690 FF
690 FF
LTC694/LTC695
Microprocessor
Supervisory Circuits
Features Description
n Guaranteed Reset Assertion at VCC = 1V The LTC®690 family, LTC690/LTC691/LTC694/LTC695,
n 1.5mA Maximum Supply Current provides complete power supply monitoring and battery
n Fast (35ns Max) Onboard Gating of RAM Chip control functions for microprocessor reset, battery back-
Enable Signals up, CMOS RAM write protection, power failure warning
n SO-8 and S16 Packaging and watchdog timing. A precise internal voltage reference
n 4.65V Precision Voltage Monitor and comparator circuit monitor the power supply line.
n Power OK/Reset Time Delay: 50ms, 200ms When an out-of-tolerance condition occurs, the reset
or Adjustable outputs are forced to active states and the chip enable
n Minimum External Component Count output unconditionally write-protects external memory.
n 1µA Maximum Standby Current In addition, the RESET output is guaranteed to remain
n Voltage Monitor for Power-Fail logic low even with VCC as low as 1V.
or Low Battery Warning
The LTC690 family powers the active CMOS RAMs with a
n Thermal Limiting
charge pumped NMOS power switch to achieve low drop
n Performance Specified Over Temperature
out and low supply current. When primary power is lost,
n Superior Upgrade for MAX690 Family
auxiliary power, connected to the battery input pin, powers
Applications the RAMs in standby through an efficient PMOS switch.
n Critical µP Power Monitoring For an early warning of impending power failure, the LTC690
n Intelligent Instruments family provides an internal comparator with a user-defined
n Battery-Powered Computers and Controllers threshold. An internal watchdog timer is also available, which
n Automotive Systems forces the reset pins to active states when the watchdog
input is not toggled prior to a preset timeout period.
L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear
Technology Corporation. All other trademarks are the property of their respective owners.
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Pin Configuration
TOP VIEW TOP VIEW
13 CE IN GND 4 13 CE IN
GND 4
BATT ON 5 12 CE OUT
BATT ON 5 12 CE OUT
LOWLINE 6 11 WDI
LOWLINE 6 11 WDI
OSC IN 7 10 PFO
OSC IN 7 10 PFO
OSC SEL 8 9 PFI
OSC SEL 8 9 PFI
SW PACKAGE
N PACKAGE 16-LEAD WIDE PLASTIC SO
16-LEAD PDIP TJMAX = 110°C, θJA = 130°C/W CONDITIONS: PCB MOUNT ON
TJMAX = 110°C, θJA = 130°C/W FR4 MATERIAL, STILL AIR AT 25°C, COPPER TRACE
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CHARGE
PUMP
–
C2 BATT ON
+
LOWLINE
+
C1
–
CE OUT
1.3V
GND
CE IN
–
C3 PFO
PFI +
RESET
OSC IN
OSC RESET PULSE
OSC SEL GENERATOR
RESET
WATCHDOG WDO
TRANSITION TIMER
WDI
DETECTOR 690 BD
Pin Functions
VCC: 5V Supply Input. The VCC pin should be bypassed GND: Ground pin.
with a 0.1µF capacitor. BATT ON: Battery On Logic Output from Comparator C2.
VOUT: Voltage Output for Backed Up Memory. Bypass with BATT ON goes low when VOUT is internally connected to
a capacitor of 0.1µF or greater. During normal operation, VCC. The output typically sinks 35mA and can provide
VOUT obtains power from VCC through an NMOS power base drive for an external PNP transistor to increase the
switch, M1, which can deliver up to 50mA and has a typical output current above the 50mA rating of VOUT. BATT ON
on resistance of 5Ω. When VCC is lower than VBATT, VOUT goes high when VOUT is internally switched to VBATT.
is internally switched to VBATT. If VOUT and VBATT are not PFI: Power Failure Input. PFI is the noninverting input
used, connect VOUT to VCC.
to the power-fail comparator, C3. The inverting input is
VBATT: Back-Up Battery Input. When VCC falls below VBATT, internally connected to a 1.3V reference. The power failure
auxiliary power, connected to VBATT, is delivered to VOUT output remains high when PFI is above 1.3V and goes
through PMOS switch, M2. If back-up battery or auxiliary low when PFI is below 1.3V. Connect PFI to GND or VOUT
power is not used, VBATT should be connected to GND. when C3 is not used.
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1.298
2.74
4.80
1.296
54 216 4.64
52 208 4.63
50 200 4.62
48 192 4.61
46 184 4.60
–50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125 –50 –25 0 25 50 75 100 125
TEMPERATURE (°C) TEMPERATURE (°C) TEMPERATURE (°C)
690 G04 690 G05 690 G06
VCC = 5V
PFO OUTPUT VOLTAGE (V)
VCC = 5V VCC = 5V
5 TA = 25°C 5 TA = 25°C 5 TA = 25˚C
4 4 4
3 VPFI + 3 3
PFO
2 1.3V – 30pF 2 VPFI + 2
PFO 5V
1 1 1.3V – 30pF 1
VPFI + 10k
0 0 0 PFO
1.3V – 30pF
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V2 V2
VCC V1 V1 = RESET VOLTAGE THRESHOLD V1
V2 = RESET VOLTAGE THRESHOLD +
RESET THRESHOLD HYSTERESIS
RESET t1 t1
LOW LINE
690 F01
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3 BATT ON 2 R
5V VCC VOUT
5V VCC VOUT
0.1µF LTC691 0.1µF
LTC695 0.1µF LTC690 0.1µF
1
VBATT LTC691
GND LTC694
3V
4 LTC695
VBATT
690 F02
3V GND
The LTC690 family is protected for safe area operation Figure 3. Charging External Battery Through VOUT
with short-circuit limit. Output current is limited to ap-
proximately 200mA. If the device is overloaded for long Replacing the Back-Up Battery
period of time, thermal shutdown turns the power switch
off until the device cools down. The threshold temperature When changing the back-up battery with system power
for thermal shutdown is approximately 155°C with about on, spurious resets can occur while battery is removed
10°C of hysteresis which prevents the device from oscil- due to battery standby current. Although battery standby
lating in and out of shutdown. current is only a tiny leakage current, it can still charge
up the stray capacitance on the VBATT pin. The oscillation
The PNP switch used in competitive devices was not chosen cycle is as follows: When VBATT reaches within 50mV of
for the internal power switch because it injects unwanted VCC, the LTC690 switches to battery back-up. VOUT pulls
current into the substrate. This current is collected by the VBATT low and the device goes back to normal operation.
VBATT pin in competitive devices and adds to the charging The leakage current then charges up the VBATT pin again
current of the battery which can damage lithium batteries. and the cycle repeats.
The LTC690 family uses a charge pumped NMOS power
switch to eliminate unwanted charging current while If spurious resets during battery replacement pose no
achieving low dropout and low supply current. Since no problems, then no action is required. Otherwise, a resistor
current goes to the substrate, the current collected by from VBATT to GND will hold the pin low while changing
VBATT pin is strictly junction leakage. the battery. For example, the battery standby current is
1µA maximum over temperature and the external resistor
A 125Ω PMOS switch connects the VBATT input to VOUT required to hold VBATT below VCC is:
in battery back-up mode. The switch is designed for very
low dropout voltage (input-to-output differential). This VCC − 50mV
R≤
feature is advantageous for low current applications such 1µA
as battery back-up in CMOS RAM and other low power
With VCC = 4.5V, a 4.3M resistor will work. With a 3V bat-
CMOS circuitry. The supply current in battery back-up
tery, this resistor will draw only 0.7µA from the battery,
mode is 1µA maximum.
which is negligible in most cases.
The operating voltage at the VBATT pin ranges from 2.0V
to 4.25V. High value capacitors, such as electrolytic or
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10Ω
CE IN can be derived from the microprocessor’s address
VBATT decoder output. Figure 6 shows a typical nonvolatile CMOS
4.3M 0.1µF LTC690 RAM application.
LTC691
LTC694
LTC695 Memory protection can also be achieved with the LTC690
and LTC694 by using RESET as shown in Figure 7.
GND
690 F04
Table 1. Input and Output Status in Battery Back-Up Mode
SIGNAL STATUS
Figure 4. 10Ω/0.1µF Combination Eliminates Inductive VCC C2 monitors VCC for active switchover.
Overshoot and Prevents Spurious Resets During Battery
VOUT VOUT is connected to VBATT through an internal PMOS switch.
Replacement
VBATT The supply current is 1µA maximum.
Table 1 shows the state of each pin during battery back-up. BATT ON Logic high. The open-circuit output voltage is equal to VOUT .
When the battery switchover section is not used, connect PFI Power failure input is ignored.
VBATT to GND and VOUT to VCC . PFO Logic low
RESET Logic low
Memory Protection RESET Logic high. The open-circuit output voltage is equal to VOUT.
The LTC691 and LTC695 include memory protection cir- LOWLINE Logic low
cuitry that ensures the integrity of the data in memory by WDI Watchdog input is ignored.
preventing write operations when VCC is at invalid level. WDO Logic high. The open-circuit output voltage is equal to VOUT.
Two additional pins, CE IN and CE OUT, control the Chip CE IN ChipEnable Input is ignored.
Enable or Write inputs of CMOS RAM. When VCC is 5V, CE OUT Logic high. The open-circuit output voltage is equal to VOUT.
CE OUT follows CE IN with a typical propagation delay of OSC IN OSC IN is ignored.
20ns. When VCC falls below the reset voltage threshold or OSC SEL OSC SEL is ignored.
VBATT, CE OUT is forced high, independent of CE IN. CE
OUT is an alternative signal to drive the CE, CS, or Write
V2
VCC V1 V1 = RESET VOLTAGE THRESHOLD
V2 = RESET VOLTAGE THRESHOLD +
RESET THRESHOLD HYSTERESIS
CE IN
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R2 = 9.7kΩ, Choose nearest 5% resistor 10k and recalcu OPTIONAL TEST LOAD
late VL,
Figure 10. Back-Up Battery Monitor with Optional Test Load
51k (5V − 1.3V) 51k
VL = 1.3V 1+ − = 7.32V
10k 1.3V (310k)
Watchdog Timer
51k 51k The LTC690 family provides a watchdog timer function
VH = 1.3V 1+ − = 8.151V to monitor the activity of the microprocessor. If the mi-
10k 300k
croprocessor does not toggle the Watchdog Input (WDI)
(7.32V − 6.25V) within a selected timeout period, RESET is forced to ac-
= 10.7ms tive low for a minimum of 35ms for the LTC690/LTC691
100mV / ms
(140ms for the LTC694/LTC695). The reset active time is
VHYSTERESIS = 8.151V − 7.32V = 831mV adjustable on the LTC691/LTC695. Since many systems
can not service the watchdog timer immediately after a
The 10.7ms allows enough time to execute shutdown reset, the LTC691 and LTC695 have longer timeout period
procedure for microprocessor and 831mV of hysteresis (1.0 second minimum) right after a reset is issued. The
would prevent PFO from going low due to the noise of VIN. normal timeout period (70ms minimum) becomes effective
Example 2: The circuit in Figure 9 can be used to measure following the first transition of WDI after RESET is inac-
the regulated 5V supply to provide early warning of power tive. The watchdog timeout period is fixed at 1.0 second
failure. Because of variations in the PFI threshold, this minimum on the LTC690 and LTC694. Figure 11 shows
circuit requires adjustment to ensure the PFI compara- the timing diagram of watchdog timeout period and reset
tor trips before the reset threshold is reached. Adjust R5 active time. The watchdog timeout period is restarted as
such that the PFO output goes low when the VCC supply soon as RESET is inactive. When either a high-to-low
reaches the desired level (e.g., 4.85V). or low-to-high transition occurs at the WDI pin prior to
timeout, the watchdog time is reset and begins to time
Monitoring the Status of the Battery out again. To ensure the watchdog time does not time
C3 can also monitor the status of the memory back-up out, either a high-to-low or low-to-high transition on the
battery (Figure 10). If desired, the CE OUT can be used to WDI pin must occur at or less than the minimum timeout
apply a test load to the battery. Since CE OUT is forced high period. If the input to the WDI pin remains either high or
in battery back-up mode, the test load will not be applied low, reset pulses will be issued every 1.6 seconds typically.
to the battery while it is in use, even if the microprocessor The watchdog time can be deactivated by floating the WDI
is not powered. pin. The timer is also disabled when VCC falls below the
reset voltage threshold or VBATT.
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t2 t3
RESET
t1 t1
690 F11
LTC691 LTC691
LTC695 LTC695
4 7 4 7
GND OSC IN GND OSC IN
3 8 FLOATING 3 8 FLOATING
5V VCC OSC SEL 5V VCC OSC SEL
OR HIGH OR HIGH
LTC691 LTC691
LTC695 LTC695
4 7 FLOATING 4 7
GND OSC IN OR HIGH GND OSC IN
690 F12
Pushbutton Reset
The LTC690 family does not provide a logic input for direct 5V VCC RESET RESET
connection to a pushbutton. However, a pushbutton in 0.1µF 100Ω MPU
series with a 100Ω resistor connected to the RESET output LTC690/LTC691
LTC694/LTC695 (e.g. 6805)
pin (Figure 13) provides an alternative for manual reset.
Connecting a 0.1µF capacitor to the RESET pin debounces GND 690 F13
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SW Package
16-Lead Plastic Small Outline (Wide .300 Inch)
(Reference LTC DWG # 05-08-1620)
1 2 3 N/2 N/2
.291 – .299
(7.391 – 7.595)
NOTE 4 .037 – .045
.093 – .104
.010 – .029 × 45° (0.940 – 1.143)
(2.362 – 2.642)
(0.254 – 0.737)
.005
(0.127)
RAD MIN 0° – 8° TYP
.050
.009 – .013 (1.270) .004 – .012
(0.229 – 0.330) NOTE 3 BSC (0.102 – 0.305)
.014 – .019
.016 – .050
(0.356 – 0.482)
(0.406 – 1.270)
TYP
NOTE:
INCHES
1. DIMENSIONS IN S16 (WIDE) 0502
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. PIN 1 IDENT, NOTCH ON TOP AND CAVITIES ON THE BOTTOM OF PACKAGES ARE THE MANUFACTURING OPTIONS.
THE PART MAY BE SUPPLIED WITH OR WITHOUT ANY OF THE OPTIONS
4. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm)
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N Package
8-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.400*
.300 – .325 .045 – .065 .130 ±.005
(10.160)
MAX (7.620 – 8.255) (1.143 – 1.651) (3.302 ±0.127)
8 7 6 5
.065
(1.651)
.255 ±.015* .008 – .015 TYP
(6.477 ±0.381) (0.203 – 0.381) .120
(3.048) .020
+.035 MIN (0.508)
.325 –.015
MIN
( )
1 2 3 4 .100 .018 ±.003
+0.889 (2.54)
8.255 (0.457 ±0.076) N8 REV I 0711
–0.381
BSC
NOTE:
INCHES
1. DIMENSIONS ARE
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
S8 Package
8-Lead Plastic Small Outline (Narrow .150 Inch)
(Reference LTC DWG # 05-08-1610 Rev G)
.189 – .197
.045 ±.005 (4.801 – 5.004)
.050 BSC NOTE 3
8 7 6 5
.245
MIN .160 ±.005
.150 – .157
.228 – .244
(3.810 – 3.988)
(5.791 – 6.197)
NOTE 3
.030 ±.005
TYP
1 2 3 4
RECOMMENDED SOLDER PAD LAYOUT
.010 – .020
× 45° .053 – .069
(0.254 – 0.508)
(1.346 – 1.752)
.004 – .010
.008 – .010
0°– 8° TYP (0.101 – 0.254)
(0.203 – 0.254)
.016 – .050
.014 – .019 .050
(0.406 – 1.270)
(0.355 – 0.483) (1.270)
NOTE: TYP BSC
INCHES
1. DIMENSIONS IN
(MILLIMETERS)
2. DRAWING NOT TO SCALE
3. THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .006" (0.15mm) SO8 REV G 0212
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N Package
16-Lead PDIP (Narrow .300 Inch)
(Reference LTC DWG # 05-08-1510 Rev I)
.770*
(19.558)
MAX
16 15 14 13 12 11 10 9
.255 ±.015*
(6.477 ±0.381)
1 2 3 4 5 6 7 8
.020
(0.508)
MIN .065
.008 – .015
(1.651)
(0.203 – 0.381) TYP
+.035
.325 –.015
.120
( )
.100 .018 ±.003
+0.889 (3.048) (2.54) (0.457 ±0.076)
8.255
–0.381 MIN BSC N16 REV I 0711
NOTE:
INCHES
1. DIMENSIONS ARE
MILLIMETERS
*THESE DIMENSIONS DO NOT INCLUDE MOLD FLASH OR PROTRUSIONS.
MOLD FLASH OR PROTRUSIONS SHALL NOT EXCEED .010 INCH (0.254mm)
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CS2
VCC
0.1µF 62128
RAM C
CSC CS1
CS2
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