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DS8096C 05

The RT8096C is a high efficiency synchronous step-down DC-DC converter with an input voltage range of 2.5V to 6V and an adjustable output voltage from 0.6V to 3.4V, capable of delivering up to 1A of output current. It features a CMCOT control design for optimal transient response, cycle-by-cycle over-current protection, and thermal shutdown capabilities. The device is available in TSOT-23-5 and TSOT-23-6 packages and is suitable for applications such as STB, cable modems, and LCD TV power supplies.

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0% found this document useful (0 votes)
25 views17 pages

DS8096C 05

The RT8096C is a high efficiency synchronous step-down DC-DC converter with an input voltage range of 2.5V to 6V and an adjustable output voltage from 0.6V to 3.4V, capable of delivering up to 1A of output current. It features a CMCOT control design for optimal transient response, cycle-by-cycle over-current protection, and thermal shutdown capabilities. The device is available in TSOT-23-5 and TSOT-23-6 packages and is suitable for applications such as STB, cable modems, and LCD TV power supplies.

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RT8096C

1A, 1.5MHz, 6V CMCOT Synchronous Step-Down Converter


General Description Features
The RT8096C is a high efficiency synchronous step-  Efficiency Up to 95%
down DC-DC converter. Its input voltage range is from  RDSON 160m HS / 110m LS
2.5V to 6V and provides an adjustable regulated output  VIN Range 2.5V to 6V
voltage from 0.6V to 3.4V while delivering up to 1A of  VREF 0.6V with 2% Accuracy
output current.  CMCOT ™ Control Loop Design for Best
Transient Response, Robust Loop Stability with
The internal synchronous low on-resistance power
Low-ESR (MLCC) COUT
switches increase efficiency and eliminate the need for
 Fixed Soft-Start 1.2ms; PGOOD Function in
an external Schottky diode. The Current Mode
TSOT-23-6
Constant-On-time (CMCOT) operation with internal
 Cycle-by-Cycle Over-Current Protection
compensation allows the transient response to be
 Input Under-Voltage Lockout
optimized over a wide range of loads and output
 Output Under-Voltage Protection (UVP Hiccup)
capacitors. The RT8096C is available in the TSOT-23-
 Thermal Shutdown Protection
5 and TSOT-23-6 packages.
 Power Saving at Light Load
Ordering Information
Applications
RT8096C  STB, Cable Modem, & xDSL Platforms
Package Type  LCD TV Power Supply & Metering Platforms
J5 : TSOT-23-5
J6 : TSOT-23-6  General Purpose Point of Load (POL)
Lead Plating System
G : Green (Halogen Free and Pb Free) Marking Information
UVP Trim Option RT8096CHGJ5
0P= : Product Code
H: Hiccup
0P=DNN DNN : Date Code
PWM/PSM Mode
C : PSM/PWM
RT8096CHGJ6
Note : 15= : Product Code
15=DNN DNN : Date Code
Richtek products are :
 RoHS compliant and compatible with the current
requirements of IPC/JEDEC J-STD-020.
 Suitable for use in SnPb or Pb-free soldering processes.

Simplified Application Circuit

RT8096C L
VIN VIN LX VOUT
CIN
EN R1 COUT
PG* FB
GND R2

*For TSOT-23-6 Package Only

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1
RT8096C
Pin Configuration
(TOP VIEW)

FB VIN FB PG VIN

5 4 6 5 4

2 3 2 3

EN GND LX EN GND LX

TSOT-23-5 TSOT-23-6

Functional Pin Description


Pin No.
Pin Name Pin Function
TSOT-23-5 TSOT-23-6
1 1 EN Enable control input.
2 2 GND Power ground.
3 3 LX Switch node.
4 4 VIN Supply voltage input. The RT8096C operates from a 2.5V to 6V input.
Feedback voltage input. An external resistor divider from the output to
5 6 FB
GND, tapped to the FB pin, sets the output voltage.
Power good indicator. The output of this pin is an open-drain with external
-- 5 PG pull-up resistor. PG is pulled up when the FB voltage is within 90%,
otherwise it is LOW.

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2
RT8096C
Functional Block Diagram
For TSOT-23-5 Package

EN

VIN
UVLO
Shut Down
Control LX
OTP Ton
VIN
Error Comparator
FB - Amplifier Logic
+ Control Driver LX
VREF + -
RC
CCOMP Current
Limit GND
Detector

Current LX
Sense

For TSOT-23-6 Package


EN

VIN
UVLO
Shut Down
Control LX
OTP Ton
VIN
Error
Amplifier Comparator
FB - Logic
+
VREF + Control Driver LX
RC -
CCOMP Current
Limit GND
Detector
+
Current LX
-
Sense

PG

Operation
The RT8096C is a synchronous low voltage step-down voltage with the internal 0.6V reference. When the load
converter that can support the input voltage range from current increases, it causes a drop in the feedback
2.5V to 6V and the output current can be up to 1A. The voltage relative to the reference, then the COMP
RT8096C uses a constant on-time, current mode voltage rises to allow higher inductor current to match
architecture. In normal operation, the high side P- the load current.
MOSFET is turned on when the switch controller is set
UV Comparator
by the comparator and is turned off when the Ton
comparator resets the switch controller. If the feedback voltage (VFB) is lower than threshold
voltage 0.2V, the UV comparator's output will go high
Low side MOSFET peak current is measured by internal
and the switch controller will turn off the high side
RSENSE. The error amplifier EA adjusts COMP voltage
MOSFET. The output under voltage protection is
by comparing the feedback signal (VFB) from the output
designed to operate in Hiccup mode.
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3
RT8096C
PGOOD Comparator
When the feedback voltage (VFB) is higher than
threshold voltage 0.54V, the PGOOD open drain output
will be high impedance. The internal PG MOSFET is
typical 100. The PGOOD signal delay time from EN is
about 2ms.

Enable Comparator
A logic-high enables the converter; a logic-low forces
the IC into shutdown mode.

Soft-Start (SS)
An internal current source charges an internal capacitor
to build the soft-start ramp voltage. The VFB voltage will
track the internal ramp voltage during soft-start interval.
The typical soft-start time is 1.2ms.

Over-Current Protection (OCP)


The RT8096C provides over-current protection by
detecting low side MOSFET valley inductor current. If
the sensed valley inductor current is over the current
limit threshold (1.5A typ.), the OCP will be triggered.
When OCP is tripped, the RT8096C will keep the over
current threshold level until the over current condition is
removed.

Thermal Shutdown (OTP)


The device implements an internal thermal shutdown
function when the junction temperature exceeds 150°C.
The thermal shutdown forces the device to stop
switching when the junction temperature exceeds the
thermal shutdown threshold. Once the die temperature
decreases below the hysteresis of 20°C, the device
reinstates the power up sequence.

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4
RT8096C
Absolute Maximum Ratings (Note 1)
 Supply Input Voltage -------------------------------------------------------------------------------------------- 0.3V to 6.5V
 LX Pin Switch Voltage------------------------------------------------------------------------------------------- 0.3V to (VIN + 0.3V)
<20ns ---------------------------------------------------------------------------------------------------------------- 4.5V to 9V
 Power Dissipation, PD @ TA = 25C
TSOT-23-5 --------------------------------------------------------------------------------------------------------- 0.43W
TSOT-23-6 --------------------------------------------------------------------------------------------------------- 0.5W
 Package Thermal Resistance (Note 2)
TSOT-23-5, JA --------------------------------------------------------------------------------------------------- 230.6C/W
TSOT-23-6, JA --------------------------------------------------------------------------------------------------- 197.4C/W
TSOT-23-5, JC --------------------------------------------------------------------------------------------------- 21.8C/W
TSOT-23-6, JC --------------------------------------------------------------------------------------------------- 18.9C/W
 Lead Temperature (Soldering, 10 sec.) --------------------------------------------------------------------- 260C
 Junction Temperature ------------------------------------------------------------------------------------------- 40C to 150C
 Storage Temperature Range ---------------------------------------------------------------------------------- 65C to 150C
 ESD Susceptibility (Note 3)
HBM (Human Body Model) ------------------------------------------------------------------------------------ 2kV

Recommended Operating Conditions (Note 4)


 Supply Input Voltage -------------------------------------------------------------------------------------------- 2.5V to 6V
 Ambient Temperature Range---------------------------------------------------------------------------------- 40C to 85C
 Junction Temperature Range --------------------------------------------------------------------------------- 40C to 125C

Electrical Characteristics
(VIN = 3.6V, TA = 25C, unless otherwise specified)
Parameter Symbol Test Conditions Min Typ Max Unit
Input Voltage VIN 2.5 -- 6 V
Feedback Reference Voltage VREF 0.588 0.6 0.612 V
Feedback Leakage Current IFB VFB = 0.6V -- -- 0.1 A
Active, VFB = 0.63V, not switching -- 22 --
DC Bias Current A
Shutdown -- -- 1
Switching Leakage Current -- -- 1 A
Switching Frequency -- 1.5 -- MHz
Switch On Resistance, High RPMOS ISW = 0.3A -- 160 -- m
Switch On Resistance, Low RNMOS ISW = 0.3A -- 110 -- m
Valley Current Limit ILIM 1.1 1.5 2 A

Under-Voltage Lockout VDD rising -- 2.25 2.5


VUVLO V
Threshold VDD falling -- 2 --
Over-Temperature Threshold -- 150 -- C

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RT8096C
Parameter Symbol Test Conditions Min Typ Max Unit

Enable Input Logic-High VIH 1.5 -- --


V
Voltage Logic-Low VIL -- -- 0.4

PG Pin Threshold FB rising -- 90 --


%
(relative to VOUT) FB falling -- 85 --
PG Open-Drain Impedance
-- -- 100 
(PG = low)
Soft-Start Time TSS -- 1.2 -- ms
Minimum Off Time -- 120 -- ns
Output Discharge Switch On
-- 1.8 -- k
Resistance
Note 1. Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These
are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated in
the operational sections of the specifications is not implied. Exposure to absolute maximum rating conditions may affect
device reliability.
Note 2. JA is measured at TA = 25C on a high effective thermal conductivity four-layer test board per JEDEC 51-7. The first
layer of copper area is filled. JC is measured at the top of the package.
Note 3. Devices are ESD sensitive. Handling precaution recommended.
Note 4. The device is not guaranteed to function outside its operating conditions.

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RT8096C
Typical Application Circuit

RT8096C L
VIN VIN LX VOUT
CIN R3
10μF 100k EN CFF* R1 COUT

PG* FB
GND R2

*For TSOT-23-6 Package Only


*CFF : Optional for performance fine-tune

Table 1. Suggested Component Values


VOUT (V) R1 (k) R2 (k) L (H) COUT (F)
3.3 90 20 1 to 3.3 10
1.8 100 50 1 to 3.3 10
1.5 100 66.6 1 to 3.3 10
1.2 100 100 1 to 3.3 10
1.05 100 133 1 to 3.3 10
1 100 148 1 to 3.3 10

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RT8096C
Typical Operating Characteristics
Efficiency vs. Output Current Efficiency vs. Output Current
100 100
90 90
80 VIN = 5V, VOUT = 3.3V 80 VIN = 5V, VOUT = 3.3V
70 VIN = 3.3V, VOUT = 1.2V 70 VIN = 3.3V, VOUT = 1.2V
Efficiency (%)

Efficiency (%)
60 60
50 50
40 40

30 30
20 20

10 10

0 0
0 0.2 0.4 0.6 0.8 1 0.001 0.01 0.1 1 10
Output Current (A) Output Current (A)

Output Voltage vs. Output Current Output Voltage vs. Output Current
1.28 3.40

1.26
3.38
1.24
Output Voltage (V)

Output Voltage (V)

3.36
1.22
3.34
1.20
3.32
1.18
3.30
1.16

1.14 3.28
VIN = 3.3V, VOUT = 1.2V VIN = 5V, VOUT = 3.3V
1.12 3.26
0 0.2 0.4 0.6 0.8 1 0 0.2 0.4 0.6 0.8 1
Output Current (A) Output Current (A)

Output Voltage vs. Input Voltage Output Voltage vs. Input Voltage
1.26 3.40

3.38
1.24
3.36
Output Voltage (V)

Output Voltage (V)

1.22
3.34
1.20 3.32

1.18 3.30

3.28
1.16
3.26
1.14
3.24
VIN = 3V to 5.5V, V OUT = 1.2V, IOUT = 1A VIN = 4.5V to 5.5V, V OUT = 3.3V, IOUT = 1A
1.12 3.22
3 3.5 4 4.5 5 5.5 4.5 4.6 4.7 4.8 4.9 5 5.1 5.2 5.3 5.4 5.5
Input Voltage (V) Input Voltage (V)

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RT8096C
Reference Voltage vs. Input Voltage Reference Voltage vs. Temperature
0.65 0.65
0.64
0.63
Reference Voltage (V)

0.63

Reference Voltage (V)


0.62
0.61 0.61

0.60
0.59 0.59

0.58
0.57 0.57

0.56 VIN = 3.6V, IOUT = 0.5A


VIN = 2.5V to 5.5V, IOUT = 1A
0.55 0.55
2.5 3 3.5 4 4.5 5 5.5 -50 -25 0 25 50 75 100 125
Input Voltage (V) Temperature (°C)

Switching Frequency vs. Temperature Shutdown Quiescent Current vs. Input Voltage
1.8 1.0
Shutdown Quiescent Current (μA)1
0.9
Switching Frequency (MHz)1

1.7
0.8
1.6 0.7
0.6
1.5 VIN = 5V, VOUT = 3.3V
0.5
1.4 VIN = 3.3V, VOUT = 1.2V
0.4
1.3 0.3
0.2
1.2
0.1
1.1 0.0
IOUT = 0.5A VEN = 0
1.0 -0.1
-50 -25 0 25 50 75 100 125 2.5 3 3.5 4 4.5 5 5.5
Temperature (°C) Input Voltage (V)

Shutdown Quiescent Current vs. Temperature Quiescent Current vs. Input Voltage
5.0 35
Shutdown Quiescent Current (μA)1

4.5
30
4.0
Quiescent Current (µA)

3.5 25

3.0
20
2.5
2.0 15

1.5 10
1.0
5
0.5 VEN = 0
0.0 0
-50 -25 0 25 50 75 100 125 2.5 3 3.5 4 4.5 5 5.5
Temperature (°C) Input Voltage(V)

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RT8096C
Quiescent Current vs. Temperature Current Limit vs. Input Voltage
40 3.0

35
2.5
Quiescent Current (µA)

30

Current Limit (A)


2.0
25 VIN = 5V

20 1.5
VIN = 3.3V
15
1.0
10
0.5
5
Valley Current
0 0.0
-50 -25 0 25 50 75 100 125 2.5 3 3.5 4 4.5 5 5.5
Temperature (°C) Input Voltage (V)

Current Limit vs. Temperature Input UVLO vs. Temperature


3.0 2.5
2.4
2.5
2.3
Turn On
Current Limit (A)

2.2
Input UVLO (V)

2.0
2.1
1.5 2.0
1.9
1.0
1.8 Turn Off

1.7
0.5
1.6
Valley Current VEN = 3.3V
0.0 1.5
-50 -25 0 25 50 75 100 125 -50 -25 0 25 50 75 100 125
Temperature (°C) Temperature (°C)

Load Transient Response


Enable Threshold vs. Temperature
1.4
VIN = 3.3V, VOUT = 1.2V,
IOUT = 0A to 1A, CFF = 22pF
1.2
VOUT
Enable Threshold (V) 1

1.0 (50mV/Div)
Enable On

0.8

0.6 Enable Off

0.4
IOUT
0.2 (500mA/Div)
VIN = 3.3V
0.0
-50 -25 0 25 50 75 100 125 Time (100s/Div)
Temperature (°C)

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RT8096C
Load Transient Response Voltage Ripple

VIN = 3.3V, VOUT = 1.2V,


IOUT = 0.5A to 1A, CFF = 22pF
VOUT
VOUT
(5mV/Div)
(20mV/Div)

IOUT VLX
(500mA/Div) (2V/Div)
VIN = 3.3V, VOUT = 1.2V, IOUT = 1A

Time (100s/Div) Time (500ns/Div)

Voltage Ripple Power On from EN

VOUT VEN
(5mV/Div) (5V/Div)
VPGOOD
(2V/Div)

VOUT
(1V/Div)

VLX IOUT
(2V/Div) (1A/Div)
VIN = 5V, VOUT = 3.3V, IOUT = 1A VIN = 3.3V, VOUT = 1.2V, IOUT = 1A

Time (500ns/Div) Time (500s/Div)

Power Off from EN Power On from EN

VEN
VEN
(5V/Div)
(5V/Div)
VPGOOD
(2V/Div) VPGOOD
(2V/Div)
VOUT
(1V/Div) VOUT
(2V/Div)
IOUT
IOUT
(1A/Div)
VIN = 3.3V, VOUT = 1.2V, IOUT = 1A (1A/Div) VIN = 5V, VOUT = 3.3V, IOUT = 1A

Time (10s/Div) Time (500s/Div)

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RT8096C
Power Off from EN

VEN
(5V/Div)

VPGOOD
(2V/Div)

VOUT
(2V/Div)
IOUT
(1A/Div) VIN = 5V, VOUT = 3.3V, IOUT = 1A

Time (10s/Div)

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RT8096C
Application Information
The RT8096C is a single-phase step-down converter. It voltage at the FB pin, causing PWM pulse width to
provides single feedback loop, constant on-time current increase slowly and in turn reduce the input surge
mode control with fast transient response. An internal current. The internal 0.6V reference takes over the loop
0.6V reference allows the output voltage to be precisely control once the internal ramping-up voltage becomes
regulated for low output voltage applications. A fixed higher than 0.6V.
switching frequency (1.5MHz) oscillator and internal
UVLO Protection
compensation are integrated to minimize external
component count. Protection features include over- The RT8096C has input Under Voltage Lockout
current protection, under-voltage protection and over- protection (UVLO). If the input voltage exceeds the
temperature protection. UVLO rising threshold voltage (2.25V typ.), the
converter resets and prepares the PWM for operation.
Output Voltage Setting If the input voltage falls below the UVLO falling
Connect a resistive voltage divider at the FB between threshold voltage during normal operation, the device
VOUT and GND to adjust the output voltage. The output will stop switching. The UVLO rising and falling
voltage is set according to the following equation : threshold voltage has a hysteresis to prevent noise-
caused reset.
VOUT = VREF   1 R1 
 R2  Inductor Selection
where VREF is the feedback reference voltage 0.6V The switching frequency (on-time) and operating point
(typ.). (% ripple or LIR) determine the inductor value as shown
below :
VOUT
VOUT   VIN  VOUT 
L=
R1 fSW  LIR  ILOAD(MAX)  VIN
FB
where LIR is the ratio of the peak-to-peak ripple current
R2
to the average inductor current.
GND
Find a low loss inductor having the lowest possible DC
resistance that fits in the allotted dimensions. The core
Figure 1. Setting VOUT with a Voltage Divider
must be large enough not to saturate at the peak
Chip Enable and Disable inductor current (IPEAK) :
The EN pin allows for power sequencing between the
IPEAK = ILOAD(MAX) +  LIR  ILOAD(MAX) 
controller bias voltage and another voltage rail. The  2 
RT8096C remains in shutdown if the EN pin is lower
The calculation above serves as a general reference.
than 400mV. When the EN pin rises above the VEN trip
To further improve transient response, the output
point, the RT8096C begins a new initialization and soft-
inductor can be further reduced. This relation should be
start cycle.
considered along with the selection of the output
Internal Soft-Start capacitor.
The RT8096C provides an internal soft-start function to Inductor saturation current should be chosen over IC’s
prevent large inrush current and output voltage current limit.
overshoot when the converter starts up. The soft-start
(SS) automatically begins once the chip is enabled.
During soft-start, the internal soft-start capacitor
becomes charged and generates a linear ramping up
voltage across the capacitor. This voltage clamps the
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RT8096C
Input Capacitor Selection For a given output voltage sag specification, the ESR
High quality ceramic input decoupling capacitor, such value can be determined.
as X5R or X7R, with values greater than 10F are Another parameter that has influence on the output
recommended for the input capacitor. The X5R and voltage sag is the equivalent series inductance (ESL).
X7R ceramic capacitors are usually selected for power The rapid change in load current results in di/dt during
regulator capacitors because the dielectric material has transient. Therefore, the ESL contributes to part of the
less capacitance variation and more temperature voltage sag. Using a capacitor with low ESL can obtain
stability. better transient performance. Generally, using several
Voltage rating and current rating are the key parameters capacitors connected in parallel can have better
when selecting an input capacitor. Generally, selecting transient performance than using a single capacitor for
an input capacitor with voltage rating 1.5 times greater the same total ESR.
than the maximum input voltage is a conservatively safe
Thermal Considerations
design.
For continuous operation, do not exceed absolute
The input capacitor is used to supply the input RMS
maximum junction temperature. The maximum power
current, which can be approximately calculated using
dissipation depends on the thermal resistance of the IC
the following equation :
package, PCB layout, rate of surrounding airflow, and
VOUT  VOUT  difference between junction and ambient temperature.
IIN_RMS = ILOAD   1
VIN  VIN  The maximum power dissipation can be calculated by
The next step is selecting a proper capacitor for RMS the following formula :
current rating. One good design uses more than one PD(MAX) = (TJ(MAX)  TA) / JA
capacitor with low equivalent series resistance (ESR) in where TJ(MAX) is the maximum junction temperature, TA
parallel to form a capacitor bank. is the ambient temperature, and JA is the junction to
The input capacitance value determines the input ripple ambient thermal resistance.
voltage of the regulator. The input voltage ripple can be For recommended operating condition specifications,
approximately calculated using the following equation : the maximum junction temperature is 125C. The
IOUT(MAX) VOUT  VOUT  junction to ambient thermal resistance, JA, is layout
VIN =   1
CIN  fSW VIN  VIN  dependent. For TSOT-23-5 package, the thermal
resistance, JA, is 230.6C/W on a standard four-layer
Output Capacitor Selection thermal test board. For TSOT-23-6 package, the
thermal resistance, JA, is 197.4C/W on a standard
The output capacitor and the inductor form a low pass
filter in the Buck topology. In steady state condition, the four-layer thermal test board. The maximum power
dissipation at TA = 25C can be calculated by the
ripple current flowing into/out of the capacitor results in
following formula :
ripple voltage. The output voltage ripple (VP-P) can be
calculated by the following equation : PD(MAX) = (125C  25C) / (230.6C/W) = 0.43W for
TSOT-23-5 package
VP_P = LIR  ILOAD(MAX)   ESR + 1 
 8  COUT  fSW  PD(MAX) = (125C  25C) / (197.4C/W) = 0.5W for
TSOT-23-6 package
When load transient occurs, the output capacitor
supplies the load current before the controller can The maximum power dissipation depends on the
respond. Therefore, the ESR will dominate the output operating ambient temperature for fixed TJ(MAX) and
voltage sag during load transient. The output voltage thermal resistance, JA. The derating curve in Figure 2
undershoot (VSAG) can be calculated by the following allows the designer to see the effect of rising ambient
equation : temperature on the maximum power dissipation.

VSAG = ILOAD  ESR


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RT8096C
1.0
Maximum Power Dissipation (W)1

Four-Layer PCB
0.9
0.8
0.7
0.6
0.5 TSOT-23-6

0.4
0.3 TSOT-23-5
0.2
0.1
0.0
0 25 50 75 100 125
Ambient Temperature (°C)

Figure 2. Derating Curve of Maximum Power


Dissipation

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RT8096C
Outline Dimension

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

TSOT-23-5 Surface Mount Package

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RT8096C

Dimensions In Millimeters Dimensions In Inches


Symbol
Min Max Min Max
A 0.700 1.000 0.028 0.039
A1 0.000 0.100 0.000 0.004
B 1.397 1.803 0.055 0.071
b 0.300 0.559 0.012 0.022
C 2.591 3.000 0.102 0.118
D 2.692 3.099 0.106 0.122
e 0.838 1.041 0.033 0.041
H 0.080 0.254 0.003 0.010
L 0.300 0.610 0.012 0.024

TSOT-23-6 Surface Mount Package

Richtek Technology Corporation


14F, No. 8, Tai Yuen 1st Street, Chupei City
Hsinchu, Taiwan, R.O.C.
Tel: (8863)5526789

Richtek products are sold by description only. Customers should obtain the latest relevant information and data sheets before placing orders and should verify that
such information is current and complete. Richtek cannot assume responsibility for use of any circuitry other than circuitry entirely embodied in a Richtek product.
Information furnished by Richtek is believed to be accurate and reliable. However, no responsibility is assumed by Richtek or its subsidiaries for its use; nor for any
infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights
of Richtek or its subsidiaries.
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