good efficiency, but also slow enough to reduce
EMI. Switch turn-on is when most EMI occurs since VSW Thermal Considerations
rises rapidly. During switch turn-off, SW is discharged
For continuous operation, do not exceed absolute
relatively slowly by the inductor current during the deadtime
maximum junction temperature. The maximum power
between high-side and low-side switch on-times. In some
dissipation depends on the thermal resistance of the IC
cases it is desirable to reduce EMI further, at the expense
package, PCB layout, rate of surrounding airflow, and
of some additional power dissipation. The switch turn-on
difference between junction and ambient temperature. The

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 RT7294A
2.0
maximum power dissipation can be calculated by the Four-Layer PCB

Maximum Power Dissipation (W)1

following formula :
1.6
PD(MAX) = (TJ(MAX) − TA) / θJA
where TJ(MAX) is the maximum junction temperature, TA is 1.2

the ambient temperature, and θJA is the junction to ambient

thermal resistance. 0.8

For recommended operating condition specifications, the

0.4
maximum junction temperature is 125°C. The junction to
ambient thermal resistance, θJA, is layout dependent. For
0.0
TSOT-23-6 (FC) package, the thermal resistance, θJA, is
0 25 50 75 100 125
70°C/W on a standard four-layer thermal test board. The Ambient Temperature (°C)
maximum power dissipation at TA = 25°C can be calculated
Figure 7. Derating Curve of Maximum Power Dissipation
by the following formula :
PD(MAX) = (125°C − 25°C) / (70°C/W) = 1.429W for
TSOT-23-6 (FC) package Layout Considerations
For best performance of the RT7294A, the following layout
The maximum power dissipation depends on the operating
guidelines must be strictly followed.
ambient temperature for fixed T J(MAX) and thermal
resistance, θJA. The derating curve in Figure 7 allows the  Input capacitor must be placed as close to the IC as
designer to see the effect of rising ambient temperature possible.
on the maximum power dissipation.  SW should be connected to inductor by wide and short
trace. Keep sensitive components away from this trace.

SW should be connected to inductor by Wide and

short trace. Keep sensitive components away from
this trace. Suggestion layout trace wider for thermal.
COUT
VOUT
Keep sensitive components away
from this trace. Suggestion layout
trace wider for thermal. COUT GND
SW
CS* R
S*

Suggestion layout trace

BOOT 6 SW
wider for thermal. CIN CIN
GND 2 5 VIN
REN
FB 3 4 EN VIN
VOUT R1 Input capacitor must be placed as close
R2 to the IC as possible. Suggestion layout
The REN component must trace wider for thermal.
The feedback components must be be connected to VIN.
connected as close to the device as Suggestion layout trace
possible. wider for thermal.

Figure 8. PCB Layout Guide

Copyright © 2016 Richtek Technology Corporation. All rights reserved. is a registered trademark of Richtek Technology Corporation.

DS7294A-05 October 2016 www.richtek.com

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RT7294A
Outline Dimension

Dimensions In Millimeters Dimensions In Inches

Symbol
Min. Max. Min. Max.
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.950 0.037
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

TSOT-23-6 (FC) Surface Mount Package

Richtek Technology Corporation

14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Richtek reserves the right to change the circuitry and/or specifications without notice at any time. Customers should
obtain the latest relevant information and data sheets before placing orders and should verify that such information is current and complete. Richtek cannot
assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product. Information furnished by Richtek is believed to be
accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any infringements of patents or other rights of third
parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Richtek or its subsidiaries.
www.richtek.com DS7294A-05 October 2016
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