Micro-Electro-Mechanical
Systems
-The Future Technology, but Today’s choice
PRESENTED BY
NEELI SATYAPHANI KUMAR
07F91A0492
AIM OF MY PRESENTATION
To familiarize what the MEMS TECHNOLOGY is all about
To explain about Microfabrication Process.
Applications of the MEMS in various fields.
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Outline of My Presentation
Introduction
Historical Background
(MEMS Evolution)
Preparation Process of MEMS
(Fabrication Process)
Applications of MEMS
(Fields where MEMS Used)
Interrelationship between MEMS and Nano
(Future Scope of MEMS)
Conclusion
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Introduction
What is MEMS Technology?
MEMS technology is based on a number of tools and
methodologies, which are used to form small structures with
dimensions in the micrometer scale
MEMS fabrication approach that conveys the advantages of
miniaturization, multiple components, and microelectronics to the
design and construction of integrated Electromechanical systems
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Introduction Conti…
What are MEMS?
• Micro - Small size, microfabricated structures
• Electro - Electrical signal /control ( In / Out )
• Mechanical - Mechanical functionality (Out/ In )
• Systems - Structures, Devices, Systems controls
What is the size of MEMS?
They range in size from the sub micron level to the
millimeter level, and there can be any number, from a few
to millions, in a particular system.
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MEMS Scaling
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Building Blocks In MEMS
How MEMS are prepared?
There are three basic building blocks in MEMS technology.
1. Deposition: The ability to deposit thin films of
material on a substrate.
2. Lithography: To apply a patterned mask on top of
the films by photolithograpic imaging.
3. Etching: To etch the films selectively to the mask.
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MEMS Deposition Technology
MEMS deposition technology can be classified in two groups:
1. Depositions that happen because of a chemical reaction:
Chemical Vapor Deposition (CVD)
Electrodeposition
Epitaxy
Thermal oxidation
2. Depositions that happen because of a physical reaction:
Physical Vapor Deposition (PVD)
Casting
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MEMS Lithography Technology
MEMS lithography technology can be classified in two groups:
1. Pattern Transfer
2. Lithographic Module
a. Dehydration bake and HMDS prime
b. Resist spin/spray and Soft bake
c. Alignment, Exposure
d. Post exposure bake and Hard bake
e. Descum
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MEMS Etching Technology
There are two classes of etching process:
1. Wet etching: The material is dissolved when immersed in a
chemical solution.
2. Dry etching: The material is sputtered or dissolved using
reactive ions or a vapor phase etchant.
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Microfabrication Process
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Photolithography
Clean wafer : to remove particles on the surface as well as any traces of organic, ionic,
and metallic impurities
Dehydration bake: to drive off the absorbed water on the surface
Coating
Coat wafer with adhesion promoting film
Coat with photoresist
Soft bake : to drive off excess solvent and to promote adhesion
Exposure
Post exposure bake: to suppress standing wave-effect
Develop, Clean, Dry
Hard bake: to harden the PR and improve adhesion to the substrate
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Photolithography
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Additive Processes
Oxidation
Thermal Oxidation of Silicon is done in a furnace in wet or dry conditions
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Additive Processes
Doping
Dopants : N type (Phosphorous, Arsenic), P type (Boron)
Doping Methods
1. Diffusion
Dopants are diffused thermally into the
substrate in furnace at 950 – 1280 0C.
It is governed by Fick’s Laws of Diffusion.
2. Ion Implantation
Dopant ions bombarded into targeting
substrate by high energy.
Ion implantation are able to place any ion at
any depth in sample.
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Additive Processes
Physical Vapor Deposition (PVD)
1. Evaporation
Deposition is achieved by evaporation or
sublimation of heated metal onto substrate.
2. Sputtering
Sputtering is achieved by accelerated inert
ion by DC drive in plasma through potential
gradient to bombard metallic target.
Then the targeting material is sputtered away
and deposited onto substrate placed on
anode.
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Additive Processes
Physical Vapor Deposition (PVD)
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Additive Processes
Chemical Vapor Deposition (CVD)
Materials deposited: Polysilicon, silicon nitride, silicon oxide, silicon carbide etc.
How does CVD Work?
Gaseous reactants are introduced into chamber at elevated temperatures.
Reactant reacts and deposits onto substrate
Types of CVD
LPCVD (Low Pressure CVD),
PECVD (Plasma Enhanced CVD)
Salient Features
CVD results depend on pressure, gas, and temperature
Can be diffusion or reaction limited
Varies from film composition, deposition rate and electrical and mechanical properties
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Subtractive Processes
Dry Etching
Dry Chemical Etching
HF Etching
HF is a powerful etchant and hence, highly dangerous.
XeF2 Etching
2XeF2+Si→2Xe+SiF4
Isotropic etching (typically 1-3µm/min)
Does not attack aluminum, silicon dioxide, and silicon nitride
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Subtractive Processes
Dry Etching
Plasma Etching
Reaction Mechanism
Produce reactive species in gas-phase Reactive species diffuse to the solid
Adsorption, and diffuse over the surface Reaction Desorption Diffusion
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Subtractive Processes
Dry Etching
Deep Reactive Ion Etching (DRIE)
A very high-aspect-ratio silicon etch method
DRIE Etched Pillars
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Subtractive Processes
Wet Etching
Isotropic Wet Etching
Isotropic etchants etch in all directions at
nearly the same rate.
Commonly use chemical for Silicon is
HNA (HF/HNO3/Acetic Acid) This results in
a finite amount of undercutting
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Subtractive Processes
Wet Etching
Anisotropic Wet Etching
Anisotropic etchants etch much faster in one
direction than in another.
Etchants are generally Alkali Hydroxides
(KOH, NaOH, CeOH
Reaction :
Silicon (s) + Water + Hydroxide Ions → Silicates + Hydrogen
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Metal Patterning
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Surface Micromachining
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MEMS Packaging
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Example: An insulin pump fabricated by classic MEMS technology
1. Pumping membrane 2. Pumping chamber
3. Inlet 4. Outlet
5. Large mesa 6. Upper glass plate
7. Bottom glass plate 8. patterned thin layer (for improved fluidics)
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MEMS Applications
Micro-engines –Micro Reactors, Vibrating Wheel
Inertial Sensors –Virtual Reality Systems
Accelerometers –Airbag Accelerometer
Pressure Sensors –Air Pressure Sensors
Optical MEMS –Pill Camera
Fluidic MEMS -Cartridges for Printers
Bio MEMS -Blood Pressure Sensors
MEMS Memory Units -Flash Memory
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iPod Touch: Techno
Sensitiveness
The two key elements of a
MEMS are:
MEMS sensor, the silicon
mechanical element which
senses the motion;
Interface chip, the IC which
converts the motion
measured by the sensor into
an analog or digital signal.
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Bio MEMS Application
An implantable blood pressure
sensor developed by
CardioMEMS
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MEMS Memory [Nanochip]
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MEMS driven Storage Devices
TB to PB device capacities
Massively parallel data transfer
rates
Very fast file access times
Improved reliability
Smaller size and weight
Device costs less than today's
devices
Excellent fit for applications to
enterprise
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Future of Magnetic Storage
HAMR-Heat Assisted Magnetic Recording or TAR -Thermally
Assisted Recording
SOMA-Self Organized Magnetic Assemblies; a form of directed
patterned media.
Super high coercivity storage layers (such as FePt) with stable
grain sizes averaging < 2nm.
Super servos for (coarse/fine) tracking and flying height control.
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Advantages and Disadvantages
Minimize energy and materials Farm establishment requires
use in manufacturing huge investments
Cost/performance advantages Micro-components are Costly
Improved reproducibility compare to macro-components
Improved accuracy and Design includes very much
reliability complex procedures
Increased selectivity and Prior knowledge is needed to
sensitivity integrate MEMS devices
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Conclusion
The medical, wireless technology, biotechnology, computer,
automotive and aerospace industries are only a few that will
benefit greatly from MEMS.
This enabling technology promises to create entirely new
categories of products
MEMS will be the indispensable factor for advancing
technology in the 21st century
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References for MEMS
IEEE Explore http://ieeexplore.ieee.org/Xplore/DynWel.jsp
PDF Files http://www.scribd.com/mems/
Introduction to Microengineering
http://www.dbanks.demon.co.uk/ueng/
MEMS Clearinghouse
http://www.memsnet.org/
MEMS Exchange
http://www.mems-exchange.org/
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