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Analog Design Day1

The document provides an introduction to MOS device modeling and current mirrors using LTspice, covering the basics of analog IC design and the functionalities of LTspice for circuit simulation. It includes step-by-step instructions on creating and simulating simple RC circuits, as well as advanced features like AC analysis and parameter stepping. Additionally, it highlights the advantages of using MOSFETs in mixed-signal circuits and the historical context of their development.

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pandiammalkrp
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© © All Rights Reserved
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0% found this document useful (0 votes)
32 views139 pages

Analog Design Day1

The document provides an introduction to MOS device modeling and current mirrors using LTspice, covering the basics of analog IC design and the functionalities of LTspice for circuit simulation. It includes step-by-step instructions on creating and simulating simple RC circuits, as well as advanced features like AC analysis and parameter stepping. Additionally, it highlights the advantages of using MOSFETs in mixed-signal circuits and the historical context of their development.

Uploaded by

pandiammalkrp
Copyright
© © All Rights Reserved
We take content rights seriously. If you suspect this is your content, claim it here.
Available Formats
Download as PDF, TXT or read online on Scribd
You are on page 1/ 139

MOS Device Modeling and Simple Current Mirrors

with LT Spice

Sensitivity: LNT Construction Internal Use


CONTENTS

• Introduction to Analog IC Design


1

• Fundamentals of MOS Device and simple


2 Current Miiror

• Mos Transistor Modeling with LTSpice


3

• Analysis of Current Miiror with LTSpice


4

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GETTING STARTED WITH LTspice XVII

3
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SPICE

• Simulation Program with Integrated


Circuit Emphasis
• Developed in 1973 by Laurence Nagel at
UC Berkeley’s Electronics Research
Laboratory
• Dependent on user defined device
models

Sensitivity: LNT Construction Internal Use


LTspice
• Developed in 1998 by Mike Engelhardt at Linear
Technology Corporation
• GUI, simulator, and schematic -> netlist for SPICE
• FREE and comes with tons of models

Sensitivity: LNT Construction Internal Use


How Do I Get LTspice and Documentation?

❖ Go to http://www.analog.com/LTspice
❖ Left-Click on Download LTspice for Windows 7, 8 and 10
❖ Follow the instructions to install
❖ LTspice is a standalone application that runs on your computer

❖ At this link, you will also find:


✓ LTspice Download Links
✓ LTspice Demo Circuits
✓ LTspice Documentation
✓ LTspice Technical Articles & Videos
✓ SPICE Models

Sensitivity: LNT Construction Internal Use


Why Use LTspice?
 2500+ macromodels of Legacy Linear Technology
products
• Stable SPICE circuit simulation with:  1500+ power products
• Unlimited number of nodes  300+ Legacy ADI Products (power and amps)
• Schematic/symbol editor
• Waveform viewer
• Library of passive devices
• Steady state detection
SPICE = Simulation Program with
• Turn on transient
Integrated Circuit Emphasis
• Step response
• Efficiency / power computations
• Advanced analysis and simulation options

• Outperforms or as powerful as pay-for tools


• In other words LTspice is free!
• Automatically builds syntax for common tasks
LTspice is also a great schematic capture / BOM tool

Sensitivity: LNT Construction Internal Use


StartUsing
With athe Schematic
New Editor in LTspice
Schematic

• To open up a blank schematic screen select “File” Menu and “New


Schematic”

Blank schematic
a.k.a.
MasterPiece in progress

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Toolbar and Keyboard Shortcuts
Place Circuit Element [F2]
Zoom In Place Diode [D]
Pan Place Inductor [L]
Zoom Out Place Capacitor [C]
Autoscale Place Resistor [R]
Label Node [F4]
Place Ground [G]
Draw Wire [F3]

Move [F7]
Drag [F8]
Undo [F9]
Delete [Del] Redo [Shift+F9]
Duplicate [Ctrl+C] Rotate [Ctrl+R]
Paste b/t Schematics [Ctrl+V] Mirror [Ctrl+E]
Find [Ctrl+F] Place Comment/text [T]
Place SPICE directive [S]

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How to Wire up a Simple RC Circuit
• Step 1: Open up a blank schematic screen
• Select “File” Menu and “New Schematic”

Sensitivity: LNT Construction Internal Use


Adding Components
Devices besides basic resistors, capacitors, and
inductors are found from this button

Lecture 4 6.101 Spring 2020


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Editing Components

Just right click the


component

Lecture 4 6.101 Spring 2020 12


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Editing Components

But what
about this?
This is the basic voltage source menu.
Use this for DC sources such as power
supplies or bias voltages.

Lecture 4 6.101 Spring 2020 13


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Editing Components

Voltage sources can produce many test signals.


PWL can be used to construct any signal.

Lecture 4 6.101 Spring 2020 14


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Selecting Device Model
There are no “ideal” BJT’s, MOSFET’s, etc. You can select a model
(provided by LTspice), download models, or create your own.

Lecture 4 6.101 Spring 2020


Sensitivity: LNT Construction Internal Use
How to Wire up a Simple RC Circuit
• Step 2: Add the passives and grounds
• Using the toolbar, select Resistor, Capacitor and Ground. Place these symbols on the
schematic as shown below. Use Ctrl+R to rotate before placement.

Select and place


res, cap & GND, or
use keyboard keys
R, C, and G
Tip: Ctrl+R to rotate
before placement

Sensitivity: LNT Construction Internal Use


How to Wire up a Simple RC Circuit
• Step 3: Add the voltage source
• Select “Edit” Menu and “Component”. From the component window, start
typing “voltage” in the dialog box, and click “OK”

2. Type
“Voltage”

3. Click “OK”

1. Edit menu, select


“Component”

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How to Wire up a Simple RC Circuit (cont.)
• Step 4: Wire up the circuit
• Using the toolbar, select Wire, or, press F3

1. Select
“Wire” button

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How to Wire up a Simple RC Circuit (cont.)
• Step 4: Wire up the circuit (cont.)

Left-Click ground “Pull” wire through the resistor “Pull” wire down through the capacitor
“Pull” wire up through the source Left-Click here to anchor Left-Click here to anchor & finish
Left-Click here to anchor

Hint: Press the ESC key at any time to clean up the schematic

Sensitivity: LNT Construction Internal Use


How to Wire up a Simple RC Circuit (cont.)
• Step 5: Add net labels
• Using the toolbar, select Label Net (or press F4). Label the input/output nodes as shown below

1. Select “Label
Net”
2. Enter net
name

3. Place on wire

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How to Wire up a Simple RC Circuit (cont.)
• Step 6a: Component values
• Right-Click on each component symbol to change its value as shown below
Right-click on
symbol

Or Right-click on
value

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Using Labels to Specify Units for Component Attributes

• M = m = milli = 10-3 • K = k = kilo = 103


• U = u = micro = 10-6 • MEG = meg = 106
• N = n = nano = 10-9 • G = g = giga = 109
• P = p = pico = 10-12 • T = t = tera = 1012
• F = f = femto = 10-15

Hints
 Use MEG (or meg) to specify 106, not M
 Enter 1 for 1 Farad, not 1F

Sensitivity: LNT Construction Internal Use


Editing Components
• Right-Click on the component to edit attributes

► You can also edit the visible attribute and label by pointing at the text with the mouse and then right-
clicking
► Mouse cursor will turn into a text caret

Sensitivity: LNT Construction Internal Use


Component Database
• Resistors, capacitors, inductors, diodes, Bipolar transistors, MOSFET
transistors, JFET transistors, Independent voltage and current sources
• You can access a database of known devices

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How to Wire up a Simple RC Circuit (cont.)
• Step 6b: Source parameters
• Right-Click on the voltage source and enter the parameters shown below
under the “Advanced” tab.
Click
“Advanced”

Right-click source

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How to Wire up a Simple RC Circuit (cont.)
• Step 6b: Source parameters
• Select the PULSE button and enter the parameters shown below:

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Running the RC Circuit Simulation – Transient Analysis
• With the RC circuit in the active window, click on the RUN button on the
toolbar
• The Edit Simulation Command window will appear. Set the Stop Time to
60m and click OK.
Run
• Using the mouse, click on the IN node and OUT node to display thefor
Click here input
and output voltage waveforms. output
waveform

RCFilterTimeDomain.asc

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Running the RC Circuit Simulation – Transient Analysis
• To add a measurement cursor to the waveform window, left+click the mouse
on the waveform name.
► To add a second Click to display
measurement cursor measurement
(paired cursors), just cursor. Click
and drag cursor
left+click on the waveform
position.
name again.

RCFilterTimeDomain.asc

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Running the RC Circuit Simulation – Transient Analysis
• To display the current in the resistor, just left+click on the resistor.

Click here for


resistor current
waveform

RCFilterTimeDomain.asc

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Running the RC Circuit Simulation – Transient Analysis
• Split the plot pane by selecting “Add Plot Pane” under the Plot Settings pull-
down menu.
• Drag and drop the I(R1) waveform title into the new plot pane

RCFilterTimeDomain.asc
Sensitivity: LNT Construction Internal Use
Summary of the Waveform Viewer
• LTspice integrated waveform viewer:
• Plot the voltage on any wire by a simple point and click

Voltage probe cursor

• Plot the current through any component by clicking


on the body of the component
Current probe cursor

• When using the current probe, the convention of


positive current is from netlist pin #1 to pin #2.
• Add a waveform measurement cursor by
left+clicking on the waveform name. Add a
second measurement cursor by left+clicking on
the waveform name again.
Sensitivity: LNT Construction Internal Use
AC Analysis Overview

• Performs small signal AC analysis linearized about the DC operating point


• Useful for analysis of filters, networks, stability analysis, and noise considerations

Sensitivity: LNT Construction Internal Use


Simulating AC Analysis – RC Filter
• Single pole filter using RC network
• Syntax: .ac <oct, dec, lin> <Nsteps> <StartFreq> <EndFreq>
• Example: RC network and .ac dec 100 .01 1MEG

-3dB point:
1/(2*pi*R*C) = 159Hz

AC amplitude of 1 sets
magnitude to 0dB

Right-click on .tran
command and select
“AC Analysis”

Sensitivity: LNT Construction Internal Use


Simulating AC Analysis – RC Filter
• Right-click on the .tran command
• Select AC Analysis tab
• Enter the following parameters:

Sensitivity: LNT Construction Internal Use


Simulating AC Analysis – RC Result

Click here for


Bode plot

Sensitivity: LNT Construction Internal Use


Simulating AC Analysis – Active Filter
• Single pole active filter using an opamp (AD8672)

Click here for


Bode plot

Sensitivity: LNT Construction Internal Use


Defining a Component Value as a Variable (Using
Parameters)

• The .param SPICE directive allows the creation of user-defined


variables.
• To define a component value as a variable, replace the component
value with a variable name enclosed in curly braces. Example: {X}
Right+click to
change the
component
value to {X}

Add the
.param SPICE
directive (press
S on the keyboard)

Sensitivity: LNT Construction Internal Use


Defining a Component Value as a Variable (Using
Parameters)
• The simulation results are the same as when the component value was
defined as 10K.

Click here for


Bode plot

Sensitivity: LNT Construction Internal Use


Defining a Component Value as a Variable (Stepping
Parameters)

• The .STEP command can be used to vary a component variable over a


range of values to plot a family of curves.
• This is very powerful and can be used for sensitivity and Monte Carlo
Analysis.

Right+click to
change SPICE
directive to the
.step command

RCFilterACAnalysis_Step Command.asc

Sensitivity: LNT Construction Internal Use


Advantages of Labeling
• Replaces the default SPICE node names with node names and waveform
titles that are easy to understand and remember
• Allows LTspice circuit nodes to match those on your production schematic,
i.e. “TP15”
Without With

LTC3412A_DC_Load.asc
Sensitivity: LNT Construction Internal Use
Labeling - Trick
• Highlight net from waveform viewer
• Alt-Left-Click on the label in the waveform viewer (i.e. V(n006)) and it will
now highlight that particular net on the schematic. You can also use the
search function ( )

Alt-Left-
Click

Net
Highlighted

LTC3412A_DC_Load.asc

Sensitivity: LNT Construction Internal Use


MOS Device Models for Analog Design

42
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INTRODUCTION

• Currently, most of the signal processing is computed with digital circuits.


• Since the 80s billions of transistors integrated on a single chip are able to perform
billions of operations per second.
• Advantages of digital signal processing:
• Why do we need then mixed-signal
• Design simplicity. circuits?
• Automatic design tools available. • Signal processing with sensors:
• Higher noise robustness.
• Compact circuits.
• Disadvantages of digital signal processing:
• Limited resolution.
• Discrete operation.

Sensitivity: LNT Construction Internal Use


INTRODUCTION
• Why do we need then mixed-signal circuits?
• Digital control of actuators.

What is needed?

Digital signals from … and analog signals to


user… DAC control speed, acceleration,
temperature…

• Digital communications: DAC for transmitter and ADC for receiver.


• Radioreceivers:

44
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INTRODUCTION
• Why do we use MOSFET design
nodes? 1928
• Patented by Liliendeld in the 30’s. Field effect control device
• They have been intensively used since the 60’s. proposed by J. Lilienfield
• CMOS-based digital design: only dynamic power consumption
• (logic transitions) and less area. Lower manufacturing costs and higher
scalability.
• CMOS-based analog design: high speed and less noisy than BJT nodes.
Lower intrinsic gain, but higher input impedance. High scalability has
enabled operating frequencies similar to BJT-based architectures.
• In the narrowest nodes the parasitic resistances and capacitors become
more limiting.

5
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Historcal Facts About MOSFET
• The surface controlled transistor has a very bad drift
• problem. We have been fooling with this problem for a
• long time and have no hope of an early solution. In fact,
• I am not sure I have a strong hope of an eventual solution.
• Gordon Moore
• Fairchild Progress Report, February 15, 1962

• Although the MOS devices are still at the research stage


• because of fabrication problems and incomplete physical
• understanding, their impact on microelectronics is
RCA Announcement of MOS
expected to be significant.
transistor (February 11, 1963)
• George Warfield, RCA
• Electron Device Meeting, October, 1962
46
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N-MOSFET Structure

• n-type MOS (NMOS) has n-doped source (S) and drain


(D) on p-type substrate (“bulk” or “body”).
• S/D junctions “side-diffuse” during fabrication so that
effective length Leff = Ldrawn − 2LD .
• Typical values are Leff ≈ 10 nm and tox ≈ 15 Å.
• The S terminal provides charge carriers and the D
terminal collects them.
• As voltages at the three terminals changes, the source
and drain may exchange roles.
47
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Structure of Depletion Mode MOSFET & Enhancement Mode MOSFET

Sensitivity: LNT Construction Internal Use


MOSFET Structure

• PMOS is obtained by inverting all of the doping


types (including the substrate).

49
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Complementary MOSFET Structure

• In complementary MOS (CMOS) technologies both NMOS (NFET) and


PMOS (PFET) are needed and fabricated on the same wafer.
• In today’s CMOS, the PMOS is fabricated in an n-well, where the n-well
is tied to the most positive supply voltage.

50
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MOS Symbols

• Substrate is denoted by “B” (bulk).


• PMOS source is positioned on top since it has a higher potential than the gate.
• Most circuits have NMOS and PMOS bulk tied to ground and VDD, respectively, so
we tend to omit the connections (b,c).
• Digital circuits tend to incorporate “switch” symbols (c).

51
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Threshold Voltage

• As VG increases from zero, holes in p-substrate


are repelled leaving negative ions behind to form
a depletion region.
• There are no charge carriers, so no current flow.

52
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Threshold Voltage

• Increasing VG further increases the width of the


depletion region and the potential at the oxide-
silicon interface.
• Structure resembles voltage divider consisting of
gate-oxide capacitor and depletion region
capacitor in series.

53
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Threshold Voltage

• When interface potential reaches sufficiently


positive value, electrons flow from the source to
the interface and eventually to the drain.
• This creates a channel of charge carriers
(inversion layer) beneath the gate oxide.
• The value of VG at which the inversion layer
occurs is the threshold voltage (VTH).

54
Sensitivity: LNT Construction Internal Use
Threshold Voltage

• Where
- ΦMS is the difference between the work functions of the
polysilicon gate and the silicon substrate.
- k is Boltzmann’s constant.
- q is the electron charge.
- Nsub is the doping density of the substrate.
- ni is the density of electrons in undoped silicon.
- Qdep is the charge in the depletion region.
- Cox is the gate oxide capacitance per unit area.
- єsi is the dielectric constant of silicon.
55
Sensitivity: LNT Construction Internal Use
Threshold Voltage

• In practice, threshold voltage is adjusted by


implanting dopants into the channel area during
device fabrication.
• For NMOS, adding a thin sheet of p+ increases
the gate voltage necessary to deplete the region.

56
Sensitivity: LNT Construction Internal Use
Threshold Voltage

• Turn-on phenomena in PMOS is similar to that of


NMOS but with all polarities reversed.
• If the gate-source voltage becomes sufficiently
negative, an inversion layer consisting of holes is
formed at the oxide-silicon interface, providing a
conduction path between source and drain.
• PMOS threshold voltage is negative.

57
Sensitivity: LNT Construction Internal Use
The Threshold Voltage

1. The work function difference TGC between the gate


and the channel reflects the built-in potential of the MOS
system, which consists of the
p-type substrate, the thin silicon dioxide layer, and the
gate electrode. Depending on the gate material, the work
function difference is
∅𝐺𝐶 = ∅ 𝐹_𝑆𝑢𝑏𝑠𝑡𝑟𝑎𝑡𝑒 - ∅ 𝐹 𝑚𝑒𝑡𝑎𝑙 𝐹𝑜𝑟 𝑀𝑎𝑡𝑟𝑎𝑙 𝐺𝑎𝑡𝑒

∅𝐺𝐶 = ∅ 𝐹_𝑆𝑢𝑏𝑠𝑡𝑟𝑎𝑡𝑒 - ∅ 𝐹 𝑃𝑜𝑙𝑦𝑠𝑖𝑙𝑖𝑐𝑜𝑛 𝐹𝑜𝑟𝑃𝑜𝑙𝑦𝑠𝑖𝑙𝑖𝑐𝑜𝑛 𝐺𝑎𝑡𝑒


2. The externally applied gate voltage must be changed to
achieve surface inversion, i.e., to change the surface
potential by - 2 ∅ F. This will be the second component of
the threshold voltage.

5
8
Sensitivity: LNT Construction Internal Use
The Threshold Voltage

3. Another component of the applied gate voltage is necessary


to offset the depletion region charge, which is due to the fixed
acceptor ions located in the depletion region near the surface.

4. There always exists a fixed positive charge density Qox at


the interface between the gate oxide and the silicon
substrate, due to impurities and/or lattice imperfections at
the interface. The gate voltage component that is necessary
to offset this positive charge at the interface is - QOX/Cox.

Sensitivity: LNT Construction Internal Use


The Threshold Voltage

The body effect occurs in a MOSFET when the source is not tied to the substrate
(which is always connected to the most negative power supply in the integrated circuit
for n-channel devices and to the most positive for p-channel devices). The substrate
then acts as a “second gate” or a back-gate for the MOSFET

Sensitivity: LNT Construction Internal Use


MOSFET Current
Linear Region- Small VDS
𝑉𝑜𝑣 = 𝑉𝐺𝑆 - 𝑉𝑇

𝑄
𝐶𝑜𝑥 𝑊𝐿 =
𝑉𝑜𝑣
𝑄
𝐶ℎ𝑎𝑟𝑔𝑒 𝑝𝑒𝑟 𝑢𝑛𝑖𝑡 𝐿𝑒𝑛𝑔𝑡ℎ = =
𝐶𝑜𝑥𝑊𝑉 𝑜𝑣
𝐿
𝑉𝐷𝑆
𝐸𝑙𝑒𝑐𝑡𝑟𝑖𝑐 𝐹𝑖𝑒𝑙𝑑 𝑖𝑛 𝐶ℎ𝑎𝑛𝑛𝑒𝑙 =
𝐿
𝑉𝐷𝑆 µ𝑛
𝑉𝑒𝑙𝑜𝑐𝑖𝑡𝑦 𝑜𝑓 𝐶ℎ𝑎𝑟𝑔𝑒 𝑖𝑛 𝐶ℎ𝑎𝑛𝑛𝑒𝑙(𝑣) = µ 𝑛𝐸 =
𝐿
𝑄 𝑉 𝐷 𝑆 µ𝑛
𝐶𝑢𝑟𝑟𝑒𝑛𝑡 𝑖𝑛 𝐶ℎ𝑎𝑛𝑛𝑒𝑙 (𝐼𝐷 ) = 𝑣 ∗ = * 𝐶𝑜𝑥 𝑊𝑉𝑜𝑣
𝐿 𝐿

µ𝑛𝐶𝑜𝑥𝑊(𝑉𝐺𝑆 − 𝑉𝑇)𝑉𝐷𝑆
𝐼𝐷 =
𝐿

Sensitivity: LNT Construction Internal Use


MOSFET Current
Linear Region- Small VDS

𝑉𝑜𝑣

µ𝑛𝐶𝑜𝑥𝑊(𝑉𝐺𝑆 − 𝑉𝑇)𝑉𝐷𝑆
𝐼𝐷 =
𝐿
µ𝑛𝐶𝑜𝑥𝑊𝑉 𝑜𝑣
𝑇𝑟𝑎𝑛𝑠𝑐𝑜𝑛𝑑𝑢𝑐𝑡𝑎𝑛𝑐𝑒 𝑜𝑓 𝐶ℎ𝑎𝑛𝑛𝑒𝑙 𝑔 𝐷𝑆 =
𝐿
𝑘𝑛′ 𝑊𝑉𝑜𝑣 𝑉𝐷𝑆
𝑃𝑟𝑜𝑐𝑒𝑠𝑠 𝑡𝑟𝑎𝑛𝑠𝑐𝑜𝑛𝑑𝑢𝑐𝑡𝑎𝑛𝑐𝑒 𝑝𝑎𝑟𝑎𝑚𝑒𝑡𝑒𝑟 𝑘 𝑛′ = µ 𝑛𝐶 𝑜𝑥 𝐼𝐷 =
𝐿

Sensitivity: LNT Construction Internal Use


MOSFET Current
Linear Region as VDS is Increased

Charge in the tapered channel is proportional to the


channel cross-sectional area

𝑘 ′ 𝑊(𝑉 − 𝑉𝐷𝑆 )𝑉
𝐼𝐷 =
𝑛 𝑜𝑣 2 𝐷𝑆
𝐿

Sensitivity: LNT Construction Internal Use


MOSFET Current
Saturation Region

𝑉𝐷𝑆 = 𝑉𝑜𝑣 = 𝑉𝐺𝑆 - 𝑉𝑇

𝑘 ′ 𝑊(𝑉 − 𝑉𝐷𝑆 )𝑉
𝐼𝐷 =
𝑛 𝑜𝑣 2 𝐷𝑆
𝐿
𝑘𝑛′ 𝑊(𝑉𝐺𝑆 − 𝑉𝑇 )2
𝐼𝐷 =
2𝐿

Sensitivity: LNT Construction Internal Use


MOSFET Current

𝑘𝑛′ 𝑊(𝑉𝐺𝑆 − 𝑉𝑇 )2
𝐼𝐷 =
2𝐿

Sensitivity: LNT Construction Internal Use


Saturation
• For v DS  vGS – V t
VGS
0 1 2 3 4 5
20

IDS (µA)
W=1 micron
10
L=10 microns
Vt0= 1 volt
Kn=2e-5 (A/v 2)

id
G D

+ 2
• Large signal model in saturation K (v GS – V t )
_

Lecture 19-66
Sensitivity: LNT Construction Internal Use
Saturation --- Channel Length Modulation
• VDS at the edge of the inversion layer remains fixed at VGS-Vt
• But the effective length of the channel decreases with increasing VDS
• Especially a factor when channel length is short

VG > Vt
VS = 0 VDS >> 0
+
L
L
n+ n+

VB = 0

KnW 2
iD = ------------------------(v GS – V t ) 
sat 2(L – L)

Lecture 19-67
Sensitivity: LNT Construction Internal Use
Saturation --- Channel Length Modulation
• Sometimes expressed in terms of channel length modulation parameter
KnW 2
iD = ------------(v GS – V t ) (1 + v DS )
sat 2L

• SPICE can calculate the modulation for you...

0 1 2 3 4 VDS 5
100
VGS=3.0V

80
W=1 micron
IDS (µA)
L=1 microns
Vt0= 1 volt
60 Kn=2e-5 (A/v 2)
VGS=2.5V phi =0.6
NA=1e15
40

VGS=2.0V
20
VGS=1.5V
0 VGS=1.0V

Lecture 19-68
Sensitivity: LNT Construction Internal Use
Saturation --- Channel Length Modulation
• Or we can specify lambda explicitly in the model

KnW 2
iD = ------------ (v GS – V t ) (1 + v DS )
sat 2L

VDS
0 1 2 3 4 5
60
VGS=3.0V
50
W=1 micron
IDS (µA)

40 L=1 microns
Vt0= 1 volt
VGS =2.5V Kn=2e-5 (A/v 2)
30 lambda = 0.8

20
VGS=2.0V
10
VGS=1.5V
0 VGS=1.0V

Lecture 19-69
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Output Resistance
• We can add a resistor to model the channel length modulation effect for the
large-signal model in saturation

id
G D

+ 2
K (v GS – V t ) ro
_

• What is the value of ro?

–1
iDS  W 2 –1 1
ro =   = K n ------(V GS – V t )  ----------------
v DS 2L I Dsat

Lecture 19-70
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Spice element description for the NMOS and PMOS MOSFETs. Also listed is the general form of the
associated MOSFET model statement. A partial listing of the parameter values applicable to either the
NMOS or PMOS MOSFET is given in Table
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Spice large-signal model for an n-channel MOSFET under static conditions.

The general form of the Spice large-signal model for an n-


channel MOSFET under static conditions.

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Drain current versus gate-source voltage for an n-channel
MOS transistor. The colored dots show the border
between the active region (small vGS) and the triode
region (large vGS). For the largest value of vDS, i.e., vDS5,
the transistor is in the active region for the range of vGS
shown in the figure.

73
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Drain current versus drain-source voltage for an n-channel MOS
transistor. The dashed curve shows the border between the
triode region and the active region

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Schematic Simulation with Self-Defined MOSFET Model
To run simulations of MOSFETs we need to at least set the values of parameters L (channel length), W (channel width), VT0
(zero-bias threshold voltage), KP (transconductance, μn/pCox), and LAMBDA (channel-length modulation coefficient, λ).

In LT Spice, these parameters can be specified by inserting the


model into the schematic.
Go to “Edit” on the menu bar and choose “Spice Directive”, or just
click .OP the button.
In the pop-up window, type-in
“.MODEL TestN NMOS (KP=90u VT0=0.7 LAMBDA=0.01)” in the
dialogue box to set KP, VT0, and LAMBDA of the NMOS transistor

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DC Operating Point Analysis
a) To perform DC operating point analysis, go to Edit and click on Spice Analysis. Select
“dc op pnt”and type .op (or Simply click on .op (right top corner) and type .op)
b) Next go to Simulateand click on Run
c) To see the DC operating points, go to Viewand click on SPICE Error Log
(Shortcut: Ctrl + L)

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Transient Analysis

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DC Operating Point Analysis:

a) To perform DC operating point analysis, go to Editand click on Spice Analysis. Select “dc op pnt”and type
.op (or Simply click on .op(right top corner) and type .op)
b) Next go to Simulateand click on Run
c) To see the DC operating points, go to Viewand click on SPICE Error Log (Shortcut: Ctrl + L)

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Input and output characteristic of NMOS:

To obtain input characteristics connect the circuit as shown in Fig

a) Go to Editand click on Spice analysis


b) Go to DC Sweepand enter values of VGS in 1st Source
c) To get id vs VGS plot for different values of VDS, enter
values of VDS in 2nd Source.
.dc VGS 0 5V 0.001V VDS 0 2V 0.2V
a) Then Run simulation

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input characteristics

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input characteristics

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Input and output characteristic of NMOS:

To obtain output characteristics connect the circuit as shown in Fig

a) Go to Editand click on Spice analysis


b) Go to DC Sweepand enter values of VDS in 1st Source
c) To get id vs Vgs plot for different values of VGS, enter
values of VGS in 2nd Source.
.dc VDS 0 5V 1mV VGS 0 5V 1V
a) Then Run simulation

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How to get gm plot from ID vs Vgs plot?

➢ Got to Plot Settings and click on


Add trace (Shortcut: Ctrl + A)
➢ In expression field write d(Id(M1))
and click OK.
➢ d() indicates that differentiating a
parameter with respect to X-axis,
➢ since X-axis is

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Noise Analysis
Output Noise voltage of transistor can be plotted as follows
a) Go to Edit and click on Spice analysis
b) Go to Noiseand write V[Vout] in Output field. Here, at the drain
of transistor we would like to find noise voltage. Node voltage
should keep inside the V[]
c) Enter input voltage, since Vgs
d) Select type of sweep and enter frequency range (let 1Hz to 10G with 50
per decade)
e) The overall command will be as follows
.noise V[Vout] Vgs dec 50 1 10G
1.Run the Simulation and select Vout the

simply right click on Y-axis of the plot and change it to logarithmic

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Noise Analysis

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Device Characterization
Aim : To characterize the MOSFETs so that hand calculations can be done
in the future, simulations need to be done to measure KP, VT0, λ, and γ.

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Device Characterization
Aim : To characterize the MOSFETs so that hand calculations can be done
in the future, simulations need to be done to measure KP, VT0, λ, and γ.

λ Measurement
➢ To measure λ you need to do a DC sweep of VDS
and plot ID as shown in Figure .
➢ Each curve represents a different VGS value. Any
one of these curves can be used to calculate λ.
➢ Make sure that VBS is 0V for this simulation. T
➢ The formula for calculating λ given two points on
the saturation portion of a single curve is:

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Device Characterization
VT0 Measurement
➢ VT0 can also be obtained from Figure.
➢ Using the saturation portion of two curves with equal VDS, VT0 can be
calculated as

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Device Characterization
KP Measurement

➢ Knowing λ and VT0, KP can easily be found from the equation for
MOSFET drain current in the saturation region.
➢ A little algebra gives that KP is

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Device Characterization
γ Measurement
To obtain γ you must first give the transistor a non-zero VBS. Next
calculate the new VT using the same procedure that you used to obtain VT0. γ is
then given as

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PMOS CHARECTERISTICS

DC Operating Point Analysis:

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NMOS pullup

 Rather than using a big (and expensive) resistor, let’s look at a NMOS
transistor as an active pullup device

Note that when the transistor is connected this way, it is not an amplifier, it is a two terminal device. When the
gate is connected to the drain of this NMOS device, it will be in saturation, so we get the equation for
the drain current

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NMOS pullup

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IV for NMOS pull-up

 The I-V characteristic of this pull-up device:

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Active Load

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Current Mirrors

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DC Voltage Sources

Characteristics of DC Voltage Sources :


• A well controlled output voltage
Small Signal Equivalent Circuit Model:
MOSFET connected in “diode configuration”

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DC Voltage Sources

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DC Voltage Sources

PMOS voltage source

Same operation and characteristics as NMOS voltage


source. PMOS needs to be larger to attain the same Rout .

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output stage to convert voltage to current

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DC CURRENT MIRRORS

A current mirror replicates the input current of a current sink or current source as
an output current. The output current may be identical to the input current or can be
a scaled version of it.

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DC Current Sources

Characteristics of Current Sources


▪ A well controlled output current
▪ Supplied current does not depend on output voltage
⇒ High Norton Resistance

Current Mirror Circuit

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Basic Current Mirror Amplifier

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DC Current Sources

Small Signal Equivalent Circuit Model:

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DC Current Sources

PMOS Current Source

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Node 1: The voltage here is VGS1 = VT + VDS,sat1.
Node 2: For good matching between input
and output currents, we want VDS1 and
VDS2 to be equal. Thus, the voltage at
node 2 is also VT + VDS,sat1.
Node 3: The minimum compliance voltage
will be the minimum voltage to keep M3
and M4 in saturation. This will be VT +
VDS,sat1 + VDS,sat2.
Cascode current mirror

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Standard Cascode Current Mirror

• All 4 MOSFETs have the same VTH


if body effect is
• ignored.
• VX = VY =VTH + VOV
2(VT + VOV) • VGS3 = VOV + VTH as M1 and M3
carry the same “I” VG3 = VGS3 + VX =
VT + VOV
2VTH + 2VOV ignoring body effect.
• VG4 = 2VTH + 2VOV
Note VOV of M1 and M2 will equal • This should also be the case with
body effect – only 2VTH will
VY = VT + VOV
become VTH1 + VTH3.
Min Vout = VX + VOV = VTH + 2VOV
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Simulating Current Mirrors

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Cascode Current Mirror

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Wilson Current Mirror

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