SYSTEM-ON-CHIP
(SOC)
Presented by:-
Ashlesha Chopane 202101070109
Ashlesh Ghodke 202101070115
Sanika Thakare 202101070120
CONTENTS
• Introduction
• Architecture
• Key Features
• Applications
• Design Challenges and approaches
• Conclusion
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INTRODUCTION
SYSTEM-ON-CHIP (SOC)
• SoC integrates multiple system components onto a single chip, combining
functionalities that were traditionally on separate chips.
• System-on-Chip (SoC) is a design paradigm that integrates an entire system’s
components onto a single chip, encapsulating multiple functions, previously
distributed across separate chips, within one integrated circuit (IC).
• This allows SoCs to power complex devices in compact form factors, maximizing
performance while minimizing space and energy requirements
• Purpose: Enables compact, efficient, and high-performance devices.
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ARCHITECTURE
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SYSTEM-ON-CHIP (SOC)
ARCHITECTURE
• ARM Processor: The central processing unit for executing commands.
• Voltage Regulator: Manages power distribution across components.
• System Controller: Includes modules like PLL, power management, timers,
watchdog, and debugging controls.
• Memory Controller: Interfaces with memory units such as SRAM and Flash.
• Peripheral Interfaces: Includes Ethernet MAC, USART, SPI, CAN, USB, PWM, and
other communication interfaces.
• Peripheral Data Controller: Manages data flow between peripherals and memory.
• Application Specific Logic: Custom logic for specific application needs.
• JTAG and PIO (Parallel Input/Output): Used for programming and interfacing
external connections.
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CORE COMPONENTS
• Processor: Main controller;
may include
microprocessors, DSPs.
• Memory: RAM (volatile) and
ROM (non-volatile) for data
storage.
• Network Interface:
Connects all blocks,
facilitating internal
communication.
• GPU and Peripherals:
Handles visual tasks,
supports interfaces
like USB, HDMI.
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KEY FEATURES
• Compact Design: Reduces space, consolidates multiple functions.
• Power Efficiency: Minimizes data movement between chips, saving
energy.
• Customization: Allows integration of specific parts for various
applications.
• High Performance: Reduces latency and improves data transfer.
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APPLICATIONS
• Consumer Electronics: Powers smartphones, tablets, smart TVs.
• Automotive: Supports ADAS and infotainment systems.
• IoT and Wearables: Enables smart devices, industrial sensors.
• Healthcare: Used in portable diagnostics, patient monitoring.
• Telecommunications & Computing: Found in routers, data centers.
• Industrial Automation and Robotics: Controls automation systems and robots with real-time
processing and reliability.
• Computing and Data Centers: Drives edge computing and high-performance computing with
integrated multi-core processing.
• Smart Home Devices: Supports smart appliances, security systems, and voice assistants with
seamless connectivity. 9
DESIGN CHALLENGES AND
APPROACHES
• Challenges: Complex design processes, power management, component
integration.
• Solutions:
• Platform-Based Design: Reuses hardware and software components for cost-
effective, rapid development.
• Power Management: Techniques like dynamic voltage scaling.
• Verification: Hierarchical testing ensures each component works as intended.
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CONCLUSION
• System-on-Chip (SoC) technology has transformed electronics by integrating multiple
components—such as processors, memory, and interfaces—onto a single chip, enhancing
performance, space efficiency, and power savings.
• This compact design is ideal for a wide range of applications, including consumer
electronics, automotive systems, and IoT devices. SoCs are cost-effective, customizable,
and scalable, making them essential in advancing fields like AI and autonomous systems.
• While their design presents challenges in integration and verification, SoCs hold great
promise for future innovations in efficient, high-performance, and multifunctional devices
across various industries.
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THANK YOU
