Project Report
Construction of a Projection
Lithography Device
Abhinay Agarwal (2021B5A82953G)
November 23, 2024
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C ONTENTS
1 Introduction 3
1.1 Objective . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
2 Theory and Concepts 5
2.1 Projection Lithography . . . . . . . . . . . . . . . . . . . . . . . . 5
2.2 Key Components of a Projection Lithography System . . . . . . 5
2.3 The Reverse Microscopy Concept . . . . . . . . . . . . . . . . . 6
2.4 Lens Selection and Focusing . . . . . . . . . . . . . . . . . . . . 6
2.5 Applications of Projection Lithography . . . . . . . . . . . . . . 6
3 Design , Methodology and Results 8
3.1 CAD Design for Lens Holder and Screen System . . . . . . . . . 8
3.2 Explaining the setup . . . . . . . . . . . . . . . . . . . . . . . . . 10
4 Conclusion 14
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1 I NTRODUCTION
Projection optical lithography has been the mainstream technology in the
semiconductor industry for more than two decades. Despite prognostications
to the contrary, it has been able to keep up with the expectations of Moore’s
Law and the semiconductor industry’s roadmap. In fact, it has enabled the
shrinking of critical dimensions to the sub-100 nm region, and current trends
will keep it on course to at least 45 nm, i.e., to at least the year 2010. It is
plausible to expect that new inventions will keep optical lithography as the
dominant process well into the next decade.
While other lithographies may face challenges in throughput, yield, or cost,
optical lithography has faced its toughest hurdles in enabling high resolution.
By its very definition, optical lithography employs photons in the optical
regime, and the wave nature of light dictates that diffraction limits the pat-
terning resolution to a certain fraction of the wavelength. This appears to be
a fundamental limit that cannot be overcome. In light of this argument, the
continued success of optical lithography is indeed remarkable. This paper
will focus on the means that optical lithography has employed to enable ever-
increasing resolution and on the prospects to continue doing so in the future.
As will be noted throughout, materials issues have played a key role in the
evolution of optical lithography.
The essential components of projection optical lithography are represented
in Figure 1.1. As in any lithography, the goal is to generate a desired pattern
in a thin layer of resist on the Si wafer. In order to do so, a related pattern
is formed on a photomask, and a sophisticated imaging system projects the
photomask pattern onto the photoresist. Typically, the pattern on the pho-
tomask is larger than the final pattern in the photoresist, and the projection
lens system provides a demagnification ratio, 4x in most systems. In addi-
tion to the photomask, the projection lens, and the photoresist, at least two
other components must be included in any analysis of an optical lithographic
system: the radiation source and the illumination geometry.
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Figure 1.1: Schematic of projection optical lithography system
1.1 O BJECTIVE
This project focuses on the development of a projection lithography device
that incorporates reverse imaging. By treating the traditional image plane of
a microscope lens as the object plane and vice versa, highly focused point
images can be produced. This will lead to enhanced precision in pattern
projection and microfabrication processes.
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2 T HEORY AND C ONCEPTS
2.1 P ROJECTION L ITHOGRAPHY
Projection lithography uses light to project a pattern onto a photoresist-
covered wafer. The wave nature of light imposes diffraction limits, which
historically have presented challenges to achieving high resolution. However,
advances in materials and optics have allowed lithography to maintain its
place as the dominant technology in the field.
2.2 K EY C OMPONENTS OF A P ROJECTION L ITHOGRAPHY S YSTEM
A projection lithography system consists of several essential components that
work together to achieve precise patterning on a photoresist-covered wafer.
These components are as follows:
1. Photomask: The photomask contains the pattern to be transferred
onto the wafer. It is typically a glass plate with a thin metal coating that
defines the desired shapes. The pattern on the photomask is usually
larger than the final projected image, requiring demagnification.
2. Projection Lens System: The projection lens is responsible for imaging
the pattern from the photomask onto the wafer. It provides a demagnifi-
cation ratio, commonly 4:1 or 5:1, ensuring the reduced pattern size on
the wafer while maintaining high resolution and alignment accuracy.
3. Radiation Source: A stable and coherent radiation source is critical for
illuminating the photomask. Common sources include mercury lamps,
excimer lasers, or other UV light sources, depending on the wavelength
requirements of the system.
4. Illumination System: This system ensures uniform illumination of the
photomask. It may include optical components such as collimators,
lenses, and mirrors to optimize light distribution.
5. Photoresist: The photoresist is a light-sensitive material applied to the
wafer. When exposed to light, it undergoes chemical changes, allowing
selective patterning during the subsequent development process.
6. Wafer Stage: The wafer stage holds and moves the wafer during the
lithography process. It requires high precision and stability to ensure
proper alignment of the projected pattern with the existing features on
the wafer.
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Each of these components plays a critical role in achieving the resolution,
accuracy, and throughput required in modern microfabrication processes.
2.3 T HE R EVERSE M ICROSCOPY C ONCEPT
Unlike traditional optical microscopy, where light travels from the sample
to the viewer’s eye or camera, reverse microscopy in projection lithography
involves the following:
• Reverse Light Path: Light originates from the source, passes through
or reflects off the mask, and is projected onto the wafer. This "reverse"
nature ensures the mask acts as the source for the final imaging.
• Reduction Projection: Modern systems use a reduction ratio (e.g., 4:1
or 5:1), meaning the image on the mask is larger than the final pattern
projected onto the wafer.
The term reverse microscopy emphasizes this reversed optical pathway
compared to standard microscopy setups.
2.4 L ENS S ELECTION AND F OCUSING
The focusing ability of the lens depends on curvature, refractive index, and
the distance between the lens and object. By optimizing these variables, a
sharp image focus can be achieved for accurate pattern projection.
2.5 A PPLICATIONS OF P ROJECTION L ITHOGRAPHY
Projection lithography is a cornerstone technology in microfabrication, with
wide-ranging applications in industries that rely on advanced semiconductor
devices and nanotechnology. Its ability to produce highly precise and intri-
cate patterns has enabled numerous technological advancements. Some key
applications include:
1. Semiconductor Manufacturing: Projection lithography is the primary
method for producing integrated circuits (ICs). It is used to create the in-
tricate patterns of transistors, interconnects, and other components on
silicon wafers. The continued scaling of feature sizes, following Moore’s
Law, has been made possible through advances in lithographic tech-
niques such as deep ultraviolet (DUV) and extreme ultraviolet (EUV)
lithography.
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2. Microelectromechanical Systems (MEMS): MEMS devices, such as sen-
sors, actuators, and microfluidic systems, rely on projection lithography
for precise fabrication. These devices find applications in automotive
systems, medical diagnostics, and consumer electronics, where minia-
turization and accuracy are critical.
3. Photonics and Optoelectronics: Projection lithography is used in the
fabrication of optical devices such as waveguides, photonic crystals,
and light-emitting diodes (LEDs). These components are essential for
communication systems, displays, and advanced imaging technologies.
4. Advanced Packaging: In modern electronics, advanced packaging tech-
niques such as flip-chip and fan-out wafer-level packaging (FOWLP)
use projection lithography for creating fine interconnect patterns. This
enhances the performance and density of electronic systems while
reducing their size.
5. Nanotechnology and Research: Projection lithography is widely used
in research to fabricate nanostructures for experimental studies. Appli-
cations include quantum computing, nanoscale sensors, and materials
science, where precise patterning at the nanoscale is essential.
6. Displays and Flat-Panel Technology: The manufacturing of flat-panel
displays, including liquid crystal displays (LCDs) and organic light-
emitting diodes (OLEDs), relies on projection lithography for patterning
electrode arrays and pixel structures with high accuracy.
7. Biomedical Devices: In biomedical engineering, projection lithogra-
phy enables the fabrication of lab-on-a-chip devices, biosensors, and
other microfluidic systems. These devices are critical for point-of-care
diagnostics and drug discovery.
The versatility and precision of projection lithography have made it indis-
pensable in these and many other fields. Ongoing research and technological
innovations continue to expand its capabilities and applications, driving
advancements in both industry and academia.
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3 D ESIGN , M ETHODOLOGY AND R ESULTS
3.1 CAD D ESIGN FOR L ENS H OLDER AND S CREEN S YSTEM
The lithography device design consists of a lens holder and screen system,
mounted on an adjustable rail. This allows for precise control over the dis-
tance between the lens and the screen, an essential factor in optimizing focus.
Figure 3.1: CAD design of the lens holding system
Figure 3.2: CAD design of the screen system with adjustable rail
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This design was not very helpful in making observation for the lens system
,So a new design which looks like horizontal setup was made
Figure 3.3: CAD design of the lens holder
Figure 3.4: CAD design of the base to fit in lens holder
these designs were fed to 3D printer for making the lens holding equipment
which looked like this.
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Figure 3.5: 3D printed lens holder
3.2 E XPLAINING THE SETUP
• This holder was used to fit in the lens (5X lens of the microscope) and
then the setup was made as shown.
• The setup consists of a light source for illumination of light , a transpar-
ent stamp or small tape , a lens and a screen .
• the setup made in Horizontal direction to see the object image charac-
teristics of the reverse microscopy and some observations were made
of the image distance to the corresponding object distance.
• A transparent tape or object was used to see the casting of the image
clearly.
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Figure 3.6: The experimental setup.
This setup was used for observations.The light source was switched on
and light source traveled through the transparent film and then through the
microscope lens and the image was observed at the Screen. This method
would produce the diminished image of the film on the screen and the
same was observed .An experiment was done in which image distance was
recorded corresponding to different object distances.
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Figure 3.7: a object to be casted
Table 3.1: Object and Image Distances (without the film only on light source)
Object Distance (cm) Image Distance (cm)
30 2
23 3.4
20 1.3
17 2
4 8
1 -0.5
Table 3.2: Object and Image Distances (observing the film image)
Object Distance (cm) Image Distance (cm)
6.5 3.3
9 2.2
17 1.8
19.5 1
23.5 0.7
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8 First Table
Image Distance (cm)
6
0 5 10 15 20 25 30
Object Distance (cm)
Figure 3.8: Graph of Object vs. Image Distance (only on light source)
Second Table
Image Distance (cm)
6 8 10 12 14 16 18 20 22 24
Object Distance (cm)
Figure 3.9: Graph of Object vs. Image Distance (observing the film image)
The second table and grpah was made on the setup in which the resolved
image of thin film was being observed (shown in Figure 3.10
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Figure 3.10: other view of setup
4 C ONCLUSION
In this project, The experimental setup, including a custom-designed lens
holder and screen system, was carefully developed and tested. Through
a series of object and image distance measurements, critical insights into
the behavior of the optical system were gathered, validating the projection
capabilities of the device. While the project reached a significant milestone
with the accurate construction of the setup and initial lens readings, further
work is required to optimize the alignment, refine the imaging process, and
fully evaluate the performance of the lithography system. This project serves
as a foundation for exploring advanced microfabrication techniques and
contributes to a deeper understanding of optical lithography principles.
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