isc Product Specification
INCHANGE Semiconductor
isc P-Channel MOSFET Transistor
FRM9140
DESCRIPTION
-11A, -100V, RDS(on) = 0.3
Second Generation Rad Hard MOSFET Results
From New Design Concepts
APPLICATIONS
It is specially designed and processed to
exhibit minimal characteristic changes to total dose and neutron
exposures. Design and processing efforts are also directed to
enhance survival to heavy ion (SEE) and/or dose rate
(GAMMA DOT) exposure.
ABSOLUTE MAXIMUM RATINGS(Ta=25)
SYMBOL
ARAMETER
VALUE
UNIT
VDSS
Drain-Source Voltage (VGS=0)
-100
VGS
Gate-Source Voltage
20
Drain Current-continuous@ TC=37
-11
Total Dissipation@TC=25
125
Max. Operating Junction Temperature
-55~150
Storage Temperature Range
-55~150
ID
Ptot
Tj
Tstg
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
MAX
UNIT
Rth j-c
Thermal Resistance,Junction to Case
1.0
/W
Rth j-a
Thermal Resistance,Junction to Ambient
30
/W
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isc Product Specification
INCHANGE Semiconductor
isc N-Channel Mosfet Transistor
FRM9140
ELECTRICAL CHARACTERISTICS (TC=25)
SYMBOL
PARAMETER
CONDITIONS
MIN
V(BR)DSS
Drain-Source Breakdown Voltage
VGS= 0; ID= -1mA
-100
VGS(TH)
Gate Threshold Voltage
VDS= VGS; ID= -1mA
-2.0
RDS(ON)
Drain-Source On-stage Resistance
IGSS
MAX
UNIT
V
-4
VGS= -10V; ID= -7A
0.3
Gate Source Leakage Current
VGS= 20V;VDS= 0
100
nA
IDSS
Zero Gate Voltage Drain Current
VDS= -100V; VGS= 0
-1
mA
VSD
Diode Forward Voltage
IF= -11A; VGS= 0
-1.8
isc websitewww.iscsemi.cn
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