isc Product Specification
INCHANGE Semiconductor
isc N-Channel MOSFET Transistor
IRF221
DESCRIPTION
Drain Current ID=5A@ TC=25
Drain Source Voltage: VDSS= 150V(Min)
Static Drain-Source On-Resistance
: RDS(on) =0.8(Max)
High Speed Applications
APPLICATIONS
Switching power supplies
ABSOLUTE MAXIMUM RATINGS(Ta=25)
SYMBOL
PARAMETER
VALUE
UNIT
VDSS
Drain-Source Voltage (VGS=0)
150
VGS
Gate-Source Voltage
20
Drain Current-continuous@ TC=25
Total Dissipation@TC=25
40
Max. Operating Junction Temperature
150
-55~150
MAX
UNIT
3.12
/W
30
/W
ID
Ptot
Tj
Tstg
Storage Temperature Range
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
Rth j-c
Thermal Resistance,Junction to Case
Rth j-a
Thermal Resistance,Junction to Ambient
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isc Product Specification
INCHANGE Semiconductor
isc N-Channel MOSFET Transistor
IRF221
ELECTRICAL CHARACTERISTICS (TC=25)
SYMBOL
PARAMETER
CONDITIONS
MIN
V(BR)DSS
Drain-Source Breakdown Voltage
VGS=0; ID=250A
150
VGS(TH)
Gate Threshold Voltage
VDS= VGS; ID=250A
2.0
RDS(ON)
Drain-Source On-stage Resistance
IGSS
TYPE
MAX
UNIT
V
4.0
VGS=10V; ID=2.5A
0.8
Gate Source Leakage Current
VGS=20V;VDS=0
100
nA
IDSS
Zero Gate Voltage Drain Current
VDS=150V; VGS=0
250
uA
VSD
Diode Forward Voltage
IS=5A; VGS=0
2.0
Ciss
Input Capacitance
600
VDS=25V;
Crss
Reverse Transfer Capacitance
VGS=0V;
80
pF
fT=1MHz
Coss
tr
td(on)
Output Capacitance
300
Rise Time
60
Turn-on Delay Time
ID=2.5A;
40
VDD=100V;
tf
td(off)
Fall Time
Turn-off Delay Time
isc websitewww.iscsemi.cn
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RL=50
ns
60
100
www.fineprint.cn
isc & iscsemi is registered trademark